Electronics Assembly Knowledge, Vision & Wisdom
Materials Tech << Page 1 of 16 >>
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.

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Printable Materials for Electronic Packaging
Printable Materials for Electronic Packaging
This paper reports on novel printable materials that have the potential to surpass conventional materials.
Materials Tech
Behavior of Materials in the Manufacturing Environment
Behavior of Materials in the Manufacturing Environment
This document shows the effect of Dk and Df values from 10GHz to 20GHz and also shows their performance for lead-free assembly.
Materials Tech
Low Surface Energy Coatings Rewrite Area Ratio Rules
Low Surface Energy Coatings Rewrite Area Ratio Rules
Paper on the properties of solder paste release and the effects of surface free energy that make up the stencil printing process.
Materials Tech
Effect of Lead-Free on Key Material Properties
Effect of Lead-Free on Key Material Properties
Paper includes study of 14 laminate materials to assess the effects of lead free soldering on various properties.
Materials Tech
Solder Joint Embrittlement Mechanisms, Solutions and Standards
Solder Joint Embrittlement Mechanisms, Solutions and Standards
The paper describes four case studies of solder joint embrittlement, three with Sn63Pb37 and one with SnAg3.7 solder alloy.
Materials Tech
Suitable Flux Medium for Cleanable and No-Clean Solder Pastes
This paper presents two concrete studies. Development steps will be validated by standardized tests, home-made testing, and industrial evaluations.
Materials Tech
The Universal PCB Design Grid System
The Universal PCB Design Grid System
Paper reviews reviews one of the single most important aspects of the electronics industry - The PCB Design Grid System.
Materials Tech
3 Steps To Solder Paste Selection
3 Steps To Solder Paste Selection
This paper covers the most significant issues in solder paste selection to meet the goals of manufacturing.
Materials Tech
Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
Rosin vs. Non-Rosin Wave Flux? - More Reliable Electronic Assemblies
This paper focuses on the surface insulation resistance (SIR) differences between rosin-containing and rosin-free flux formulations.
Materials Tech
Embedding Passive and Active Components: PCB Design and Fabrication
Embedding Passive and Active Components: PCB Design and Fabrication
This paper focuses on six basic embedded component structure designs described in IPC-7092.
Materials Tech
Materials Tech << Page 1 of 16 >>
 
 
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