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Materials Tech
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Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more. Programs are sorted by published date, most recent first.


Insulation Resistance of Dielectric Materials
Insulation Resistance of Dielectric Materials
This investigation measures the leakage within internal PCB layers during exposure of various specimens to a controlled ground-based test environment.
Materials Tech

Investigation of Copper Sinter Material for Die Attach
Investigation of Copper Sinter Material for Die Attach
3 different copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents.
Materials Tech

Long Term Thermal Reliability of Printed Circuit Board Materials
Long Term Thermal Reliability of Printed Circuit Board Materials
This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at the company.
Materials Tech

Nanocopper Based Paste for Solid Copper Via Fill
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling.
Materials Tech

Reliability Improvements by the Creation of Intermetallic Connections
Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech

New-Generation, Low-Temperature Lead-Free Solder
New-Generation, Low-Temperature Lead-Free Solder
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech

Embedded Components: A Comparative Analysis of Reliability
Embedded Components: A Comparative Analysis of Reliability
Paper covers a series of comparative analyses, testing the reliability of standard SMT components vs their embedded counterparts.
Materials Tech

New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly
New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech

Digitally Printed Battery Design
Digitally Printed Battery Design
Battery operated devices have grown smaller while energy demands have increased. This paper provides a review of battery construction.
Materials Tech

New High-Performance Organophosphorus Flame Retardant
New High-Performance Organophosphorus Flame Retardant
A non-halogen flame retardant has been developed for high performance applications. Resin performance data are presented.
Materials Tech

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