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| Assembly, Printing, Pick & Place | ||||||||||
| These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more. | ||||||||||
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The paper focuses on all aspects of SMT assembly of the MaxQFP. The robustness of the assembly in automotive type board-level thermal cycling will be demonstrated. Production Floor
Materials Informatics is one of the hottest technologies because of its potential to reduce the time and costs of discovering innovative materials. Materials Tech
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed. Production Floor
With high frequency and high-speed transmission in information industry, PCB customers demand stricter signal transmission integrity of PCB. Analysis Lab
Paper on the properties of solder paste release and the effects of surface free energy that make up the stencil printing process. Materials Tech
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily. Board Talk
Tests performed in this study demonstrate that a conductive adhesive using spherical, polymer silver particles can be used for no-contact jet printing. Production Floor
This study examines possible factors for these inconsistencies such as etched signal trace shape, surface treatment, and grain size. Analysis Lab
In this paper the authors present a new method of handling an assignment problem for hybrid manual and robotic assembly mixing lines. Production Floor
The flatness of boards and components is an important topic. This study deals only with components. Analysis Lab |
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