Materials Tech



Materials Tech
Adhesives, Cleaning, Coatings, Design, Embedded Technology, Finishes, Flex Circuits, Flip Chip, Flux, Solder, Solder Mask, Solder Paste
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The Effects of PCB Fabrication on High-Frequency Electrical Performance
The Effects of PCB Fabrication on High-Frequency Electrical Performance
Achieving optimum high-frequency PCB performance is not only the best possible PCB material, but can be impacted by PCB fabrication practices.
Materials Tech

High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys
High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys
High-Ag, low-Ag: Which alloy fits best certain application? Here we present a report on the thermal and mechanical reliability of alloys.
Materials Tech

Investigation of Copper Sinter Material for Die Attach
Investigation of Copper Sinter Material for Die Attach
3 copper powders were tested for their feasibility to use as die attach material for pressure sintering process without prior treatment with reducing agents.
Materials Tech

Insulation Resistance of Dielectric Materials
Insulation Resistance of Dielectric Materials
This investigation measures the leakage within internal PCB layers during exposure of various specimens to a controlled ground-based test environment.
Materials Tech

Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
The effect of micro-alloying to SAC based solder materials on component reliability was studied, considering various factors of solder paste and surface finish.
Materials Tech

Long Term Thermal Reliability of Printed Circuit Board Materials
Long Term Thermal Reliability of Printed Circuit Board Materials
This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at the company.
Materials Tech

Reliability Improvements by the Creation of Intermetallic Connections
Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech

Nanocopper Based Paste for Solid Copper Via Fill
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling.
Materials Tech

Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses.
Materials Tech

New-Generation, Low-Temperature Lead-Free Solder
New-Generation, Low-Temperature Lead-Free Solder
In this paper, the roles of additive and bismuth content will be discussed. Eutectic SnBi and three newly designed SnBi-based alloys were experimented upon.
Materials Tech

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