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Materials Tech << Page 1 of 15 >>
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.

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Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Paper presents the reliability of LGA components assembled with tin-lead solder onto PCBs with an ENEPIG finish and subjected to thermal cycling and aging.
Materials Tech
Comparison of SAC105 and SAC305 Solders
Comparison of SAC105 and SAC305 Solders
In this paper, the thermal fatigue performance under accelerated test conditions is compared for three common BGA ball alloys.
Materials Tech
New Phosphorus-based Curing Agents for PWB
New Phosphorus-based Curing Agents for PWB
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials.
Materials Tech
Nanomaterials Performance Advantages
Nanomaterials Performance Advantages
Low temperature reactivity, reaction speeds, flexibility and fine pitch considerations dictate that nanomaterials be given serious consideration.
Materials Tech
Printed Circuit Structures, the Evolution of Printed Circuit Boards
Printed Circuit Structures, the Evolution of Printed Circuit Boards
The PCS concept will allow passives, actives and even antennas to move out of the XY plane and into the XZ and YZ planes.
Materials Tech
Reducing Defects with Embedded Sensing
Reducing Defects with Embedded Sensing
This paper covers sensing technologies to guarantee that only good PCBs pass the assembly process, reducing rework and improving efficiency.
Materials Tech
Insertion Loss Comparisons of High Frequency PCBs
Insertion Loss Comparisons of High Frequency PCBs
PCBs have been used for many years in low loss, high frequency microwave applications and many have become increasingly complex.
Materials Tech
Improve Etching Performance
Improve Etching Performance
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil.
Materials Tech
No-Clean Flux Residue and Underfill Compatibility
No-Clean Flux Residue and Underfill Compatibility
This paper covers an experiment designed to measure the electrical reliability of various combinations of underfill and no-clean flux residues.
Materials Tech
A Novel Conformal Back-Up Material
A Novel Conformal Back-Up Material
Paper presents a new technology and process in mechanical drill backing material designed to be used in rigid multilayer, rigid-flex and flex circuits.
Materials Tech
Materials Tech << Page 1 of 15 >>