Electronics Assembly Knowledge, Vision & Wisdom
Causes of Popcorn Defects in Plastic Packages
Causes of Popcorn Defects in Plastic Packages
Industry expert Bob Willis uses the NPL Defect Database to explain the causes of popcorning (distortion) on plastic packages like QFPs, SOICs and BGAs.
Analysis Lab

Authored By:
Bob Willis - http://www.bobwillis.co.uk
Bob Willis operates a training and consultancy business based in England.
,{url:'http://www.circuitinsight.com/videos/popcorn_defects_plastic_packages.mp4'},{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet We Bake, But Still Have Delamination, Why?
bullet Contamination Using Solvent Dispensers
bullet Influence of Salt Residues on BGA Head in Pillow
bullet Circuit Board Bow and Twist
bullet Collaboration to Combat Head on Pillowing Defects
bullet Corrosion Resistant Servers for Free-Air Cooling Data Centers
bullet What Causes Black Pad?
bullet Characterization, Prevention and Removal of Particulate Matter on PCBs
bullet What is Causing Solder Joint Cracking?
bullet OEM and EMS to Combat Head on Pillowing Defects
More Related Programs