Electronics Assembly Knowledge, Vision & Wisdom
Assembly, Printing, Pick & Place
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These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more. Programs are sorted by published date, most recent first.


Void Reduction Method for BTC Using Exposed Via in Pad
Void Reduction Method for BTC Using Exposed Via in Pad
The method explored in this paper regards the use of exposed via in pad. A dedicated test vehicle was designed for two types of QFN components.
Analysis Lab

An Interesting Approach to Yield Improvement
An Interesting Approach to Yield Improvement
The approach involves spending a little more money than normal at the start of project and the results show savings of many times more than this outlay.
Production Floor

Electronic Packages and Modules Based on Embedded Die Technologies
Electronic Packages and Modules Based on Embedded Die Technologies
This paper describes the use of embedded die technologies and the development of work in the on power electronic applications.
Production Floor

Strain Measuring Technology in Board Level Assembly Process
Strain Measuring Technology in Board Level Assembly Process
The study on strain measurement has just started, and there are still many unsolved puzzles, whether about strain gage selection or about measurement methodology.
Analysis Lab

Stencil Design for Ultra Fine Pitch Printing
Stencil Design for Ultra Fine Pitch Printing
Miniaturization is pushing the stencil printing process. As features become smaller, solder paste transfer efficiency is becoming more critical.
Production Floor

Stencil Printing for Challenging Heterogeneous Assembly Applications
Stencil Printing for Challenging Heterogeneous Assembly Applications
A series of Metric 0201 experiments investigating printing process sensitivity to circuit board properties, including pad dimensional accuracy and landscape topography.
Analysis Lab

Selective Solder Paste Printing for BGA Components
Selective Solder Paste Printing for BGA Components
Could we print paste only on the pads that have functional requirements? Could we skip printing on 50 or more of the interior pads since they serve no function?
Board Talk

Evaluating Manual and Automated Heat Sink Assembly
Evaluating Manual and Automated Heat Sink Assembly
This paper illustrates the use of strain gauge testing and Finite Element Analysis as a simulation tool to optimize the heat sink assembly process.
Production Floor

Issues With SMT Component Alignment
Issues With SMT Component Alignment
During automatic optical inspection our chip components are shifting. This is not limited to single components and changes daily.
Board Talk

Electroplated Copper Filling of Through Hole Influence of Hole Geometry
Electroplated Copper Filling of Through Hole Influence of Hole Geometry
The through hole fill technology and factors that affect performance such as substrate thickness and through hole diameter will be presented.
Production Floor

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