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| Solders, Fluxes, Pastes | ||||||||||
| These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more. | ||||||||||
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Reflectivity as a metric to quantify "shininess" is presented. An approach to quantifying "Reflectivity" of solder alloy joints has been developed. Materials Tech
Today Jet Printing is no longer seen as a futuristic technology but it has proven itself and the technology is still gaining momentum. Production Floor
Flux residues can create interaction with solder resists and the component body. This paper discusses a new SIR measurement process. Analysis Lab
In the study reported in this paper the effect of trace additions of selected elements on the grain structure of pure tin and lead-free solder alloys was observed. Analysis Lab
This paper details a water-soluble lead-free solder paste that has improved voiding performance and washability over previous generations of solder paste. Materials Tech
High-Ag, low-Ag: Which alloy fits best certain application? Here we present a report on the thermal and mechanical reliability of alloys. Materials Tech
In this study, we developed a Cu paste that can be used as a filling material for through silicon via (TSV), through glass via (TGV), and organic substrates. Materials Tech
This paper presents performance/process capability of various low/no silver alloy solder pastes. Production Floor
This paper discusses a nano copper based paste for use in via filling. Materials Tech
The differences between jet printing and dispensing will be highlighted and technical challenges with broad band technology will be discussed. Production Floor |
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