Electronics Assembly Knowledge, Vision & Wisdom
Materials Tech
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Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more. Programs are sorted by published date, most recent first.


Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging.
Materials Tech

Micro Trace Resistive Technology
Micro Trace Resistive Technology
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide.
Materials Tech

Nanomaterials Performance Advantages
Nanomaterials Performance Advantages
Low temperature reactivity, reaction speeds, flexibility and fine pitch considerations dictate that nanomaterials be given serious consideration.
Materials Tech

FEA and Analysis for BGA-CGA Assemblies Under Thermal Cycling
In high-reliability applications ball grid array versions are used because of technology availability, lower cost, and lower CTE mismatches.
Materials Tech

The Importance of Conformal Coating Thickness and Edge Coverage
The Importance of Conformal Coating Thickness and Edge Coverage
The performance of new silicone and urethane materials, designed for coverage and thickness, is compared with an acrylic and ultra-thin material.
Materials Tech

Screening of Lower Melting Point Pb-Free Alloys
Screening of Lower Melting Point Pb-Free Alloys
Program explores the manufacturability and reliability for Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies.
Materials Tech

DFX on High Density Assemblies
DFX on High Density Assemblies
This paper discusses selection of solder paste based on end product and the need to conduct proper root cause analyses before making any material changes.
Materials Tech

Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads
In this work, a new halogen-free no-clean flux solder paste been developed. It exhibited ultra-low voiding and virtually zero solder beading performance.
Materials Tech

Comparison of Reliability of Copper, Gold, Silver and PCC Wirebonds Under Sustained Operation
Comparison of Reliability of Copper, Gold, Silver and PCC Wirebonds Under Sustained Operation
In this paper, a detailed study of the electrical and mechanical degradation of wirebonds under high temperature exposure is presented.
Materials Tech

Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging
Reliability of Doped Lead-Free Solder Joints Under Isothermal Aging
This paper presents harsh environment reliability test results for lead-free solder pastes with and without the presence of a variety of dopant elements.
Materials Tech

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