Electronics Assembly Knowledge, Vision & Wisdom
Signal Transmission Loss Due to Surface Roughness
Signal Transmission Loss Due to Surface Roughness
In this research, parameters of various types of transmission line structures on an evaluation board were measured and analyzed in detail.
Materials Tech

Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company


Your E-mail


Your Country


Your Comment



Authored By:
Elaine Liew, Mitsui Copper Foil Malaysia, Shah Alam Malaysia
Taka-aki Okubo, Toshio Sudo, Shibaura Institute of Technology, Tokyo Japan
Toshihiro Hosoi, Hiroaki Tsuyoshi, Fujio Kuwako, Mitsui Kinzoku Co., Ltd, Japan

Summary
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So, signal transmission loss of copper wiring on a printed circuit board has been studied. First, total signal loss was divided into dielectric loss and conductor loss quantitatively based on electromagnetic theory. In particular, the scattering loss due to surface roughness of copper foil has been examined in detail and the usefulness of the copper foil with low surface roughness has been demonstrated.

Conclusions
In this research, parameters of various types of transmission line structures on an evaluation board were measured and analyzed in detail.

It was confirmed that reduction of signal loss for differential transmission line was greater than that for single-ended transmission line. From this, it was shown that differential transmission line is useful for the reduction of losses in high-speed signal transmission.

Signal loss has been greatly reduced by adopting low dielectric constant material. It has been confirmed that the signal loss of dielectric G1 was reduced by about 68% compared with the signal loss of FR-4.

When using the low dielectric constant materials instead of FR-4, the ratio of the conductor loss against the entire loss increases. The ratio of conductor loss for FR-4 was 13% of the total signal loss, but the conductor loss in dielectric G1 will increase to 30% among the overall loss.

If low dielectric material is used as dielectric, low roughness copper foil is effective in reducing the overall loss. Low roughness copper foil was found to reduce by 73% of the scattering loss compared with commonly used surface roughness of copper foil.

The chemical treatment on very low profile and the thin resin coating on no nodule copper foil are both very effective to improve bond strength of laminates.

Initially Published in the IPC Proceedings

Comments
No comments have been submitted to date.
Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search
Related Programs
bullet Stereo Vision Based Automated Solder Ball Height Detection
bullet HALT Testing of Backward Soldered BGAs on a Military Product
bullet Should We Invest in 3D Optical Inspection?
bullet Good Quality Comes From Good Design for Test
bullet What is Kelvin Test?
bullet Head in Pillow X-ray Inspection at Flextronics
bullet Embedded System Access
bullet Signal Transmission Loss Due to Surface Roughness
bullet Electrical Testing of Passive Components
bullet The Evolution of ICT
More Related Programs