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Solders, Fluxes, Pastes << Page 1 of 13 >>
These programs cover solders, alloys, fluxes, solder pastes and more.

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Reliability of Lead Free Solder Joints in Ball Grid Array Packages
Reliability of Lead Free Solder Joints in Ball Grid Array Packages
This paper investigates the impact of isothermal aging on the long-term reliability of lead-free solder joints.
Analysis Lab
Lead-free Development in Server Applications
Lead-free Development in Server Applications
Paper examines the effects of varying surface finishes, process parameters and interactions that affect solder attach attributes.
Materials Tech
Ask the Experts
QFN Test Failures Caused by Flux
A test engineer claims that test failures are due to flux residue between terminations that affects the capacitance at the joints. Is this a valid claim?
Ask the Experts
Factors Impacting the Reliability of Ultralow Silver Lead Free Alloys
Factors Impacting the Reliability of Ultralow Silver Lead Free Alloys
The delta of the thermal cycle and dwell at each end of the thermal cycle are determined to be significant contributors.
Analysis Lab
Evaluation of Lead-free Solder Pastes
Evaluation of Lead-free Solder Pastes
This paper discusses the strategy and methodology for selecting a good lead-free solder paste material for volume manufacturing uses.
Materials Tech
Solder Joint Reliability of 0.8 mm BGA Packages for Automotive
Solder Joint Reliability of 0.8 mm BGA Packages for Automotive
Described is work to improve solder-joint reliability of 0.8mm pitch BGA packages used in automotive under-the-hood applications.
Analysis Lab
Ask the Experts
Viscosity of Solder Paste Before Printing
What is the general recommended viscosity of solder paste before printing?
Ask the Experts
Pb-free Solder Joint Reliability
Pb-free Solder Joint Reliability
Paper compares the thermal fatigue reliability of Pb-free and SnPb solder joints in 16 different, high strain surface mount packages.
Analysis Lab
Ask the Experts
Reusing recovered solder paste
We are wasting a lot of solder paste. Can we recover the solder paste, since disposition of used solder paste is tedious task?
Ask the Experts
Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux
Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux
This paper reports on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range on finished PCBs soldered with organic acid flux.
Analysis Lab
Solders, Fluxes, Pastes << Page 1 of 13 >>
 
 
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