Electronics Assembly Knowledge, Vision & Wisdom
Assembly, Printing, Pick & Place
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These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more. Programs are sorted by published date, most recent first.


Jetting Conductive Adhesives with Silver Coated Polymer Particles
Jetting Conductive Adhesives with Silver Coated Polymer Particles
Tests performed in this study demonstrate that a conductive adhesive using spherical, polymer silver particles can be used for no-contact jet printing.
Production Floor

Effect of Thermal Cycling on Subsequent Drop Behavior of Assemblies
Effect of Thermal Cycling on Subsequent Drop Behavior of Assemblies
This paper presents the effect of a priori thermal cycle on subsequent drop to failure behavior of CGAs with 1272 columns.
Analysis Lab

Stencil Printing Yield Improvements
Stencil Printing Yield Improvements
The wipe sequence, wipe frequency and wipe solvent and how these interact to provide solder paste printing yield improvement is studied.
Production Floor

Stencil Printing Yield Improvements
Stencil Printing Yield Improvements
In this paper two methods were studied to improve solder paste release. A nano-scale hydrophobic, oleophobic and adhesion promoting coating.
Production Floor

A New Line Balancing Method
A New Line Balancing Method
In this paper the authors present a new method of handling an assignment problem for hybrid manual and robotic assembly mixing lines.
Production Floor

How Many Fiducials Per Stencil
How Many Fiducials Per Stencil
We have seen as many as 180 fiducials per stencil with a step and repeat. How many fiducials are recommended for a solder paste stencil? Phil Zarrow and Jim Hall, The Assembly Brothers, answer this question and share their own experiences.
Board Talk

Enhance the Shock Performance of Ultra-Large BGA Components
Enhance the Shock Performance of Ultra-Large BGA Components
A study on the rubber standoffs and gaskets. The effectiveness of rubber standoffs and rubber gaskets as shock/vibration mitigation have been evaluated.
Analysis Lab

FEA and Analysis for BGA-CGA Assemblies Under Thermal Cycling
In high-reliability applications ball grid array versions are used because of technology availability, lower cost, and lower CTE mismatches.
Materials Tech

Assembly Reliability of TSOP/DFN PoP Stack Package
Assembly Reliability of TSOP/DFN PoP Stack Package
This paper presents thermal cycle reliability evaluations of 2-high and 4-high 3D stacks built with a mix of TSOP and DFN daisy-chain package assembly.
Analysis Lab

Cohesive Zone Modeling of Failure Underfilled BGA-PCB Assemblies
Cohesive Zone Modeling of Failure Underfilled BGA-PCB Assemblies
A model was developed to simulate the delamination behavior of multilayer PCBs assembled with BGA components reinforced with an underfill epoxy adhesive.
Production Floor

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