Electronics Assembly Knowledge, Vision & Wisdom
Materials Tech << Page 1 of 17 >>
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.

Programs are sorted by published date, most recent first.
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Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste
The miniaturization trend is driving components with large pads. To alleviate the voiding challenge, a voiding-free solder paste will be the solution.
Materials Tech
Tools and Techniques for Material Assessment in Advanced Technologies
Tools and Techniques for Material Assessment in Advanced Technologies
Paper identifies limitations in the methods used for evaluating solders, circuit board materials and surface finishes.
Materials Tech
High Reliability, Stress-free Copper Deposit
High Reliability, Stress-free Copper Deposit
To overcome the challenge of metallizing smooth surfaces, a new stress-free electroless copper was developed to serve this important sector.
Materials Tech
Reliability of Fine Pitch Flip Chip BGA Packages for Automotive Applications
Reliability of Fine Pitch Flip Chip BGA Packages for Automotive Applications
The board level reliability of different FCBGA packages was evaluated in the automotive thermal cycling environment.
Materials Tech
NanoCopper Based Solder-free Electronic Assembly
NanoCopper Based Solder-free Electronic Assembly
This paper explores a nanotechnology enabled copper-based electrical interconnect material that can be processed around 200 degrees.
Materials Tech
Material Selection for Reliable TMV Pop Assembly
Material Selection for Reliable TMV Pop Assembly
This paper investigates selected aspects of the above mentioned processes to better understand the critical factors associated with successful TMV PoP assembly.
Materials Tech
Superior Thermal Cycling Reliability of PB-Free Solder Alloy
Superior Thermal Cycling Reliability of PB-Free Solder Alloy
Alternative solders meet stringent environmental regulations, requirements for greater mechanical reliability, and high temperature service environments.
Materials Tech
Embedded Passive Technology
Embedded Passive Technology
This paper summarizes the selection of resistor embedded materials, evaluations of resistive material and duplication of a complex digital design.
Materials Tech
Ultra Low Profile Copper Foil for Very Low Loss Material
Ultra Low Profile Copper Foil for Very Low Loss Material
A new almost no profile copper foil has been developed to achieve this property while maintaining a good adhesion with low loss resins.
Materials Tech
Flux for Cleanable and No-Clean Solder Pastes
Flux for Cleanable and No-Clean Solder Pastes
Paper provides a description of flux and the role of their constituting ingredients and a tin-bismuth-silver solder paste with cleanable residues.
Materials Tech
Materials Tech << Page 1 of 17 >>