Electronics Assembly Knowledge, Vision & Wisdom
Assembly, Printing, Pick & Place << Page 1 of 18 >>
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

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Returning to Basics in the SMT Screen Printing Process
Returning to Basics in the SMT Screen Printing Process
This paper showcases a new stencil process that was discovered by reverting to the basics.
Production Floor
Minimizing Voiding in QFN Packages
Minimizing Voiding in QFN Packages
This paper quantifies the preform requirements and process adjustments needed to minimize voiding in QFN packages.
Production Floor
Press Fit  Roadmap for High Performance Process
Press Fit Roadmap for High Performance Process
Paper investigates the roadmap for press fit technology, with attention to placement and insertion, inspection, repair, pin design, challenges and solutions.
Production Floor
The Challenges of LGA Server Socket Trends
The Challenges of LGA Server Socket Trends
This paper discusses the challenges and some potential solutions for sockets used in the high end server market.
Production Floor
3D Assembly Processes a Look at Today and Tomorrow
3D Assembly Processes a Look at Today and Tomorrow
This paper explores various technologies available today and some that are starting to appear and illustrates some key items for each technology.
Production Floor
Low-Silver BGA Assembly
Low-Silver BGA Assembly
This study characterizes the influence of alloy type and reflow parameters on low-silver SAC spheres for BGA assembly.
Production Floor
Selecting Stencil Technologies to Optimize Print Performance
Selecting Stencil Technologies to Optimize Print Performance
Research has been done to identify individual factors in stencil performance; this paper discusses the real-world application of numerous findings.
Production Floor
What is the Best Way to Clean Solder Stencils?
What is the Best Way to Clean Solder Stencils?
Every 4 hours we remove each solder paste stencil and wipe both sides using IPA lint free wipes and then blow drying. Is this the proper procedure?
Board Talk
Optimization to Prevent the Graping Effect
Optimization to Prevent the Graping Effect
This paper will discuss the specific challenge of the Graping Effect and the work that has been performed to mitigate this phenomenon.
Production Floor
Ask the Experts
Issues with BGA Components Near PCB Edges
What issues are we likely to see when we place BGA components very close to PCB edges?
Ask the Experts
Assembly, Printing, Pick & Place << Page 1 of 18 >>
 
 
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