Electronics Assembly Knowledge, Vision & Wisdom
Solders, Fluxes, Pastes
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These programs cover solders, alloys, fluxes, solder pastes and more. Programs are sorted by published date, most recent first.


Bending Strength of Solder Joints as a Function of Joint Length
Bending Strength of Solder Joints as a Function of Joint Length
The effect of joint length on the fracture of copper-solder-copper joints is investigated using double cantilever-beam specimens of various joint lengths.
Analysis Lab

75% IPA/25% DI Extraction Solution on No-Clean Flux Residues
75% IPA/25% DI Extraction Solution on No-Clean Flux Residues
This study is broken into two parts, first a review of the solubility of some critical ions in different ratios of IPA/DI and at different temperatures.
Materials Tech

Dissolution Rate of Specific Elements in SAC305 Solder
Dissolution Rate of Specific Elements in SAC305 Solder
This paper describes the approach for measuring the solder dissolution that can be used to optimize soldering process profiles for electronic assemblies.
Materials Tech

Impact of Low Silver Paste on Area Array Joint Quality
Impact of Low Silver Paste on Area Array Joint Quality
This paper provides analysis to "fill in the gaps" concerning the implementation for a wide variety of lead-free solder alloys.
Production Floor

Electrochemical Methods to Measure Corrosion Potential of Flux Residue
Electrochemical Methods to Measure Corrosion Potential of Flux Residue
This study reviewed electrochemical methods on four flux systems used in a SIR study to determine if EIS data findings have commonality with SIR data findings.
Analysis Lab

Fill the Void
Fill the Void
Several methods of minimizing voids are presented. Printing solder paste with gas escape routes is an excellent way to reduce voiding.
Materials Tech

Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump
Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump
The research objective is to estimate metallurgical and mechanical properties of low alpha solder. Cu-filling property to TSV was also investigated.
Materials Tech

Robust SMT No-Clean Solder Paste for SIP and 01005 Assembly
Robust SMT No-Clean Solder Paste for SIP and 01005 Assembly
Solder powder size, flux chemistry, stencil aperture, stencil surface technology, reflow process, and more are investigated.
Materials Tech

Formulation of a New Liquid Flux for High Temperature Soldering
Formulation of a New Liquid Flux for High Temperature Soldering
This paper presents the development of a new liquid flux. Laboratory and beta-site test results for existing fluxes are compared to this new flux.
Materials Tech

Attributes of Cored Solder Wire in LED Luminaire Soldering
Attributes of Cored Solder Wire in LED Luminaire Soldering
Reflectivity as a metric to quantify "shininess" is presented. An approach to quantifying "Reflectivity" of solder alloy joints has been developed.
Materials Tech

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