Electronics Assembly Knowledge, Vision & Wisdom
Materials Tech << Page 1 of 16 >>
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.

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Lead-free Board Materials Reliability Project
Lead-free Board Materials Reliability Project
Paper covers results from 20 laminate materials. Relationship between moisture uptake and material survivability reflow is discussed.
Materials Tech
Predictability for PCB Layout Density
Predictability for PCB Layout Density
This paper covers the use of a new tool called a "Predictability Calculator" to predict PCB layout density.
Materials Tech
Reliability of Multiple Pb-free Solder Ball Alloys
Reliability of Multiple Pb-free Solder Ball Alloys
Paper covers a screening experiment to obtain data comparing thermal fatigue reliability of the various solder ball alloys.
Materials Tech
Low-Cost & High Performance Silicon Interposers
Low-Cost & High Performance Silicon Interposers
The Low-Cost Silicon Interposer industry consortium addresses limitations of organic packages as well as wafer-based silicon interposers.
Materials Tech
Best Practices for Controlling Moisture in PCBs
Best Practices for Controlling Moisture in PCBs
Paper provides info of moisture diffusion processes, governing models, and dependent variables.
Materials Tech
Processing and Reliability of Low Silver Alloys
Processing and Reliability of Low Silver Alloys
Paper reviews processing and reliability concerns for low silver solder alloys.
Materials Tech
Improving properties of a Lead-free Solder Alloy with Doping of Copper
Improving properties of a Lead-free Solder Alloy with Doping of Copper
This paper reviews 3 lead-free solder alloys to assess the mechanical and thermal cycle properties by implementing drop tests and thermal cycle tests.
Materials Tech
A New PCB Surface Finish
A New PCB Surface Finish
Paper covers a new PCB surface finish that offers outstanding performance and excellent environmental protection.
Materials Tech
Low-temp, Tin-bismuth-silver Solder Pastes
Low-temp, Tin-bismuth-silver Solder Pastes
Staff from Koki Company and Christopher Associates Inc. collaborate on a study on bismuth usage in lead-free solder.
Materials Tech
Connector Design for Wearables
Connector Design for Wearables
Paper discusses contact physics, plating options, force requirements and trade-offs that occur when selecting a connector for an application.
Materials Tech
Materials Tech << Page 1 of 16 >>
 
 
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