Electronics Assembly Knowledge, Vision & Wisdom
Assembly, Printing, Pick & Place << Page 1 of 18 >>
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

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Challenges for Selecting Appropriate TIM2 Material for CPU
Challenges for Selecting Appropriate TIM2 Material for CPU
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things.
Materials Tech
Filling of Microvias and Through Holes by Electrolytic Copper Plating
Filling of Microvias and Through Holes by Electrolytic Copper Plating
This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Production Floor
High-Speed 3D Surface Imaging Technology in Electronics Manufacturing
High-Speed 3D Surface Imaging Technology in Electronics Manufacturing
This paper introduces line confocal technology that was developed to characterize 3D features of surface and material types at sub-micron resolution.
Analysis Lab
Additive Manufacturing Printed Circuit Board Assembly Processes
Additive Manufacturing Printed Circuit Board Assembly Processes
Utilizing 3D printing, the design process can be shortened and the manufacturing of the jigs and fixtures can replace the cost and lead time of traditional manufacturing.
Analysis Lab
Selective Solder Paste Printing for BGA Components
Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function?
Board Talk
Reliability of Stacked Microvia
Reliability of Stacked Microvia
Study was designed to understand the reliability of Type 1, 2, and 3 Microvias. The reliability test coupons included four stacks of microvias and a buried via.
Production Floor
Issues With SMT Component Alignment
Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily.
Board Talk
Advanced Printing for Microelectronic Packaging
Advanced Printing for Microelectronic Packaging
Using micro-dispensing it is possible to print in 3D space a wide variety of materials including solders, epoxies, conductive adhesives and ceramic filled polymers.
Production Floor
Larger Stencil Apertures and Type 4 Paste
Larger Stencil Apertures and Type 4 Paste
What is your experience with larger size apertures and type four solder paste for non-collapsible BGA and CGA type solder joints?
Board Talk
Printing of Solder Paste - A Quality Assurance Methodology
Printing of Solder Paste - A Quality Assurance Methodology
This paper describes a method to ensure quality secured data from both solder paste printers and inspection machines in electronic assembly manufacturing.
Production Floor
Assembly, Printing, Pick & Place << Page 1 of 18 >>