Electronics Assembly Knowledge, Vision & Wisdom
Materials Tech << Page 1 of 15 >>
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.

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Hot Air Solder Leveling in the Lead-free Era
Hot Air Solder Leveling in the Lead-free Era
Paper discusses best practice for lead-free HASL lines and the properties expected with a properly applied HASL finish.
Materials Tech
Gold Stud Bump Flip Chip Attachment
Gold Stud Bump Flip Chip Attachment
Flip chip bonding is a desirable attachment approach for minimizing size. This paper compares immersion and auto catalytic gold plating processes.
Materials Tech
Alternative Solvent with Low Global Warming Potential
Alternative Solvent with Low Global Warming Potential
A new low global warming potential fluorinated solvent for precision cleaning is discussed. The paper covers the properties and performance.
Materials Tech
Lead-free Development in Server Applications
Lead-free Development in Server Applications
Paper examines the effects of varying surface finishes, process parameters and interactions that affect solder attach attributes.
Materials Tech
HCFC-225 Phaseout, What Now?
HCFC-225 Phaseout, What Now?
The use restrictions on HCFC-225 are in effect throughout the US. This paper discusses the options for assemblers and component manufacturers.
Materials Tech
When Precision is Not Good Enough
When Precision is Not Good Enough
Papers shows that variations in pcb design cannot be accounted for by look up tables and a more complex model is required.
Materials Tech
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
This paper gives an overview of which circuit material properties are important to mmWave frequency applications using PCBs.
Materials Tech
Elimination of Whiskers from Electroplated Tin
Elimination of Whiskers from Electroplated Tin
Paper covers data to show the effect of two approaches on the dissipation of the stress, resulting from intermetallic compound formation.
Materials Tech
Evaluation of Lead-free Solder Pastes
Evaluation of Lead-free Solder Pastes
This paper discusses the strategy and methodology for selecting a good lead-free solder paste material for volume manufacturing uses.
Materials Tech
Flip Chip Package Qualification
Flip Chip Package Qualification
Paper reviews solder interconnects on interposer substrates, X-ray and cross-sectional analysis of packages and process optimization efforts to improve reliability.
Materials Tech
Materials Tech << Page 1 of 15 >>
 
 
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