Electronics Assembly Knowledge, Vision & Wisdom
Solders, Fluxes, Pastes << Page 1 of 15 >>
These programs cover solders, alloys, fluxes, solder pastes and more.

Programs are sorted by published date, most recent first.
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Effect of Process Changes and Flux on Mid-Chip Solder Balling
Effect of Process Changes and Flux on Mid-Chip Solder Balling
Paper documents experimental work performed to understand the impact on mid-chip solder balling from the manufacturing process and flux chemistry.
Production Floor
Study on Solder Joint Reliability of Fine Pitch CSP
Study on Solder Joint Reliability of Fine Pitch CSP
In the future more fine pitch CSP components will be required. However, product reliability has been a big challenge with the fine pitch CSPs.
Analysis Lab
Ask the Experts
Solder Paste Viscosity
What key factors affect solder paste viscosity? Assuming we only focus on the powder, will more fine powders increase the paste viscosity or the reverse?
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Reliability of Lead-Free LGAs and BGAs
Reliability of Lead-Free LGAs and BGAs
A theory is proposed that substantial differences in SAC305 solder joint Sn grain morphology may explain, at least partially.
Analysis Lab
Screening of Lower Melting Point Pb-Free Alloys
Screening of Lower Melting Point Pb-Free Alloys
Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies.
Materials Tech
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Solder Paste Mixing
How can we confirm that our centrifuge machine is properly mixing jars of solder paste to give us the results as per the standard requirement?
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Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
In this work, a new halogen-free no-clean flux solder paste been developed. It exhibited ultra-low voiding and virtually zero solder beading performance.
Materials Tech
Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging
Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging
This paper presents harsh environment reliability test results for lead-free solder pastes with and without the presence of a variety of dopant elements.
Materials Tech
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Using Solder Paste Beyond the Expiration Date
We used a water soluble paste beyond the expiration date and are seeing a white powder residue. Is it because of the expiration date?
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Pressure-Less Silver Sintering Pastes for Low Porosity Joint and Large Die
Pressure-Less Silver Sintering Pastes for Low Porosity Joint and Large Die
Under pressure-less sintering conditions silver sintering pastes for different sized die attachment to form robust silver joints have been developed.
Materials Tech
Solders, Fluxes, Pastes << Page 1 of 15 >>