Electronics Assembly Knowledge, Vision & Wisdom
Assembly, Printing, Pick & Place << Page 1 of 18 >>
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

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Low Cost and High Pin Count Wafer Level Packaging
Low Cost and High Pin Count Wafer Level Packaging
Reliability improvement at low cost is achieved using plastic core balls at selected ball locations. A daisy chain WLP is the test vehicle.
Production Floor
Larger Stencil Apertures and Type 4 Paste
Larger Stencil Apertures and Type 4 Paste
What is your experience with larger size apertures and type four solder paste for non-collapsible BGA and CGA type solder joints?
Board Talk
Revolutionary Printing Solution for SMT Assembly
Revolutionary Printing Solution for SMT Assembly
This paper presents new techniques in the screen print process with the aim of increasing solder paste transfer efficiency.
Production Floor
Low Surface Energy Coatings Rewrite Area Ratio Rules
Low Surface Energy Coatings Rewrite Area Ratio Rules
Paper on the properties of solder paste release and the effects of surface free energy that make up the stencil printing process.
Materials Tech
Past, Present, Future of Solderless Assembly
Past, Present, Future of Solderless Assembly
Paper examines some of the solderless assembly methods over the years and some new solutions we might see in the future.
Production Floor
Stencil Printing of Small Apertures
Stencil Printing of Small Apertures
Stencil technologies, aperture wall coatings, and paste transfer for area ratios less than the recommended lower limit are examined.
Production Floor
Jetting Strategies for mBGAs
Jetting Strategies for mBGAs
This study attempts to understand the dependencies on piezo actuation pulse profile on jetting deposit quality, especially focused on positioning, satellites and shape.
Production Floor
Ask the Experts
Pick and Place Placement Rate
What is the best way to calculate, and verify the placement rate for a pick and place system prior to purchase?
Ask the Experts
Stencil Considerations - Miniature Components
Stencil Considerations - Miniature Components
This paper outlines different approaches to printing miniature devices along with conventional SMT devices.
Production Floor
Ask the Experts
Selective Printing for BGA Components
We use common BGA packages on many of our low-end products. To save cost, could we print paste only on the pads that have functional requirements?
Ask the Experts
Assembly, Printing, Pick & Place << Page 1 of 18 >>
 
 
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