Electronics Assembly Knowledge, Vision & Wisdom
Explanation of PoP Inspection Techniques
Explanation of PoP Inspection Techniques
Industry expert Bob Willis explains the three available options of x-ray, optical and process monitoring for inspection of package-on-package assemblies.
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Authored By:
Bob Willis - http://www.bobwillis.co.uk
Bob Willis operates a training and consultancy business based in England.
,{url:'http://www.circuitinsight.com/videos/pop_inspection_techniques.mp4'},{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
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