Electronics Assembly Knowledge, Vision & Wisdom
Assembly, Printing, Pick & Place
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These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more. Programs are sorted by published date, most recent first.


Is There a Spacing Spec for SMD Components?
Is There a Spacing Spec for SMD Components?
Is there a minimum spacing requirement or should we apply SMT components to comply with SMT pick and place systems on the market? The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question.
Board Talk

Investigation of Copper Sinter Material for Die Attach
Investigation of Copper Sinter Material for Die Attach
3 different copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents.
Materials Tech

Additive Manufacturing for Next Generation Microwave Electronics
Additive Manufacturing for Next Generation Microwave Electronics
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications.
Production Floor

Jetting Strategies for mBGAs
Jetting Strategies for mBGAs
This study attempts to understand the dependencies on piezo actuation pulse profile on jetting deposit quality, especially focused on positioning, satellites and shape.
Production Floor

Processing Circuit Boards with BGAs On Both Sides
Processing Circuit Boards with BGAs On Both Sides
What is the best way to process a 30 mil circuit board assembly that has micro BGAs that need to be soldered to both sides? The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question.
Board Talk

Filling of Microvias and Through Holes by Electrolytic Copper Plating
Filling of Microvias and Through Holes by Electrolytic Copper Plating
This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Production Floor

Digitally Printed Battery Design
Digitally Printed Battery Design
Battery operated devices have grown smaller while energy demands have increased. This paper provides a review of battery construction.
Materials Tech

Advanced Printing for Microelectronic Packaging
Advanced Printing for Microelectronic Packaging
Using micro-dispensing it is possible to print in 3D space a wide variety of materials including solders, epoxies, conductive adhesives and ceramic filled polymers.
Production Floor

Reliability of Stacked Microvia
Reliability of Stacked Microvia
Study was designed to understand the reliability of Type 1, 2, and 3 Microvias. The reliability test coupons included four stacks of microvias and a buried via.
Production Floor

Solder Paste Printing First Pass
Solder Paste Printing First Pass
Is it recommended to print one cycle before printing the first production board? I could use a scrap board or blank plastic card for the first print. Phil Zarrow and Jim Hall, the Assembly Brothers, share their own experiences and insight.
Board Talk

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