Electronics Assembly Knowledge, Vision & Wisdom
Solders, Fluxes, Pastes << Page 1 of 13 >>
These programs cover solders, alloys, fluxes, solder pastes and more.

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Reliability of Multiple Pb-free Solder Ball Alloys
Reliability of Multiple Pb-free Solder Ball Alloys
Paper covers a screening experiment to obtain data comparing thermal fatigue reliability of the various solder ball alloys.
Materials Tech
Processing and Reliability of Low Silver Alloys
Processing and Reliability of Low Silver Alloys
Paper reviews processing and reliability concerns for low silver solder alloys.
Materials Tech
Improving properties of a Lead-free Solder Alloy with Doping of Copper
Improving properties of a Lead-free Solder Alloy with Doping of Copper
This paper reviews 3 lead-free solder alloys to assess the mechanical and thermal cycle properties by implementing drop tests and thermal cycle tests.
Materials Tech
Low-temp, Tin-bismuth-silver Solder Pastes
Low-temp, Tin-bismuth-silver Solder Pastes
Staff from Koki Company and Christopher Associates Inc. collaborate on a study on bismuth usage in lead-free solder.
Materials Tech
Ask the Experts
How Many Fiducials Pre Solder Paste Stencil?
We manufacture solder paste stencils for a variety of customers. We have seen as many as 180 fiducials per stencil with a step and repeat. Is this excessive?
Ask the Experts
What is the Shelf Life of Solder Paste?
What is the Shelf Life of Solder Paste?
What is the practical shelf life of a syringe of solder paste, and what symptoms would one see when the syringe is getting too old? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk
Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys
Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys
This paper investigates a number of low (or no) Silver (Ag), Bi-containing Pb-free alloys for performance in accelerated thermal cycling (ATC).
Analysis Lab
Fracture of Lead-Free Joints
Fracture of Lead-Free Joints
The current study extended the quasi-static approach of [6,7] to treat solder joint fracture under higher strain-rate loading conditions.
Analysis Lab
Solder Pastes to Reduce Head-In-Pillow
Solder Pastes to Reduce Head-In-Pillow
Results of test methods to analyze head in pillow defects to assess BGA/CSP solder ball interactions.
Materials Tech
Effect of Process Changes and Flux on Mid-Chip Solder Balling
Effect of Process Changes and Flux on Mid-Chip Solder Balling
Paper documents experimental work performed to understand the impact on mid-chip solder balling from the manufacturing process and flux chemistry.
Production Floor
Solders, Fluxes, Pastes << Page 1 of 13 >>
 
 
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