Materials Tech



Materials Tech
Adhesives, Cleaning, Coatings, Design, Embedded Technology, Finishes, Flex Circuits, Flip Chip, Flux, Solder, Solder Mask, Solder Paste
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DFX on High Density Assemblies
DFX on High Density Assemblies
This paper discusses selection of solder paste based on end product and the need to conduct proper root cause analyses before making any material changes.
Materials Tech

Screening of Lower Melting Point Pb-Free Alloys
Screening of Lower Melting Point Pb-Free Alloys
Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies.
Materials Tech

Reliability of Copper, Gold, Silver and PCC Wirebonds Under Sustained Operation
Reliability of Copper, Gold, Silver and PCC Wirebonds Under Sustained Operation
In this paper, a detailed study of the electrical and mechanical degradation of wirebonds under high temperature exposure is presented.
Materials Tech

Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
In this work, a new halogen-free no-clean flux solder paste been developed. It exhibited ultra-low voiding and virtually zero solder beading performance.
Materials Tech

A Novel Conformal Back-Up Material
A Novel Conformal Back-Up Material
Paper presents a new technology and process in mechanical drill backing material designed to be used in rigid multilayer, rigid-flex and flex circuits.
Materials Tech

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