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Assembly, Printing, Pick & Place << Page 1 of 17 >>
These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

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Maximum Time Between Printing and Reflow
Maximum Time Between Printing and Reflow
What is the maximum allowable time for a PCB after it leaves the screen printer but before reflow? We're using water soluble lead-free paste. The Assembly Brothers, Phil Zarrow and Jim Hall, discuss this.
Board Talk
Assembly Reliability of TSOP/DFN PoP Stack Package
Assembly Reliability of TSOP/DFN PoP Stack Package
This paper presents thermal cycle reliability evaluations of 2-high and 4-high 3D stacks built with a mix of TSOP and DFN daisy-chain package assembly.
Analysis Lab
Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Many center pad voiding studies have focused on center pad footprint/stencil aperture designs. This study focuses on I/O pad stencil modifications.
Analysis Lab
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
This study shows optimized print process can be achieved using standard materials, while also considering board level reliability.
Production Floor
Beyond 0402M Placement: Considerations for Microchip Mounting
Beyond 0402M Placement: Considerations for Microchip Mounting
This presentation explores board and component trends, and delves into three areas for successful 03015M adoption: equipment, materials, and controls.
Production Floor
Processing Circuit Boards with BGAs On Both Sides
Processing Circuit Boards with BGAs On Both Sides
What is the best way to process a 30 mil circuit board assembly that has micro BGAs that need to be soldered to both sides? The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question.
Board Talk
Low Surface Energy Coatings Rewrite Area Ratio Rules
Low Surface Energy Coatings Rewrite Area Ratio Rules
Paper on the properties of solder paste release and the effects of surface free energy that make up the stencil printing process.
Materials Tech
Gold Stud Bump Flip Chip Bonding on Interconnect Devices
Gold Stud Bump Flip Chip Bonding on Interconnect Devices
This paper presents the studies on flip chip thermo-compression bonding (TCB) of gold stud bumps on MID substrate.
Production Floor
Solder Paste Stencil Design for Optimal QFN Reliability
Solder Paste Stencil Design for Optimal QFN Reliability
In this study, the volume of solder used in assembly of QFNs was varied to investigate the relationship between standoff height and thermal cycle life.
Production Floor
Choosing the Right Stencil Options
Choosing the Right Stencil Options
Quality and yield are directly linked to the solder printing process. A constant paste depot is critical to a stable soldering process.
Production Floor
Assembly, Printing, Pick & Place << Page 1 of 17 >>