Electronics Assembly Knowledge, Vision & Wisdom
Materials Tech
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Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more. Programs are sorted by published date, most recent first.


New-Generation, Low-Temperature Lead-Free Solder
New-Generation, Low-Temperature Lead-Free Solder
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech

Reliability Improvements by the Creation of Intermetallic Connections
Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech

New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly
New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech

Embedded Components: A Comparative Analysis of Reliability
Embedded Components: A Comparative Analysis of Reliability
Paper covers a series of comparative analyses, testing the reliability of standard SMT components vs their embedded counterparts.
Materials Tech

New High-Performance Organophosphorus Flame Retardant
New High-Performance Organophosphorus Flame Retardant
A non-halogen flame retardant has been developed for high performance applications. Resin performance data are presented.
Materials Tech

Digitally Printed Battery Design
Digitally Printed Battery Design
Battery operated devices have grown smaller while energy demands have increased. This paper provides a review of battery construction.
Materials Tech

Lead-Free Alloys with Ultra-High Thermo-Mechanical Reliability
Lead-Free Alloys with Ultra-High Thermo-Mechanical Reliability
Alpha focused on improving the properties of the bulk solder as well as controlled growth of interfacial IMCs and alloy microstructure.
Materials Tech

Characterization of Solder Pastes Based on Two Alternative Alloys
Characterization of Solder Pastes Based on Two Alternative Alloys
Characteristics of alloys, the development of flux media, solder pastes performance and solder joint reliability are discussed.
Materials Tech

Designing a High Performance Electroless Nickel and Immersion Gold
Designing a High Performance Electroless Nickel and Immersion Gold
It was the goal of this paper to overcome myths and misunderstandings within the PCB manufacturing environment regarding the HP ENIG finish.
Materials Tech

Low Temperature Solder Alloys for Portable Electronics
Low Temperature Solder Alloys for Portable Electronics
This paper discusses low temperature Pb-free alloys, which are capable of delivering high reliability performance at low soldering temperatures.
Materials Tech

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