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Solders, Fluxes, Pastes | ||||||||||
These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more. | ||||||||||
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A novel epoxy SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste. Materials Tech This paper investigates a number of low (or no) Silver (Ag), Bi-containing Pb-free alloys for performance in accelerated thermal cycling (ATC). Analysis Lab Alpha focused on improving the properties of the bulk solder as well as controlled growth of interfacial IMCs and alloy microstructure. Materials Tech Characteristics of alloys, the development of flux media, solder pastes performance and solder joint reliability are discussed. Materials Tech This study investigated the cause of tombstoning for 0402 capacitors in surface mount technology. Statistical analysis methods were used to determine if there was any difference. Analysis Lab This paper discusses low temperature Pb-free alloys, which are capable of delivering high reliability performance at low soldering temperatures. Materials Tech On average, how many locations should we measure our PCBs to confirm our solder paste thickness? Our PCBs are approximately 10" by 10". Board Talk It was the goal of this paper to overcome myths and misunderstandings within the PCB manufacturing environment regarding the HP ENIG finish. Materials Tech This paper provides analysis to "fill in the gaps" concerning the implementation for a wide variety of lead-free solder alloys. Production Floor The current study extended the quasi-static approach of [6,7] to treat solder joint fracture under higher strain-rate loading conditions. Analysis Lab |
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