Assembly, Printing, Pick & Place



These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.
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Solder Paste  Beyond The Shelf Life?
Solder Paste Beyond The Shelf Life?
We have some solder paste that has been in a sealed box at 4 degree Celsius for 8 months. The shelf life is 6 months. Can it be used? Phil Zarrow and Jim Hall, The Assembly Brothers, offer their insight and share their own experiences to answer this reader's question.
Board Talk

Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
This study examines possible factors for these inconsistencies such as etched signal trace shape, surface treatment, and grain size.
Analysis Lab

Reducing Dust Deposition on Electronic Equipment
Reducing Dust Deposition on Electronic Equipment
This work focuses on one aspect of reducing dust accumulation on electronic equipment, specifically by optimizing the cooling air flow.
Production Floor

The Development of a 0.3 mm Pitch CSP Assembly Process
The Development of a 0.3 mm Pitch CSP Assembly Process
A major study looks at different aspects of the stencil printing process and their impact upon the assembly and reliability of CSP components.
Production Floor

Generalizations About Component Flatness at Elevated Temperature
Generalizations About Component Flatness at Elevated Temperature
The flatness of boards and components is an important topic. This study deals only with components.
Analysis Lab

Printed Electronics for Medical Devices
Printed Electronics for Medical Devices
This paper will share details about multiple medical sensing applications and the advanced materials and processes used to assemble them for optimal functionality.
Production Floor

Suggested Stencil Wipe Frequency?
Suggested Stencil Wipe Frequency?
How do we determine what is the best under stencil wipe frequency? As always, the Assembly Brothers Phil Zarrow and Jim Hall, Pick and Place, give a review.
Board Talk

Lessons Learned While Investigating Microvia Reliability Failures
Lessons Learned While Investigating Microvia Reliability Failures
There has been an increasing number of reports concluding that stacked micro vias are failing preferentially when compared to an alternative staggered via design.
Analysis Lab

Miniaturization with Help of Reduced Component to Component Spacing
Miniaturization with Help of Reduced Component to Component Spacing
This paper covers layout, assembly and material selections to reduce component to component spacing down to 4-5mil from today's mainstream of 6-8mil.
Production Floor

When is it Time to Switch from Manual Assembly to Automation?
When is it Time to Switch from Manual Assembly to Automation?
We are a new start-up assembling wireless sensors. All assembly is now manual. We are at a point where we are experiencing large reject rates due to hand soldering of components. The Assembly Brothers, Phil Zarrow and Jim Hall, offer their insight.
Board Talk

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