Defect of the Month



Bob Willis
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure trouble shooting, in-house training, process engineering support and product failure analysis.
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Bob Willis
SMT Adhesive Inspection
Industry expert Bob Willis uses the NPL Defect Database to explain SMT adhesive inspection.
Defect of the Month

Bob Willis
Head in Pillow Explained
Industry expert Bob Willis explains the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it.
Defect of the Month

Bob Willis
Causes and Tests for Pin Holes, Blow Holes and Outgassing
Bob Willis explains the causes, solutions and tests for outgassing, caused by moisture in the printed board board.
Defect of the Month

Bob Willis
Causes of Popcorn Defects in Plastic Packages
Industry expert Bob Willis explains the causes of popcorning (distortion) on plastic packages like QFPs, SOICs and BGAs.
Defect of the Month

Bob Willis
Causes of PCB Delamination
Industry expert Bob Willis explains the causes of PCB lamination defects.
Defect of the Month

Bob Willis
How To Eliminate PCB Bow and Twist
Industry expert Bob Willis uses the NPL Defect Database to explore techniques to reduce the possibility of circuit board bow and twist.
Defect of the Month

Bob Willis
Evaluating Surface Cleanliness
The water break test is easy and practical to conduct and helps you evaluate residues left from adhesives or conformal coating dots.
Defect of the Month

Bob Willis
Explanation of PoP Inspection Techniques
Industry expert Bob Willis explains the three available options of x-ray, optical and process monitoring for inspection of package-on-package assemblies.
Defect of the Month

Bob Willis
What Causes Solder Mask Outgassing?
Industry expert Bob Willis explains solder mask outgassing defects with the help of the NPL Defect Database.
Defect of the Month

Bob Willis
What Causes Solder Skips?
Bob Willis looks at the most common reasons for solder skips on surface mount during wave soldering and illustrates how pad length, solder mask thickness and gassing from solder mask and flux will contribute to the problem.
Defect of the Month

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