Electronics Assembly Knowledge, Vision & Wisdom
Solders, Fluxes, Pastes
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These programs cover solders, alloys, fluxes, solder pastes and more. Programs are sorted by published date, most recent first.


Determination of Total Halogen Content in Halogen-Free Fluxes
Determination of Total Halogen Content in Halogen-Free Fluxes
It is important for laboratories to follow robust methods to assure commercial products meet the safety requirements established.
Analysis Lab

Stencil Quality & Technology on Solder Paste Printing Performance
Stencil Quality & Technology on Solder Paste Printing Performance
We evaluate the impact of stencil quality by comparing the printing performance of 0.35mm pitch and 01005 pads from different stencil suppliers.
Analysis Lab

Screening of Lower Melting Point Pb-Free Alloys
Screening of Lower Melting Point Pb-Free Alloys
Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies.
Materials Tech

Flux Residue Influence on Surface Insulation Resistance
Flux Residue Influence on Surface Insulation Resistance
Two liquid flux and two newly developed products build up the basic models. The results also provide a scientific approach to design highly reliable products.
Analysis Lab

Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
In this work, a new halogen-free no-clean flux solder paste been developed. It exhibited ultra-low voiding and virtually zero solder beading performance.
Materials Tech

Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging
Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging
This paper presents harsh environment reliability test results for lead-free solder pastes with and without the presence of a variety of dopant elements.
Materials Tech

Reliability of Isothermally Aged Doped Low Creep Lead-Free Solder Paste
Reliability of Isothermally Aged Doped Low Creep Lead-Free Solder Paste
The primary goal of this study was to find a manufacturable solder paste material that would reduce the effects of aging on the solder joints.
Analysis Lab

Pressure-Less Silver Sintering Pastes for Low Porosity Joint and Large Die
Pressure-Less Silver Sintering Pastes for Low Porosity Joint and Large Die
Under pressure-less sintering conditions silver sintering pastes for different sized die attachment to form robust silver joints have been developed.
Materials Tech

Jetting Solder Paste Opens Up New Possibilities
Jetting Solder Paste Opens Up New Possibilities
Today Jet Printing is no longer seen as a futuristic technology but it has proven itself and the technology is still gaining momentum.
Production Floor

The Sir Reliability of Fine Pitch QFN Components Under Harsh Condition
The Sir Reliability of Fine Pitch QFN Components Under Harsh Condition
A variety of dummy QFNs are assembled on PCBs whose surface finish is OSP by reflow in air, they are tested under 5V bias voltage and 85, 85%RH condition.
Analysis Lab

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