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Paper provides a description of flux and the role of their constituting ingredients and a tin-bismuth-silver solder paste with cleanable residues. Materials Tech
Aggressive form factors, reducing pitch, thinner packages, and larger die to package ratios are leading to higher package warpage during SMT reflow. Materials Tech
Two solder paste chemistries and several printing parameters were evaluated in order to achieve consistent solder paste deposition across the assembly. Materials Tech
How the Electrical Test industry combats requirements and provides solutions to adhere to ever changing requirements is discussed. Materials Tech
This study offers a better understanding of the correlation between rheological properties and shelf life of solder paste exposed to extreme conditions. Materials Tech
This paper covers a type of 'crack free' flux paste designed to inhibit cracking under extreme environments. Includes electro-chemical migration tests dew ... Materials Tech
This study focused on the thermal fatigue performance and the microstructural evolution of five lead-free solders under harsh service conditions. Materials Tech
The strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved. Materials Tech
This paper reports results of the behaviour of Sb in a Sn-Bi alloy and consider the implications of the findings for the reliability of LTS solder joints. Materials Tech
This paper discusses the need for low-temperature solders and process-ability of solder pastes with three novel alloys against the industry standard. Materials Tech |
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