Electronics Assembly Knowledge, Vision & Wisdom
Materials Tech
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Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more. Programs are sorted by published date, most recent first.


High Performance Light and Moisture Dual Curable Encapsulant
High Performance Light and Moisture Dual Curable Encapsulant
This study is focused on liquid glop top encapsulants that are placed over the PCB components and wire bonds as a protective layer.
Materials Tech

Alternatives to Solder in Packaging and Assembly
Alternatives to Solder in Packaging and Assembly
This presentation surveys the landscape of alternatives to solder in interconnect, packaging, and assembly.
Materials Tech

Atmospheric Plasma Surface Engineering of Printed Circuit Boards:  A Novel Method to Improve the Adhesion of Conformal Coatings
Atmospheric Plasma Surface Engineering of Printed Circuit Boards: A Novel Method to Improve the Adhesion of Conformal Coatings
Plasma treatment is a novel method to increase the adhesion strength of the conformal protective coatings to PCBs through the removal of residual organic contaminants and surface activation.
Materials Tech

ENEPIG - How the Process Characteristics Influence the Layer Performance  Britta Schafsteller
ENEPIG - How the Process Characteristics Influence the Layer Performance Britta Schafsteller
This paper will focus on the comparison of pure Pd and PdP deposits and the interaction with the gold electrolyte type in use.
Materials Tech

Design and Fabrication of Ultra-Thin Flexible Substrate
Design and Fabrication of Ultra-Thin Flexible Substrate
This study focuses on an approach based on the use of a polyimide substrate for 2.5D/3D ultra-thin packaging applications.
Materials Tech

Microalloyed Sn-Cu Pb-Free Solder for High Temp
Microalloyed Sn-Cu Pb-Free Solder for High Temp
While susceptibility to tin whisker growth remains a barrier to the transition to Pb-free, there is now general acceptance that there are reliable alternatives.
Materials Tech

Nano Silver Replacement for High Lead Solders
Nano Silver Replacement for High Lead Solders
This paper details mechanical and reliability testing of joints made with materials under a range of temperature, pressure and atmosphere.
Materials Tech

Circuit Material Performance for PCBs at Millimeter Wave Frequencies
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
This paper gives an overview of which circuit material properties are important to mmWave frequency applications using PCBs.
Materials Tech

Optimizing Insulated Metal Substrate Application
Optimizing Insulated Metal Substrate Application
The growth in insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application.
Materials Tech

Material Selection and Optimization for TMV PoP
Material Selection and Optimization for TMV PoP
Materials selection and parameter optimization to better understand the critical factors with successful TMV PoP assembly are investigated.
Materials Tech

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