Electronics Assembly Knowledge, Vision & Wisdom
Head in Pillow Explained
Head in Pillow Explained
Industry expert Bob Willis uses the NPL Defect Database to explain the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it.
Analysis Lab
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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Very interesting explanation. If oxygen level during reflow process is controlled at very low levels, solder oxidation may go to near zero as well. So Head in pillow defects rate would decrease (considering that other process parameters are ok). Using correctly nitrogen in reflow atmosphere helps to eliminate this type of defect if caused by solder oxidation.
Luiz Felipe Rodrigues, Air Liquide, Brasil
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