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These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more. Programs are sorted by published date, most recent first.
Reservior Printing in Deep Cavities
Guidelines for stencil designs and aperture placement in cavities are presented, including stencil design, paste material, experimentation, and results.
Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function?
Advanced Second Level Assembly Analysis Techniques
This analysis method provides new capabilities when planning and monitoring the assembly interface to help predict and compensate for defects.
Print Performance Studies Comparing Electroform and Laser-Cut Stencils
Study investigates the print performance and the dispersion in paste transfer volume for a variety of Electroform and Laser-Cut stencils.
Predicting the Reliability of Package-On-Package Interconnections
Package-on-package technologies are being considered to reduce the size, weight, and power of military, space, and satellite electronics.
Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily.
Material Selection and Optimization for TMV PoP
Materials selection and parameter optimization to better understand the critical factors with successful TMV PoP assembly are investigated.
Larger Stencil Apertures and Type 4 Paste
What is your experience with larger size apertures and type four solder paste for non-collapsible BGA and CGA type solder joints?
Assembling Boards with BGAs on Both Sides
What are the pros and cons of assembling circuit boards with BGA components on both sides? Should we first place BGAs on side one or side two? Does it make a difference? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions.
Electronic Packages and Modules Based on Embedded Die Technologies
This paper describes the use of embedded die technologies and the development of work in the on power electronic applications.
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