Electronics Assembly Knowledge, Vision & Wisdom
Assembly, Printing, Pick & Place
Previous   Page 1 of 20   Next


These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more. Programs are sorted by published date, most recent first.


Impact of Alloy Composition on Shear Strength for Low Temperature Lead Free Alloys
Impact of Alloy Composition on Shear Strength for Low Temperature Lead Free Alloys
As assemblies, undergo temperature/power changes during use CTE mismatch causes added stress and strain on the solder joint.
Production Floor

Stencil Printing for Challenging Heterogeneous Assembly Applications
Stencil Printing for Challenging Heterogeneous Assembly Applications
A series of Metric 0201 experiments investigating printing process sensitivity to circuit board properties, including pad dimensional accuracy and landscape topography.
Analysis Lab

Qualitative Model Describing Hot Tear Above VIPPO and Other Design Elements
Qualitative Model Describing Hot Tear Above VIPPO and Other Design Elements
The mechanism for the formation of Hot Tears is discussed and applied to other design elements that can be found on Printed Circuit Board Assemblies.
Production Floor

FEA and Analysis for BGA-CGA Assemblies Under Thermal Cycling
In high-reliability applications ball grid array versions are used because of technology availability, lower cost, and lower CTE mismatches.
Materials Tech

How Many Fiducials Per Stencil
How Many Fiducials Per Stencil
We have seen as many as 180 fiducials per stencil with a step and repeat. How many fiducials are recommended for a solder paste stencil? Phil Zarrow and Jim Hall, The Assembly Brothers, answer this question and share their own experiences.
Board Talk

The Development of Hybrid Therma-EMI Solutions for Electronics
The Development of Hybrid Therma-EMI Solutions for Electronics
Test methods to measure the thermal and electromagnetic properties of a material in an application and as fundamental material properties are discussed.
Production Floor

Cavity Board SMT Assembly Challenges
Cavity Board SMT Assembly Challenges
This study is to identifies the challenges related to assembly of a package into a cavity on the board, and establish the best known method for SMT assembly success.
Analysis Lab

Comparison of Reliability of Copper, Gold, Silver and PCC Wirebonds Under Sustained Operation
Comparison of Reliability of Copper, Gold, Silver and PCC Wirebonds Under Sustained Operation
In this paper, a detailed study of the electrical and mechanical degradation of wirebonds under high temperature exposure is presented.
Materials Tech

Stencil Printing Yield Improvements
Stencil Printing Yield Improvements
The wipe sequence, wipe frequency and wipe solvent and how these interact to provide solder paste printing yield improvement is studied.
Production Floor

Jetting Conductive Adhesives with Silver Coated Polymer Particles
Jetting Conductive Adhesives with Silver Coated Polymer Particles
Tests performed in this study demonstrate that a conductive adhesive using spherical, polymer silver particles can be used for no-contact jet printing.
Production Floor

Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search