Electronics Assembly Knowledge, Vision & Wisdom
Materials Tech << Page 1 of 17 >>
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.

Programs are sorted by published date, most recent first.
Directory Search        


Program Search        
Improved Reliability of Jet Dispensable Polymeric Coating Material
Improved Reliability of Jet Dispensable Polymeric Coating Material
The study compares a paste that barely passes SIR at 85C/85RH with polymeric coating material, Silicone conformal coating, and acrylic conformal coating.
Materials Tech
Solder Joint Embrittlement Mechanisms, Solutions and Standards
Solder Joint Embrittlement Mechanisms, Solutions and Standards
The paper describes four case studies of solder joint embrittlement, three with Sn63Pb37 and one with SnAg3.7 solder alloy.
Materials Tech
pH neutral Cleaning Agents - Market Expectation & Field Performance
pH neutral Cleaning Agents - Market Expectation & Field Performance
Study reviews performance of pH neutral cleaning agents compared to alkaline cleaning alternatives and includes field data.
Materials Tech
Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
This paper focuses on the surface insulation resistance (SIR) differences between rosin-containing and rosin-free flux formulations.
Materials Tech
RF Capacitor Material for Use in Printed Circuit Board
RF Capacitor Material for Use in Printed Circuit Board
A novel ceramic-functional-particle-filled polymer composite material has been developed for use either discrete elements on the PCBs.
Materials Tech
Embedding Passive and Active Components: PCB Design and Fabrication
Embedding Passive and Active Components: PCB Design and Fabrication
This paper focuses on six basic embedded component structure designs described in IPC-7092.
Materials Tech
Advanced Thermal Management for High Power Applications
Advanced Thermal Management for High Power Applications
This paper gives a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs.
Materials Tech
Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump
Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump
The research objective is to estimate metallurgical and mechanical properties of low alpha solder. Cu-filling property to TSV was also investigated.
Materials Tech
Fill the Void
Fill the Void
Several methods of minimizing voids are presented. Printing solder paste with gas escape routes is an excellent way to reduce voiding.
Materials Tech
Flexible Circuit Materials for High Temperature Applications
Flexible Circuit Materials for High Temperature Applications
This paper reports on various flexible materials with recommendations for the best flexible materials for high temperature applications.
Materials Tech
Materials Tech << Page 1 of 17 >>