Solders, Fluxes, Pastes



These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.
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New Requirements for Sir Measurement
New Requirements for Sir Measurement
Flux residues can create interaction with solder resists and the component body. This paper discusses a new SIR measurement process.
Analysis Lab

Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes
In this paper, the effect of mixing solder sphere alloys with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied.
Materials Tech

Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
This paper focuses on the surface insulation resistance (SIR) differences between rosin-containing and rosin-free flux formulations.
Materials Tech

75% IPA/25% DI Extraction Solution on No-Clean Flux Residues
75% IPA/25% DI Extraction Solution on No-Clean Flux Residues
This study is broken into two parts, first a review of the solubility of some critical ions in different ratios of IPA/DI and at different temperatures.
Materials Tech

Dissolution Rate of Specific Elements in SAC305 Solder
Dissolution Rate of Specific Elements in SAC305 Solder
This paper describes the approach for measuring the solder dissolution that can be used to optimize soldering process profiles for electronic assemblies.
Materials Tech

Testing Intermetallic Fragility
Testing Intermetallic Fragility
Data is presented on the intermetallic strengths and failure modes of two bond pull test methods.
Analysis Lab

Fill the Void
Fill the Void
Several methods of minimizing voids are presented. Printing solder paste with gas escape routes is an excellent way to reduce voiding.
Materials Tech

Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump
Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump
The research objective is to estimate metallurgical and mechanical properties of low alpha solder. Cu-filling property to TSV was also investigated.
Materials Tech

Robust SMT No-Clean Solder Paste for SIP and 01005 Assembly
Robust SMT No-Clean Solder Paste for SIP and 01005 Assembly
Solder powder size, flux chemistry, stencil aperture, stencil surface technology, reflow process, and more are investigated.
Materials Tech

Formulation of a New Liquid Flux for High Temperature Soldering
Formulation of a New Liquid Flux for High Temperature Soldering
This paper presents the development of a new liquid flux. Laboratory and beta-site test results for existing fluxes are compared to this new flux.
Materials Tech

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