Electronics Assembly Knowledge, Vision & Wisdom
Test, Inspection, X-Ray
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These programs cover manual and automated test, manual and automated optical inspection, x-ray and more. Programs are sorted by published date, most recent first.


Tin Flakes/Splashes in SMT
Tin Flakes/Splashes in SMT
An increasing of electrical shorts reported in several testers was noticed. Initially, it was found than more of the 80% of the shorts corresponding to thin metal flakes/splashes.
Analysis Lab

Expanding IEEE Std 1149.1 Boundary-Scan Architecture
Expanding IEEE Std 1149.1 Boundary-Scan Architecture
This paper discusses the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects.
Production Floor

Restoration of Lead-Free Bismuth Containing Solder Joints
Restoration of Lead-Free Bismuth Containing Solder Joints
Bismuth (Bi)-containing solder alloys have emerged as prime candidates to replace traditional lead (Pb)-free alloys such as SAC 305 (Sn-3.0Ag-0.5Cu).
Analysis Lab

A Packaging Physics of Failure Based Testing Methodology
A risk assessment testing methodology built in the fundamentals of packaging physics of failure is discussed in terms of reliability tests.
Analysis Lab

On-Board Package Decapsulation Techniques for Failure Analysis
On-Board Package Decapsulation Techniques for Failure Analysis
Various on-board decapsulation techniques to remove package overmold while preserving wire bonds either gold (Au) or Copper (Cu) were evaluated.
Analysis Lab

Requirements on a Class 0 EPA - ESD Equipment and Measurements
Requirements on a Class 0 EPA - ESD Equipment and Measurements
The requirements “0 volt” can be achieved, when die maximum value will be required. Today we do not have any ESD material, which requires these limits.
Analysis Lab

Solder Paste Inspection - When and Why
Solder Paste Inspection - When and Why
Our facility is pushing us to purchase a 3D solder paste inspection system. Are these systems common and under what condition should we consider buying one?
Board Talk

Will Typical No Clean Paste Pass an SIR Test?
Will Typical No Clean Paste Pass an SIR Test?
Will a typical no clean paste pass an SIR test? Is it really clean enough for a conformal coating and 20 years of service? The Assembly Brothers, Jim Hall and Phil Zarrow, share their own experiences and insight.
Board Talk

A Standardized Reliability Evaluation Framework for Connections
A Standardized Reliability Evaluation Framework for Connections
The iNEMI Connector Reliability Test Recommendations team recommends work to define test conditions to evaluate the expected degradation of connectors under the stress levels.
Analysis Lab

Industry 4.0 for Inspection in the Electronics Industry
Industry 4.0 for Inspection in the Electronics Industry
This paper investigates how the connected at-line x-ray system can improve production yield and lower costs when connected to the production line.
Production Floor

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