Electronics Assembly Knowledge, Vision & Wisdom
Assembly, Printing, Pick & Place << Page 1 of 21 >>
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Programs are sorted by published date, most recent first.
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Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
This study shows optimized print process can be achieved using standard materials, while also considering board level reliability.
Production Floor
Gold Stud Bump Flip Chip Bonding on Interconnect Devices
Gold Stud Bump Flip Chip Bonding on Interconnect Devices
This paper presents the studies on flip chip thermo-compression bonding (TCB) of gold stud bumps on MID substrate.
Production Floor
Beyond 0402M Placement: Considerations for Microchip Mounting
Beyond 0402M Placement: Considerations for Microchip Mounting
This presentation explores board and component trends, and delves into three areas for successful 03015M adoption: equipment, materials, and controls.
Production Floor
Solder Paste Stencil Design for Optimal QFN Reliability
Solder Paste Stencil Design for Optimal QFN Reliability
In this study, the volume of solder used in assembly of QFNs was varied to investigate the relationship between standoff height and thermal cycle life.
Production Floor
Solder Paste Printing First Pass
Solder Paste Printing First Pass
Is it recommended to print one cycle before printing the first production board? I could use a scrap board or blank plastic card for the first print. Phil Zarrow and Jim Hall, the Assembly Brothers, share their own experiences and insight.
Board Talk
Choosing the Right Stencil Options
Choosing the Right Stencil Options
Quality and yield are directly linked to the solder printing process. A constant paste depot is critical to a stable soldering process.
Production Floor
Investigation into Printing Miniaturized Devices
Investigation into Printing Miniaturized Devices
Paper investigates a solution to ensure a high yield process where fine pitch devices can be printed alongside traditional larger footprint devices.
Production Floor
Challenges of Manufacturing with Printed Circuit Board Cavities
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity design and assembly issues identified during the design of experiments, the findings, reliability results, and conclusions are discussed in this paper.
Production Floor
Ask the Experts
0201 Pick & Place Nozzle Plugging
Our stencil vendor is recommending the same aperture size going to a .004" think stencil. I am concerned about reducing the volume by 20%.
Ask the Experts
Top 5 BGA Rework Challenges to Overcome
Top 5 BGA Rework Challenges to Overcome
As BGA component package dimensions continue to get thinner more are being used in handheld device applications. The challenges of BGA rework is discussed.
Analysis Lab
Assembly, Printing, Pick & Place << Page 1 of 21 >>