Electronics Assembly Knowledge, Vision & Wisdom
Materials Tech
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Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more. Programs are sorted by published date, most recent first.


Development and Testing of a Lead-Free Low Melting Point Alloy
Development and Testing of a Lead-Free Low Melting Point Alloy
This paper describes the development and testing procedure of a new lead-free low melting point alloy.
Materials Tech

Evaluation and Qualification of Reworkable Underfill Materials
Evaluation and Qualification of Reworkable Underfill Materials
Study investigates, evaluates and qualifies reworkable underfill materials for BGAs, Leadless devices, QFNs, and other devices to improve reliability.
Materials Tech

Essential Tools to Combat the Ingress of Counterfeit Materials
Essential Tools to Combat the Ingress of Counterfeit Materials
The tools to ensure that counterfeits are not polluting any given supply chain have not kept pace with the changing needs.
Materials Tech

Insertion Loss Comparisons of High Frequency PCBs
Insertion Loss Comparisons of High Frequency PCBs
PCBs have been used for many years in low loss, high frequency microwave applications and many have become increasingly complex.
Materials Tech

Behavior of Materials in the Manufacturing Environment
Behavior of Materials in the Manufacturing Environment
This document shows the effect of Dk and Df values from 10GHz to 20GHz and also shows their performance for lead-free assembly.
Materials Tech

The Role of Organic Amines in Soldering Materials
The Role of Organic Amines in Soldering Materials
Paper shows that tests can be developed to characterize fundamental properties of activator packages that directly impact performance.
Materials Tech

Meeting Future Stencil Printing Challenges with Ultrafine Powder Pastes
Meeting Future Stencil Printing Challenges with Ultrafine Powder Pastes
Paper provides a comparison of the transfer efficiency of solder powder particle sizes with post reflow results in optimal and harsh conditions.
Materials Tech

Exploring the Reliability Limits for Silicone Adhesives
Exploring the Reliability Limits for Silicone Adhesives
Paper determines "life expectancies" as well as an extrapolated estimate of the Underwriter's Laboratories' "continuous use" temperature rating.
Materials Tech

Endocrine Disrupting Chemicals and Bioaccumulative Substances
Endocrine Disrupting Chemicals and Bioaccumulative Substances
The re-classification and regulation of EDCs and bioaccumulative substances is expected to multiply the number of materials that will require control or replacement.
Materials Tech

Ultrathin Fluoropolymer Coatings to Mitigate PCB Damage
Ultrathin Fluoropolymer Coatings to Mitigate PCB Damage
Ultra-thin fluoropolymer coatings were tested by industry approved test methods to determine whether this level of process was possible.
Materials Tech

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