Electronics Assembly Knowledge, Vision & Wisdom
Solders, Fluxes, Pastes << Page 1 of 13 >>
These programs cover solders, alloys, fluxes, solder pastes and more.

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Ask the Experts
Solder Paste Alloy Check
We accidentally assembled boards using lead-free paste. Is there an easy method to check which paste has been used?
Ask the Experts
Solder Paste - Type 3 or Type 4?
Solder Paste - Type 3 or Type 4?
What are the determining factors when switching from type 3 solder paste to type 4 solder paste for the solder paste printing operation?
Board Talk
Suitable Flux Medium for Cleanable and No-Clean Solder Pastes
This paper presents two concrete studies. Development steps will be validated by standardized tests, home-made testing, and industrial evaluations.
Materials Tech
Reliability of No-clean and Water-soluble Solder Pastes
Reliability of No-clean and Water-soluble Solder Pastes
The purpose of this paper is to highlight the differences between two families of solder pastes to guide users in their choice.
Analysis Lab
3 Steps To Solder Paste Selection
3 Steps To Solder Paste Selection
This paper covers the most significant issues in solder paste selection to meet the goals of manufacturing.
Materials Tech
Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
This paper focuses on the surface insulation resistance (SIR) differences between rosin-containing and rosin-free flux formulations.
Materials Tech
Voiding/Drop Test for Mixed Alloy BGA Assembly
Voiding/Drop Test for Mixed Alloy BGA Assembly
BGAs with various alloy balls were assembled with various solder pastes. Joint strength, drop test performance and voiding performance were evaluated.
Analysis Lab
Predicting Fatigue of Solder Joints
Predicting Fatigue of Solder Joints
Chip resistors were subjected to a high number of short duration power cycles. Environmental conditions and material properties were documented.
Analysis Lab
Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump
Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump
The research objective is to estimate metallurgical and mechanical properties of low alpha solder. Cu-filling property to TSV was also investigated.
Materials Tech
The Effects of Phosphorus in Lead-Free Solders
The Effects of Phosphorus in Lead-Free Solders
This paper reports on experiments to determine the effects of phosphorus additions on the behavior of a widely used lead-free solder.
Production Floor
Solders, Fluxes, Pastes << Page 1 of 13 >>
 
 
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