Electronics Assembly Knowledge, Vision & Wisdom
Head in Pillow Explained
Head in Pillow Explained
Industry expert Bob Willis uses the NPL Defect Database to explain the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it.
Analysis Lab

,{url:'http://www.circuitinsight.com/videos/hiphop_explained-2.mp4'},{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Reader Comment

Very interesting explanation. If oxygen level during reflow process is controlled at very low levels, solder oxidation may go to near zero as well. So Head in pillow defects rate would decrease (considering that other process parameters are ok). Using correctly nitrogen in reflow atmosphere helps to eliminate this type of defect if caused by solder oxidation.

Luiz Felipe Rodrigues, Air Liquide, Brasil
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Novel Approaches for Minimizing Pad Cratering
bullet Acceptable Rate for Head in Pillow?
bullet LED Component Shift During Reflow
bullet Testing PCBs for Creep Corrosion
bullet Contaminated Joints Cause an Assembly to Fail RoHS Compliance
bullet Mitigating Tin Whiskers in Alternative Lead-Free Alloys
bullet Components Falling Off During Wave Soldering
bullet Dust contamination after selective soldering
bullet Human-Induced Contamination on PCB Assembly
bullet Problems With Large Voids
More Related Programs