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Printing and Assembly Challenges for QFN Devices



Printing and Assembly Challenges for QFN Devices
QFN (quad flatpack, no leads) and DFN (dual flatpack, no lead) are becoming more popular in new component releases.
Production Floor

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Authored By:


Rachel Short
Photo Stencil, Colorado Springs, CO USA

Conclusions


Although QFN devices present a challenge to the SMT assembly process with proper stencil design, proper stencil technology selection (Laser, Electroform, Nano-Coat), and proper PCB solder mask layout these challenges can be overcome. The most popular QFN repair seems to be to print solder paste directly onto the QFN leads and ground plane.

Initially Published in the IPC Proceedings

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