Electronics Assembly Knowledge, Vision & Wisdom
Solders, Fluxes, Pastes
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These programs cover solders, alloys, fluxes, solder pastes and more. Programs are sorted by published date, most recent first.


Utilizing an Alternative Solder Paste to Improve the PCB Assembly Process
Utilizing an Alternative Solder Paste to Improve the PCB Assembly Process
Results from an investigation that studied and characterized a novel lead-free solder paste as compared to traditional solder materials will be presented.
Production Floor

Superior Thermal Cycling Reliability of PB-Free Solder Alloy
Superior Thermal Cycling Reliability of PB-Free Solder Alloy
Alternative solders meet stringent environmental regulations, requirements for greater mechanical reliability, and high temperature service environments.
Materials Tech

Microstructure and Reliability of Low AG/Bi Solder Alloys
Microstructure and Reliability of Low AG/Bi Solder Alloys
The goal of this study was to provide a screening experiment for three alloys Bi-containing, Low (or no) Ag as alternatives to SAC305.
Analysis Lab

Flux for Cleanable and No-Clean Solder Pastes
Flux for Cleanable and No-Clean Solder Pastes
Paper provides a description of flux and the role of their constituting ingredients and a tin-bismuth-silver solder paste with cleanable residues.
Materials Tech

Surface Insulation Resistance of No-Clean Flux Residues
Surface Insulation Resistance of No-Clean Flux Residues
No-clean fluxes present great benefits, but the activity of the unwashed process residues must be tightly controlled in order to meet reliability standards.
Materials Tech

Solder Paste Selection for Bottom Termination Components Attach
Solder Paste Selection for Bottom Termination Components Attach
Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly.
Materials Tech

Solder Paste: Fundamental Material Property / SMT Performance Correlation
Solder Paste: Fundamental Material Property / SMT Performance Correlation
Aggressive form factors, reducing pitch, thinner packages, and larger die to package ratios are leading to higher package warpage during SMT reflow.
Materials Tech

Rheology of Solder Paste: Shelf Life Study
Rheology of Solder Paste: Shelf Life Study
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions.
Materials Tech

Implementation of Assembly Processes for Low-Melting Point Solder Pastes
Implementation of Assembly Processes for Low-Melting Point Solder Pastes
This paper discusses the need for low-temperature solders and compare the process-ability of solder pastes with three novel alloys against the industry standard.
Materials Tech

Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste
Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste
This paper covers a type of 'crack free' flux paste designed to inhibit cracking under extreme environments. Includes electro-chemical migration tests dew ...
Materials Tech

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