Electronics Assembly Knowledge, Vision & Wisdom
Materials Tech << Page 1 of 17 >>
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.

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HCFC-225 Phaseout, What Now?
HCFC-225 Phaseout, What Now?
The use restrictions on HCFC-225 are in effect throughout the US. This paper discusses the options for assemblers and component manufacturers.
Materials Tech
Semi-Additive Process for High Frequency Signal Substrates
Semi-Additive Process for High Frequency Signal Substrates
This paper covers a new SAP process for low loss build-up materials with low desmear roughness and excellent adhesion at various processing conditions.
Materials Tech
Dielectrics for Embedding Active and Passive Components
Dielectrics for Embedding Active and Passive Components
This paper presents a composite type material that can be used as dielectric for the embedding of actives and passives.
Materials Tech
Alternatives to Solder in Packaging and Assembly
Alternatives to Solder in Packaging and Assembly
This presentation surveys the landscape of alternatives to solder in interconnect, packaging, and assembly.
Materials Tech
Microalloyed Sn-Cu Pb-Free Solder for High Temp
Microalloyed Sn-Cu Pb-Free Solder for High Temp
While susceptibility to tin whisker growth remains a barrier to the transition to Pb-free, there is now general acceptance that there are reliable alternatives.
Materials Tech
Design and Fabrication of Ultra-Thin Flexible Substrate
Design and Fabrication of Ultra-Thin Flexible Substrate
This study focuses on an approach based on the use of a polyimide substrate for 2.5D/3D ultra-thin packaging applications.
Materials Tech
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
Circuit Material Performance for PCBs at Millimeter Wave Frequencies
This paper gives an overview of which circuit material properties are important to mmWave frequency applications using PCBs.
Materials Tech
Nano Silver Replacement for High Lead Solders
Nano Silver Replacement for High Lead Solders
This paper details mechanical and reliability testing of joints made with materials under a range of temperature, pressure and atmosphere.
Materials Tech
Material Selection and Optimization for TMV PoP
Material Selection and Optimization for TMV PoP
Materials selection and parameter optimization to better understand the critical factors with successful TMV PoP assembly are investigated.
Materials Tech
Optimizing Insulated Metal Substrate Application
Optimizing Insulated Metal Substrate Application
The growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application.
Materials Tech
Materials Tech << Page 1 of 17 >>