Solders, Fluxes, Pastes
These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.
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Novel TIM Solution with Chain Network Solder Composite
Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. Cu filler was added to the solder paste.
Materials Tech

Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys
Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys
This paper investigates a number of low (or no) Silver (Ag), Bi-containing Pb-free alloys for performance in accelerated thermal cycling (ATC).
Analysis Lab

Lead-Free Alloys with Ultra-High Thermo-Mechanical Reliability
Lead-Free Alloys with Ultra-High Thermo-Mechanical Reliability
Alpha focused on improving the properties of the bulk solder as well as controlled growth of interfacial IMCs and alloy microstructure.
Materials Tech

Characterization of Solder Pastes Based on Two Alternative Alloys
Characterization of Solder Pastes Based on Two Alternative Alloys
Characteristics of alloys, the development of flux media, solder pastes performance and solder joint reliability are discussed.
Materials Tech

Analyzing 0402 Capacitor Defects With Stencil Printing Misalignment
Analyzing 0402 Capacitor Defects With Stencil Printing Misalignment
This study investigated the cause of tombstoning for 0402 capacitors in surface mount technology. Statistical analysis methods were used to determine if there was any difference.
Analysis Lab

Low Temperature Solder Alloys for Portable Electronics
Low Temperature Solder Alloys for Portable Electronics
This paper discusses low temperature Pb-free alloys, which are capable of delivering high reliability performance at low soldering temperatures.
Materials Tech

Should We Measure Solder Paste Thickness?
Should We Measure Solder Paste Thickness?
On average, how many locations should we measure our PCBs to confirm our solder paste thickness? Our PCBs are approximately 10" by 10".
Board Talk

Designing a High Performance Electroless Nickel and Immersion Gold
Designing a High Performance Electroless Nickel and Immersion Gold
It was the goal of this paper to overcome myths and misunderstandings within the PCB manufacturing environment regarding the HP ENIG finish.
Materials Tech

Impact of Low Silver Paste on Area Array Joint Quality
Impact of Low Silver Paste on Area Array Joint Quality
This paper provides analysis to "fill in the gaps" concerning the implementation for a wide variety of lead-free solder alloys.
Production Floor

Fracture of Lead-Free Joints
Fracture of Lead-Free Joints
The current study extended the quasi-static approach of [6,7] to treat solder joint fracture under higher strain-rate loading conditions.
Analysis Lab