Electronics Assembly Knowledge, Vision & Wisdom
Assembly, Printing, Pick & Place << Page 1 of 21 >>
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Programs are sorted by published date, most recent first.
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Solder Paste Life on the Stencil
Our solder paste has a specified life on the stencil of 10 hours. After 10 hours of manufacturing, do we need to remove all the paste and scrap it?
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Generalizations About Component Flatness at Elevated Temperature
The flatness of boards and components is an important topic. This study deals only with components.
Analysis Lab
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Selective Printing for BGA Components
We use common BGA packages on many of our low-end products. To save cost, could we print paste only on the pads that have functional requirements?
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What is the Best Way to Clean Solder Stencils?
What is the Best Way to Clean Solder Stencils?
Every 4 hours we remove each solder paste stencil and wipe both sides using IPA lint free wipes and then blow drying. Is this the proper procedure? The Assembly Brothers, Jim Hall and Phil Zarrow, share their experiences.
Board Talk
Stencil Printing Yield Improvements
Stencil Printing Yield Improvements
The wipe sequence, wipe frequency and wipe solvent and how these interact to provide solder paste printing yield improvement is studied.
Production Floor
The Development of Hybrid Therma-EMI Solutions for Electronics
The Development of Hybrid Therma-EMI Solutions for Electronics
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed.
Production Floor
Tenting Via In Pad - Yes or No?
Tenting Via In Pad - Yes or No?
Should the thermal vias on the bottom terminated components be tented on both sides to prevent flux trapping or is it okay to tent the top side only? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk
Jetting Conductive Adhesives with Silver Coated Polymer Particles
Jetting Conductive Adhesives with Silver Coated Polymer Particles
Tests performed in this study demonstrate that a conductive adhesive using spherical, polymer silver particles can be used for no-contact jet printing.
Production Floor
Solder Paste  Beyond The Shelf Life?
Solder Paste Beyond The Shelf Life?
We have some solder paste that has been in a sealed box at 4 degree Celsius for 8 months. The shelf life is 6 months. Can it be used?
Board Talk
Issues With Solder Paste Transfer Efficiency
Issues With Solder Paste Transfer Efficiency
With transfer efficiency and its relationship to solder paste volume, can you produce a transfer efficiency over 100% of the theoretical volume? Jim Hall and Phil Zarrow, the Assembly Brothers, discuss this question.
Board Talk
Assembly, Printing, Pick & Place << Page 1 of 21 >>