Electronics Assembly Knowledge, Vision & Wisdom
Assembly, Printing, Pick & Place << Page 1 of 18 >>
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

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What Is the Ideal Humidity for PCB Assembly?
How would the temperature and humidity differing from the recommended affect the solderability of circuit board assemblies?
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Challenges for Step Stencil Printing
Challenges for Step Stencil Printing
This paper focuses on the printing performance of step-up/step-down stencils and the paper ends up with a short outlook on 3D cavity printing.
Production Floor
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Recommended Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and a PCB hole that will allow for a proper solder fill?
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Stencil Printing Process Tools for Miniaturization
Stencil Printing Process Tools for Miniaturization
This paper offers preliminary test results relating to the stencil coating technology and how they impact miniaturization and high yield processing.
Production Floor
PCB Assembly System Set-Up for PoP
PCB Assembly System Set-Up for PoP
This paper will explore the challenges and solutions of PoP assembly for the SMT assembly system.
Production Floor
Solder Paste Print Volume vs. Alignment?
Solder Paste Print Volume vs. Alignment?
Which of these factors is more critical to the solder printing process, solder paste volume or solder print alignment? The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this question and share their insight and experiences.
Board Talk
Stencil Printing: Circular vs. Square Apertures
Stencil Printing: Circular vs. Square Apertures
Paper covers practices for optimizing the printing process focusing on comparison of large/small and square vs. round apertures.
Production Floor
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Solution for Grape Effect
Our smaller parts are showing the 'grape' effect. What is the best solution for this since we cannot increase the conveyor speed or lower temperatures?
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Screen Printing and Humidity
Screen Printing and Humidity
Solder paste is drying out inside our screen printer. How can we increase humidity to slow drying of our solder paste?
Board Talk
Solder Paste and the 5 Ball Rule
Solder Paste and the 5 Ball Rule
For either Type III or Type IV solder paste, should there be a minimum number of solder spheres deposited on each surface mount pad? The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question.
Board Talk
Assembly, Printing, Pick & Place << Page 1 of 18 >>
 
 
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