Authored By:
Cliff Sandstrom
Deca Technologies Inc.
AZ, USA
Charles Woychik, Alan Huffman
SkyWater Technology, Inc.
FL, USA
Summary
There are numerous market drivers that are achieved using fan-out wafer-level packaging (FOWLP), such as: reduced form factor, improved electrical performance due to shorter interconnects, lower packaging costs, chiplet integration, and lower power consumption. FOWLP is a platform that is projected to have one of the highest growth rates for advanced packaging [1] and is very well suited to address a wide range of applications, including high-performance multi-chip modules that have through mold vias (TMVs) and double-sided build up layers.
To achieve these goals, the Deca M-series™ fan-out technology is a leading contender. The novel features of this technology are mask-less laser direct imaging, Adaptive Patterning, and the capability to do 2μm Lines/Spaces (L/S). In this paper, an overview of packages having multiple die along with double-sided build up layers will be presented. The process flow will be discussed to show how this technology can provide high module yields, fine L/S and accommodate 20μm die pitch.
Conclusions
In this paper, LDI was presented as an option for photolithography in the advanced packaging discipline. Currently LDI is deployed for both 300 and 600mm formats at Deca’s licensee partners in support of M-Series™ with Adaptive Patterning®. LDI has advantages of higher DOF, mask-less, large panel processing experience, large packages without reticle stitching, and real time design optimization. LDI processing classically uses dry films from the PCB industry supporting high aspect ratio imaging up to 4:1. Liquid resists have been developed in support of 2μm line & space using 405nm for advanced RDL features.
These processes have been successfully deployed in support of heterogenous integration in multi-die products. The LDI tool enables full lithographic patterning technology capability to maximize yield, enhance design rules and improve performance.
Initially Published in the SMTA Proceedings
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