Electronics Assembly Knowledge, Vision & Wisdom
Solders, Fluxes, Pastes
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These programs cover solders, alloys, fluxes, solder pastes and more. Programs are sorted by published date, most recent first.


Has My Flux Expired?
Has My Flux Expired?
What specific attributes occur in an expired flux? How do you know if a flux is bad and shouldn't be used? Are there any simple tests? The Assembly Brothers, Jim Hall and Phil Zarrow, share there expertise and shed some light on these questions.
Board Talk

Nanocopper Based Paste for Solid Copper Via Fill
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling.
Materials Tech

Voiding/Drop Test for Mixed Alloy BGA Assembly
Voiding/Drop Test for Mixed Alloy BGA Assembly
BGAs with various alloy balls were assembled with various solder pastes. Joint strength, drop test performance and voiding performance were evaluated.
Analysis Lab

New-Generation, Low-Temperature Lead-Free Solder
New-Generation, Low-Temperature Lead-Free Solder
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech

Backward Compatible Solder Joint Reliability Under Accelerated Conditions
Backward Compatible Solder Joint Reliability Under Accelerated Conditions
Accelerated temperature cycling was used to assess the thermal fatigue reliability of a Pb free grid array package assembled.
Production Floor

Reliability of No-clean and Water-soluble Solder Pastes
Reliability of No-clean and Water-soluble Solder Pastes
The purpose of this paper is to highlight the differences between two families of solder pastes to guide users in their choice.
Analysis Lab

Predicting Fatigue of Solder Joints
Predicting Fatigue of Solder Joints
Chip resistors were subjected to a high number of short duration power cycles. Environmental conditions and material properties were documented.
Analysis Lab

New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly
New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech

Low Temperature SMT Solder Evaluation
Low Temperature SMT Solder Evaluation
Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications.
Production Floor

Characterization of Solder Pastes Based on Two Alternative Alloys
Characterization of Solder Pastes Based on Two Alternative Alloys
Characteristics of alloys, the development of flux media, solder pastes performance and solder joint reliability are discussed.
Materials Tech

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