Electronics Assembly Knowledge, Vision & Wisdom
Materials Tech << Page 1 of 17 >>
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.

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Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications.
Materials Tech
Three Dimensional Integration Focusing on Device Embedded Substrate
Three Dimensional Integration Focusing on Device Embedded Substrate
In this paper, EDA tools, TEG chips, and several evaluation equipment developed in Fukuoka are explained.
Materials Tech
How to Protect Internal Circuitry from a Harsh Environment
How to Protect Internal Circuitry from a Harsh Environment
Paper discusses developments in conformal coating for increased reliability at a lower cost for high production volume devices.
Materials Tech
Micro Trace Resistive Technology
Micro Trace Resistive Technology
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide.
Materials Tech
Evaluating Rinsing Effectiveness in Spray-In-Air Cleaners
Evaluating Rinsing Effectiveness in Spray-In-Air Cleaners
This study was designed to investigate the efficiency of the rinse cycle using both a spray-in-air batch and inline
cleaner.
Materials Tech
FEA and Analysis for BGA-CGA Assemblies Under Thermal Cycling
In high-reliability applications ball grid array versions are used because of technology availability, lower cost, and lower CTE mismatches.
Materials Tech
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging.
Materials Tech
Screening of Lower Melting Point Pb-Free Alloys
Screening of Lower Melting Point Pb-Free Alloys
Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies.
Materials Tech
Nanomaterials Performance Advantages
Nanomaterials Performance Advantages
Low temperature reactivity, reaction speeds, flexibility and fine pitch considerations dictate that nanomaterials be given serious consideration.
Materials Tech
Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
In this work, a new halogen-free no-clean flux solder paste been developed. It exhibited ultra-low voiding and virtually zero solder beading performance.
Materials Tech
Materials Tech << Page 1 of 17 >>