Electronics Assembly Knowledge, Vision & Wisdom
Assembly, Printing, Pick & Place << Page 1 of 18 >>
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

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Ask the Experts
Most Important Factors for Screen Printing
Which of these factors is more critical to the solder printing process, solder paste volume or solder print alignment?
Ask the Experts
Reliability of Stacked Microvia
Reliability of Stacked Microvia
Study was designed to understand the reliability of Type 1, 2, and 3 Microvias. The reliability test coupons included four stacks of microvias and a buried via.
Production Floor
Stencil Manufacturing and Impact on Precision
Stencil Manufacturing and Impact on Precision
Stencil positional accuracy is a function of the manufacturing process. The various parameters that influence positional accuracy are covered.
Production Floor
Digitally Printed Battery Design
Digitally Printed Battery Design
Battery operated devices have grown smaller while energy demands have increased. This paper provides a review of battery construction.
Materials Tech
Printing of Solder Paste - A Quality Assurance Methodology
Printing of Solder Paste - A Quality Assurance Methodology
This paper describes a method to ensure quality secured data from both solder paste printers and inspection machines in electronic assembly manufacturing.
Production Floor
Are There Standards Governing Polarity Marks?
Are There Standards Governing Polarity Marks?
Is there a standard that governs how polarity marks are used to denote orientation of components on circuit boards?
Board Talk
Round or Square Stencil Apertures?
Round or Square Stencil Apertures?
What is your opinion about using round versus square apertures for BGA patterns in solder paste stencils? Which wins, square or round? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions.
Board Talk
Stencil Design Improves Drop Test Performance
Stencil Design Improves Drop Test Performance
Paper evaluates the influence of stencil printed solder volume on electronic component lifetime in mechanical stress testing.
Materials Tech
Ask the Experts
Mixed Technology - Which First
We are assembling a mixed technology board. We assemble the through hole section first, then reflow the SMT parts. Is it always done in this order?
Ask the Experts
Sources of ESD in a Production Line
Sources of ESD in a Production Line
It is necessary for everyone who handles ESD sensitive devices to know the reasons for failures. This paper discusses causes for ESD in a SMT production line.
Production Floor
Assembly, Printing, Pick & Place << Page 1 of 18 >>
 
 
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