Electronics Assembly Knowledge, Vision & Wisdom
Assembly, Printing, Pick & Place << Page 1 of 21 >>
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Programs are sorted by published date, most recent first.
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Should Apertures be Home Plate or Inverted Home Plate?
Should Apertures be Home Plate or Inverted Home Plate?
Should stencil the aperture be home plate or inverted home plate? You know the performance difference between the two types. Which one is better? The Assembly Brothers, Phil Zarrow and Jim Hall, answer these questions.
Board Talk
Taking the LED Pick and Place Challenge
Taking the LED Pick and Place Challenge
There has been a shift in the lighting industry that has carried over to surface mount technology. What is this shift? Is it the LED revolution?
Production Floor
Step Stencil Setup
Step Stencil Setup
When shifting from standard solder paste stencils to step stencils, should we change the pressure or attack angle?
Board Talk
What Rate is World Class for SMT Machines?
What Rate is World Class for SMT Machines?
What rate is considered world class when it comes to pick performance for SMT placement machines? Can you define pick performance? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions and share their own experiences.
Board Talk
Double Print Stencils Systems
Double Print Stencils Systems
It is useful in Assemblies that require mixed technologies; including SMT / Through Hole, SMT / Glue attach components, Packages requiring die attach / SMT assembly.
Production Floor
Ask the Experts
Solder Paste Life on the Stencil
Our solder paste has a specified life on the stencil of 10 hours. After 10 hours of manufacturing, do we need to remove all the paste and scrap it?
Ask the Experts
Assembly of POP with Novel Epoxy Flux on Solder Paste
Assembly of POP with Novel Epoxy Flux on Solder Paste
In this paper, a newly developed epoxy flux, that is compatible with solder paste, was evaluated for assembly and reliability.
Production Floor
Ask the Experts
Selective Printing for BGA Components
We use common BGA packages on many of our low-end products. To save cost, could we print paste only on the pads that have functional requirements?
Ask the Experts
Printing and Assembly Challenges for QFN Devices
Printing and Assembly Challenges for QFN Devices
QFN (quad flatpack, no leads) and DFN (dual flatpack, no lead) are becoming more popular in new component releases.
Production Floor
Enclosed Media Printing as an Alternative to Metal Blades
Enclosed Media Printing as an Alternative to Metal Blades
This paper explores the latest developments in enclosed media print head technology and how it can impact the bottom line.
Production Floor
Assembly, Printing, Pick & Place << Page 1 of 21 >>