Research
Impractical Stencil Aperture Designs to Enable M0201 Assembly
Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Microalloyed Sn-Cu Pb-Free Solder for High Temp
Selective Reflow Rework Process
Impact of Thermal Loading on the Structural Intergrity of 3D TSV Package
Design and Fabrication of Ultra-Thin Flexible Substrate
Influence of PCB Surface Features on BGA Assembly Yield
Last Will and Testament of the BGA Void
MORE RESEARCH
Latest Industry News
Print These Electronic Circuits Directly Onto Skin
Compal increasingly asked to diversify production bases
Intel's margins tumble as customers shift to cheaper chips, shares slide 10%
From Foldable Phones to Stretchy Screens
6 Considerations for Integrating Sensors in Vehicles
Bill Gates Says Unhappy Customers Are Good for Your Business. Here's Why.
iPhone 12 review: Upgrade for the camera, not 5G
Apple's shifting supply chain creates boomtowns in rural Vietnam
MORE INDUSTRY NEWS

Simple Test for Flux Penetration



Simple Test for Flux Penetration
What is a good test for flux penetration through plated hole barrels on plated through hole circuit boards? A simple method is offered.
Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Process Troubleshooting, Failure Analysis, Process Audits, Process Set-up
CEM Selection/Qualification, SMT Training/Seminars, Legal Disputes
Phil Zarrow
Phil Zarrow
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall
Jim Hall
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

Transcript


Phil
And welcome to Board Talk. You are here with Phil and Jim, the assembly brothers pick and place. And we are here to talk surface mount processes, equipment, materials, procedures, and whatever may ail you or make your day.

Jim, what's today's question.

Jim
Well Phil, it actually isn't surface mount, it is the old technology, wave soldering. It is a pretty straight-forward question and comes from J.V.

What is a good test for flux penetration through the plated hole barrels?

Phil
Good question, and I'm glad he is checking it out. So many people neglect their wave solder machine and the proper setup. It is kind of refreshing to hear. 

There are some procedures that are used. You can buy some fancy tools. But we like to do the old board sandwich.

One way of doing that is essentially you take your board, your through hole board that you are wanting to test penetration on. And you put a piece of thermal style fax paper and you sandwich that in. Then you put another like board on top of it. Then you clamp them together.

If you don't have any fax paper you can use ...

Jim
Well, technically any paper, but to really make the dots show up, if you have alcohol based flux, thermal fax paper is the best. If you are using a water-based flux litmus paper will give you a better reaction.

Any paper will work but it won't turn color, and it will be more problematic to see the dots.

Phil
You make that sandwich and you run it through your fluxer as you would normally operate it.

When it comes out you look at the paper and look at the dots. You will be able to determine if your flux has penetrated with the current settings through the holes on the board. Pretty straight-forward.

Jim
Do not run the board through full pre-heat or the wave with paper in it. You take severe risks to the well-being of your factory.

Phil
Regardless of whether you are trying to run litmus paper through your machine or whatever, when you go to solder whatever you do, don't solder like my brother.

Jim
And don't solder like my brother.

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
Causes of Blowholes
Tips When Moving a Reflow Oven
Assembling Boards with BGAs on Both Sides
Larger Stencil Apertures and Type 4 Paste
5 vs 8-Zone Ovens
Component Moisture Question?
BGA Components and Coplanarity
How To Verify Cleanliness After Rework and Prior to Re-coating?
MORE BOARD TALK
Ask the Experts
Initial Screen Print Test Board
HASL Surface Finish and Coplanarity
Legend Marking Discoloration
Cleanliness Testing
Stencil Cleaning Frequency
Exposed Copper Risk
Spotting After DI Water Cleaning
ESD Grounding - 1 Meg Ohm Resistor
MORE ASK THE EXPERTS