Electronics Assembly Knowledge, Vision & Wisdom
Solders, Fluxes, Pastes
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These programs cover solders, alloys, fluxes, solder pastes and more. Programs are sorted by published date, most recent first.


Investigation into Lead-Free Low Silver Solder Wire for Electronics
Investigation into Lead-Free Low Silver Solder Wire for Electronics
This paper show results using a lead-free solder rework wire alloy in terms of wetting, reduced solder iron tip erosion, reduced IMC growth and reliability.
Production Floor

The Effects of Solder Powder Size on Solder Paste Performance
The Effects of Solder Powder Size on Solder Paste Performance
Testing was conducted to measure each of these solders paste performance attributes for solder powders in both water-soluble and no clean solder pastes.
Analysis Lab

Development and Testing of a Lead-Free Low Melting Point Alloy
Development and Testing of a Lead-Free Low Melting Point Alloy
This paper describes the development and testing procedure of a new lead-free low melting point alloy.
Materials Tech

The Role of Organic Amines in Soldering Materials
The Role of Organic Amines in Soldering Materials
Paper shows that tests can be developed to characterize fundamental properties of activator packages that directly impact performance.
Materials Tech

Meeting Future Stencil Printing Challenges with Ultrafine Powder Pastes
Meeting Future Stencil Printing Challenges with Ultrafine Powder Pastes
Paper provides a comparison of the transfer efficiency of solder powder particle sizes with post reflow results in optimal and harsh conditions.
Materials Tech

Fracture of Lead-Free Solder Joints
Fracture of Lead-Free Solder Joints
This study extended the quasi-static approach to treat solder joint fracture under higher strain-rate loading conditions.
Analysis Lab

Impact of Low Silver Paste on Area Array Joint Quality
Impact of Low Silver Paste on Area Array Joint Quality
This paper provides analysis to "fill in the gaps" concerning the implementation for a wide variety of lead-free solder alloys.
Production Floor

Acceptance Testing Of Low-Ag Reflow Solder Alloys
Acceptance Testing Of Low-Ag Reflow Solder Alloys
This paper describes initial test results for low-silver alloys using solder paste alloy assessment protocols for BGAs and leaded components.
Analysis Lab

Suitable Flux Medium for Cleanable and No-Clean Solder Pastes
This paper presents two concrete studies. Development steps will be validated by standardized tests, home-made testing, and industrial evaluations.
Materials Tech

Engineered Flux for Low Temperature Solders
Engineered Flux for Low Temperature Solders
The advantage of engineered flux for low temperature solders in achieving critical properties of the solder paste is summarized in this paper.
Materials Tech

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