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This paper reports on various flexible materials with recommendations for the best flexible materials for high temperature applications. Materials Tech
This paper presents the development of a new liquid flux. Laboratory and beta-site test results for existing fluxes are compared to this new flux. Materials Tech
Materials Informatics is one of the hottest technologies because of its potential to reduce the time and costs of discovering innovative materials. Materials Tech
Reflectivity as a metric to quantify "shininess" is presented. An approach to quantifying "Reflectivity" of solder alloy joints has been developed. Materials Tech
In this stydy, nanoparticles were functionalized to bind them to the polymer structure while avoiding the collection among the particles. Materials Tech
Paper on the properties of solder paste release and the effects of surface free energy that make up the stencil printing process. Materials Tech
This paper details a water-soluble lead-free solder paste that has improved voiding performance and washability over previous generations of solder paste. Materials Tech
High-Ag, low-Ag: Which alloy fits best certain application? Here we present a report on the thermal and mechanical reliability of alloys. Materials Tech
This study focuses on the changes in melting and solidification behavior of near-eutectic Sn-Bi alloys with Sb (0.5-2wt%) and Ag (0-1wt%) additions. Materials Tech
Achieving optimum high-frequency PCB performance is not only the best possible PCB material, but can be impacted by PCB fabrication practices. Materials Tech |
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