Electronics Assembly Knowledge, Vision & Wisdom
Test, Inspection, X-Ray << Page 1 of 9 >>
These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.

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Early Design Review of Boundary Scan To Enhancing Testability
Early Design Review of Boundary Scan To Enhancing Testability
Paper reviews what portions of a design can be covered structurally and what are covered functionally, to provide the best diagnostics to discover faults?
Production Floor
Combination of AOI and AVI Machines
Combination of AOI and AVI Machines
AOI and AVI machines have different functions. This paper analyses the combination of AOI and AVI machines to save cost, labor and space.
Analysis Lab
Explanation of PoP Inspection Techniques
Explanation of PoP Inspection Techniques
Industry expert Bob Willis explains the three available options of x-ray, optical and process monitoring for inspection of package-on-package assemblies.
Analysis Lab
Thermal Mechanical Fatigue of a 56 I/O Quad-Flat No Lead Package
Thermal Mechanical Fatigue of a 56 I/O Quad-Flat No Lead Package
A fatigue computational model was used to predict the effects of conformal coating and underfill on solder joints between a 56 I/O plastic quad-flat and a polyimide PCB.
Analysis Lab
Numerical Study on New Pin Pull Test for Pad Cratering
Numerical Study on New Pin Pull Test for Pad Cratering
In this study a new pin pull test method with solder ball attached and positioned to the test board at a 30° was used to study the strength of pad cratering.
Analysis Lab
Ask the Experts
Test Probe Problems After Pin-In-Paste
We are having test probe contact issues with our Pin-In-Paste process. Should all the flux vaporize off in the reflow process? Any suggestions?
Ask the Experts
Pb-Free Thermal Cycle Acceleration Factors
Pb-Free Thermal Cycle Acceleration Factors
Paper discusses the calculation of acceleration factors for different Pb-free solders, comparing results with those for eutectic SnPb.
Analysis Lab
Drop Test Performance of BGA Assemblies
Drop Test Performance of BGA Assemblies
In this work, BGA solder spheres using SAC105 with 0.02% addition of Titanium were evaluated for BGA assembly drop test performance.
Analysis Lab
Expanding IEEE Std 1149.1 Boundary-Scan Architecture
Expanding IEEE Std 1149.1 Boundary-Scan Architecture
This paper discusses the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects.
Production Floor
Analysis of Voiding Under QFN Packages
Analysis of Voiding Under QFN Packages
Paper covers results of experiments on QFN devices when the ensuing voiding level was calculated by x-ray inspection.
Analysis Lab
Test, Inspection, X-Ray << Page 1 of 9 >>
 
 
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