Electronics Assembly Knowledge, Vision & Wisdom
Plasma Polymerization
Plasma Polymerization
This paper will discuss the plasma coating process and the equipment used.
Production Floor

Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name

Your Company

Your E-mail

Your Country

Your Comment

Authored By:
Andy Brooks, Siobhan Woollard, Gareth Hennighan, Elizabeth Duncan, PhD, Tim von Werne, PhD.
Semblant Limited, Melbourn, Royston, United Kingdom

The use of plasma processing in the manufacture of electronics is growing as we discover more and more applications for this technology. It is now common for plasma etching and cleaning to be used in multiple stages of the electronics manufacturing process. The introduction of new plasma polymerization methods and equipment has added new possibilities and applications for plasma.

Plasma polymerization is a unique and exciting new tool for our industry. Plasma polymerization is a simple, one step process that can be used to apply a thin, uniform film as a protective coating which requires no curing or the use of any solvents. The chemical structure and properties of the coating can easily be tailored to the requirements of the application by selection of the appropriate precursors and processing conditions. The protective coatings that can be deposited using plasma polymerization represent an opportunity for the industry to deliver new, more reliable products to the market.

This paper will discuss the plasma coating process and the equipment used. The application of this type of coating process to printed circuit boards and electronic assemblies and the results of tests to demonstrate the protection offered by these coatings will also be presented.

Plasma deposition has been shown to be a very attractive coating method for the protection of electronic products. The
deposition process itself is very simple, and can be accomplished with minimal handling or sample preparation, in some cases even eliminating the requirement for masking contacts and connectors prior to coating.

Plasma polymerization offers access to an incredible range of coating materials, as virtually any material which can exist in the gas phase can be polymerized in the plasma. We expect that use of plasma polymerization for the conformal coating of electronics will enable a new generation of improved reliability electronics as the ease of use and low cost allow more and more products to be conformally coated.

Initially Published in the IPC Proceedings

No comments have been submitted to date.
Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search

Program Search
Related Programs
bullet Insulation Resistance of Dielectric Materials
bullet Is HASL a Good Choice for Surface Finish?
bullet Board Processes and Effects on Fine Copper Barrel Cracks
bullet Long Term Thermal Reliability of Printed Circuit Board Materials
bullet Final Finish Specifications Review
bullet Embedded Components: A Comparative Analysis of Reliability
bullet Study of Various PCBA Surface Finishes
bullet New High-Performance Organophosphorus Flame Retardant
bullet Simulation of Embedded Component
bullet The Effect of Radiation Losses on High Frequency PCB Performance
More Related Programs