Electronics Assembly Knowledge, Vision & Wisdom
Solders, Fluxes, Pastes << Page 1 of 14 >>
These programs cover solders, alloys, fluxes, solder pastes and more.

Programs are sorted by published date, most recent first.
Directory Search        


Program Search        
The Sir Reliability of Fine Pitch QFN Components Under Harsh Condition
The Sir Reliability of Fine Pitch QFN Components Under Harsh Condition
A variety of dummy QFNs are assembled on PCBs whose surface finish is OSP by reflow in air, they are tested under 5V bias voltage and 85, 85%RH condition.
Analysis Lab
Screening of Lower Melting Point Pb-Free Alloys
Screening of Lower Melting Point Pb-Free Alloys
Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies.
Materials Tech
Ask the Experts
Solder Paste Past Shelf Life
We have some solder paste that has been in a sealed box at 4 degree Celsius for more than 8 months. The shelf life is 6 months. Can it be used?
Ask the Experts
Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
In this work, a new halogen-free no-clean flux solder paste been developed. It exhibited ultra-low voiding and virtually zero solder beading performance.
Materials Tech
Ask the Experts
Solder Paste Alloy Check
We accidentally assembled boards using lead-free paste. Is there an easy method to check which paste has been used?
Ask the Experts
Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging
Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging
This paper presents harsh environment reliability test results for lead-free solder pastes with and without the presence of a variety of dopant elements.
Materials Tech
Pressure-Less Silver Sintering Pastes for Low Porosity Joint and Large Die
Pressure-Less Silver Sintering Pastes for Low Porosity Joint and Large Die
Under pressure-less sintering conditions silver sintering pastes for different sized die attachment to form robust silver joints have been developed.
Materials Tech
Microstructure and Reliability of Low AG/Bi Solder Alloys
Microstructure and Reliability of Low AG/Bi Solder Alloys
The goal of this study was to provide a screening experiment for three alloys Bi-containing, Low (or no) Ag as alternatives to SAC305.
Analysis Lab
Ask the Experts
Extending Shelf Life for Jars of Solder Paste
We have a few unopened jars of solder paste that have gone past the posted expiration date. The jars have been kept in refrigeration. We would like extend the shelf life.
Ask the Experts
Effect of Reflow Profiling on Solder Paste Flux Residues
Effect of Reflow Profiling on Solder Paste Flux Residues
Paper studied the effect of reflow profiling on the electrical reliability of no-clean flux residues using surface insulation resistance testing.
Production Floor
Solders, Fluxes, Pastes << Page 1 of 14 >>