Electronics Assembly Knowledge, Vision & Wisdom
Materials Tech << Page 1 of 16 >>
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.

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Reliability Improvements by the Creation of Intermetallic Connections
Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech
Insulation Resistance of Dielectric Materials
Insulation Resistance of Dielectric Materials
This investigation measures the leakage current within internal PCB layers during exposure of various specimens to a controlled ground-based test environment.
Materials Tech
Board Performance after Pb-Free Reflow
Board Performance after Pb-Free Reflow
This paper will focus on air-air thermal cycling, IST testing and material survivability after lead-free assembly reflow.
Materials Tech
Digitally Printed Battery Design
Digitally Printed Battery Design
Battery operated devices have grown smaller while energy demands have increased. This paper provides a review of battery construction.
Materials Tech
Emerging Substrate Technologies
Emerging Substrate Technologies
This paper outlines the market dynamics driving the development of advanced substrates in today's industry landscape.
Materials Tech
Embedded Packaging Technologies
Embedded Packaging Technologies
Paper covers the design, packaging processes, and technology demonstrations of prototypes packaged using embedded technology.
Materials Tech
Pb-Free Alloy Alternatives
Pb-Free Alloy Alternatives
This paper compares solder compositions and micro alloyed SAC solders in terms of assembly and mechanical/thermal fatigue properties.
Materials Tech
Stencil Design Improves Drop Test Performance
Stencil Design Improves Drop Test Performance
Paper evaluates the influence of stencil printed solder volume on electronic component lifetime in mechanical stress testing.
Materials Tech
Next Generation PoP Pastes
Next Generation PoP Pastes
This paper highlights some of the differences between traditional solder pastes and PoP solder pastes.
Materials Tech
Second Generation Pb-Free Alloys
Second Generation Pb-Free Alloys
Paper covers shortcomings of current alloys, namely SAC305, and presents data for various new alloys which show promise as replacement materials.
Materials Tech
Materials Tech << Page 1 of 16 >>
 
 
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