Electronics Assembly Knowledge, Vision & Wisdom
Materials Tech << Page 1 of 16 >>
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.

Programs are sorted by published date, most recent first.
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High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys for Ball-Grid Array
High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys for Ball-Grid Array
High-Ag, low-Ag: Which alloy fits best certain application? Here we present a report on the thermal and mechanical reliability of alloys.
Materials Tech
Long Term Thermal Reliability of Printed Circuit Board Materials
Long Term Thermal Reliability of Printed Circuit Board Materials
This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at the company.
Materials Tech
Insulation Resistance of Dielectric Materials
Insulation Resistance of Dielectric Materials
This investigation measures the leakage current within internal PCB layers during exposure of various specimens to a controlled ground-based test environment.
Materials Tech
Reliability Improvements by the Creation of Intermetallic Connections
Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech
Digitally Printed Battery Design
Digitally Printed Battery Design
Battery operated devices have grown smaller while energy demands have increased. This paper provides a review of battery construction.
Materials Tech
New High-Performance Organophosphorus Flame Retardant
New High-Performance Organophosphorus Flame Retardant
A non-halogen flame retardant has been developed for high performance applications. Resin performance data are presented.
Materials Tech
Embedded Components: A Comparative Analysis of Reliability
Embedded Components: A Comparative Analysis of Reliability
Paper covers a series of comparative analyses, testing the reliability of standard SMT components vs their embedded counterparts.
Materials Tech
Nanocopper Based Paste for Solid Copper Via Fill
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling.
Materials Tech
Lead-Free Alloys with Ultra-High Thermo-Mechanical Reliability
Lead-Free Alloys with Ultra-High Thermo-Mechanical Reliability
Alpha focused on improving the properties of the bulk solder as well as controlled growth of interfacial IMCs and alloy microstructure.
Materials Tech
Signal Transmission Loss Due to Surface Roughness
Signal Transmission Loss Due to Surface Roughness
In this research, parameters of various types of transmission line structures on an evaluation board were measured and analyzed in detail.
Materials Tech
Materials Tech << Page 1 of 16 >>