Electronics Assembly Knowledge, Vision & Wisdom
Materials Tech << Page 1 of 16 >>
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.

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Embedded Passive Technology
Embedded Passive Technology
This paper summarizes the selection of resistor embedded materials, evaluations of resistive material and duplication of a complex digital design.
Materials Tech
NanoCopper Based Solder-free Electronic Assembly
NanoCopper Based Solder-free Electronic Assembly
This paper explores a nanotechnology enabled copper-based electrical interconnect material that can be processed around 200 degrees.
Materials Tech
Flux for Cleanable and No-Clean Solder Pastes
Flux for Cleanable and No-Clean Solder Pastes
Paper provides a description of flux and the role of their constituting ingredients and a tin-bismuth-silver solder paste with cleanable residues.
Materials Tech
Hi Pot Dielectic Breakdown
Hi Pot Dielectic Breakdown
How the Electrical Test industry combats requirements and provides solutions to adhere to ever changing requirements is discussed.
Materials Tech
Measuring Conformal Coating Adhesion
Measuring Conformal Coating Adhesion
Coating adhesion has been a difficult property to measure. This paper reviews a new tape peel test that can be applied to the PCB or component surface.
Materials Tech
Lower Temperature Solder Joint Encapsulant
Lower Temperature Solder Joint Encapsulant
The strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved.
Materials Tech
Thermally, Electrically Conductive Adhesive to Control Heat in PCBs
Thermally, Electrically Conductive Adhesive to Control Heat in PCBs
Study illustrates the complexity of achieving optimum thermal and electrical performance with any circuit, especially at higher frequencies.
Materials Tech
Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste
Improved Flux Reliability of Lead-Free Solder Alloy Solder Paste
This paper covers a type of 'crack free' flux paste designed to inhibit cracking under extreme environments. Includes electro-chemical migration tests dew .
Materials Tech
Solder Fortification with Preforms
Solder Fortification with Preforms
PIP is not always possible to print enough paste to obtain an acceptable joint. This paper covers techniques using solder performs.
Materials Tech
Three Dimensional Integration Focusing on Device Embedded Substrate
Three Dimensional Integration Focusing on Device Embedded Substrate
In this paper, EDA tools, TEG chips, and several evaluation equipment developed in Fukuoka are explained.
Materials Tech
Materials Tech << Page 1 of 16 >>