Electronics Assembly Knowledge, Vision & Wisdom
Assembly, Printing, Pick & Place
Previous   Page 1 of 20   Next


These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more. Programs are sorted by published date, most recent first.


Wearable Electronics & Big Data = High Volume, High Mix SMT
Wearable Electronics & Big Data = High Volume, High Mix SMT
This paper explores the conflicting requirements of achieving low cost while meeting high volume, high mix requirements.
Production Floor

Comparison of Active and Passive Temperature Cycling
Comparison of Active and Passive Temperature Cycling
This paper describes the various accelerated temperature cycling tests, compares and evaluates the related degradation of solder joints.
Analysis Lab

Going Beyond Your Solder Paste Work Life
Going Beyond Your Solder Paste Work Life
Solder paste used for a problem batch of board exceeded the 12 hour work life by one hour. Could this cause soldering problems for small chip components?
Board Talk

Hand Printing using Nanocoated and other High End Stencil Materials
Hand Printing using Nanocoated and other High End Stencil Materials
This study details the effectiveness of nanocoating materials, high end stainless steel stencil materials, as they relate to the manual SMT printing.
Production Floor

Cause of Damage During Through-hole Component Insertion
Cause of Damage During Through-hole Component Insertion
During automatic insertion and clinching of two pin components we encounter small cracks in the lands or the walls of plated holes. How can we eliminate this?
Board Talk

What is the Best Way to Clean Solder Stencils?
What is the Best Way to Clean Solder Stencils?
Every 4 hours we remove each solder paste stencil and wipe both sides using IPA lint free wipes and then blow drying. Is this the proper procedure? The Assembly Brothers, Jim Hall and Phil Zarrow, share their experiences.
Board Talk

High-Volume-Manufacturing of BVA Enabled Advanced POP
High-Volume-Manufacturing of BVA Enabled Advanced POP
We will present validation data for BVA high volume manufacturing including optimization of assembly process, yield, test and reliability.
Production Floor

Contamination and Risks Related to ESD Gloves and Finger Cots
Contamination and Risks Related to ESD Gloves and Finger Cots
Choosing a protective glove for the production floor is a critical decision and all variable need to be considered.
Production Floor

Investigation Into the Durability of Stencil Coating Technologies
Investigation Into the Durability of Stencil Coating Technologies
Paper addresses durability of coatings in relation to the number of print cycles and underside wipe cycles and materials used on the underside wipe process.
Production Floor

Tenting Via In Pad - Yes or No?
Tenting Via In Pad - Yes or No?
Should the thermal vias on the bottom terminated components be tented on both sides to prevent flux trapping or is it okay to tent the top side only? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question.
Board Talk

Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search