Electronics Assembly Knowledge, Vision & Wisdom
Assembly, Printing, Pick & Place << Page 1 of 21 >>
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Programs are sorted by published date, most recent first.
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Ask the Experts
0201 Pick & Place Nozzle Plugging
Our stencil vendor is recommending the same aperture size going to a .004" think stencil. I am concerned about reducing the volume by 20%.
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Why Should We Consider Smart Feeders?
Why Should We Consider Smart Feeders?
In selecting a new pick and place line, why should we consider smart feeders? How can we justify the added cost?
Board Talk
Electronic Packages and Modules Based on Embedded Die Technologies
Electronic Packages and Modules Based on Embedded Die Technologies
This paper describes the use of embedded die technologies and the development of work in the on power electronic applications.
Production Floor
Evaluating Manual and Automated Heat Sink Assembly
Evaluating Manual and Automated Heat Sink Assembly
This paper illustrates the use of strain gauge testing and Finite Element Analysis as a simulation tool to optimize the heat sink assembly process.
Production Floor
Ask the Experts
Environment Impact on Assembly, Printing and Reflow
Is particle count a good parameter to control? How can having high particle concentrations affect our PCB assembly process or reflow process?
Ask the Experts
Ask the Experts
Stencil Pattern for Thermal Pads on QFNs
We know why it is important to "mesh" but need more info regarding what is best aperture size, number of apertures, etc. Can you point us to information?
Ask the Experts
Trends for Printing Ultra Miniature Chips
Trends for Printing Ultra Miniature Chips
What are the current trends and practices for printing ultra-miniature chips, a la 01005? The Assembly Brothers, Phil and Jim, take a look and share their opinions.
Board Talk
Electroplated Copper Filling of Through Hole Influence of Hole Geometry
Electroplated Copper Filling of Through Hole Influence of Hole Geometry
The through hole fill technology and factors that affect performance such as substrate thickness and through hole diameter will be presented.
Production Floor
Stencil Design for Ultra Fine Pitch Printing
Stencil Design for Ultra Fine Pitch Printing
Miniaturization is pushing the stencil printing process. As features become smaller, solder paste transfer efficiency is becoming more critical.
Production Floor
FEA and Analysis for BGA-CGA Assemblies Under Thermal Cycling
In high-reliability applications ball grid array versions are used because of technology availability, lower cost, and lower CTE mismatches.
Materials Tech
Assembly, Printing, Pick & Place << Page 1 of 21 >>