Electronics Assembly Knowledge, Vision & Wisdom
Solders, Fluxes, Pastes
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These programs cover solders, alloys, fluxes, solder pastes and more. Programs are sorted by published date, most recent first.


Alternatives to Solder in Packaging and Assembly
Alternatives to Solder in Packaging and Assembly
This presentation surveys the landscape of alternatives to solder in interconnect, packaging, and assembly.
Materials Tech

Microalloyed Sn-Cu Pb-Free Solder for High Temp
Microalloyed Sn-Cu Pb-Free Solder for High Temp
While susceptibility to tin whisker growth remains a barrier to the transition to Pb-free, there is now general acceptance that there are reliable alternatives.
Materials Tech

Effect of Reflow Profiling on Solder Paste Flux Residues
Effect of Reflow Profiling on Solder Paste Flux Residues
Paper studied the effect of reflow profiling on the electrical reliability of no-clean flux residues using surface insulation resistance testing.
Production Floor

Nano Silver Replacement for High Lead Solders
Nano Silver Replacement for High Lead Solders
This paper details mechanical and reliability testing of joints made with materials under a range of temperature, pressure and atmosphere.
Materials Tech

Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys
Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys
This paper investigates a number of low (or no) Silver (Ag), Bi-containing Pb-free alloys for performance in accelerated thermal cycling (ATC).
Analysis Lab

Fracture of Lead-Free Joints
Fracture of Lead-Free Joints
The current study extended the quasi-static approach of [6,7] to treat solder joint fracture under higher strain-rate loading conditions.
Analysis Lab

Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste
The miniaturization trend is driving components with large pads. To alleviate the voiding challenge, a voiding-free solder paste will be the solution.
Materials Tech

Mechanical Behavior of Bi-Containing Pb-Frees
Mechanical Behavior of Bi-Containing Pb-Frees
The objective of this research was to characterize the mechanical metallurgy of alternative solder alloys for high-reliability applications.
Analysis Lab

Effect of Process Changes and Flux on Mid-Chip Solder Balling
Effect of Process Changes and Flux on Mid-Chip Solder Balling
Paper documents experimental work performed to understand the impact on mid-chip solder balling from the manufacturing process and flux chemistry.
Production Floor

NanoCopper Based Solder-free Electronic Assembly
NanoCopper Based Solder-free Electronic Assembly
This paper explores a nanotechnology enabled copper-based electrical interconnect material that can be processed around 200 degrees.
Materials Tech

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