Electronics Assembly Knowledge, Vision & Wisdom
Test, Inspection, X-Ray
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These programs cover manual and automated test, manual and automated optical inspection, x-ray and more. Programs are sorted by published date, most recent first.


Risk for Ceramic Component Cracking Dependent
Risk for Ceramic Component Cracking Dependent
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses.
Analysis Lab

Design for Testability to Overcome Functional Board Test Complexities
Design for Testability to Overcome Functional Board Test Complexities
In this paper the author reviews how Design for Testability techniques can be an effective way to reduce functional board test programming complexity.
Production Floor

Pad Crater Initiation in Shock Using Acoustic Emission Detection
Pad Crater Initiation in Shock Using Acoustic Emission Detection
Dye stain and cross section failure analysis techniques were used to identify pad crater damage and showed good agreement with the acoustic events.
Analysis Lab

Flowers of Sulfur Creep Corrosion Testing of Populated PCBs
Flowers of Sulfur Creep Corrosion Testing of Populated PCBs
Creep corrosion testing of printed circuit boards using a specially designed flowers of sulfur chamber has been pioneered by an iNEMI technical committee.
Production Floor

Second Roung Robin Evaluation of iNEMI Creep Corrosion Qualification Test
Second Roung Robin Evaluation of iNEMI Creep Corrosion Qualification Test
The paper reports the results of the iNEMI creep corrosion qualification test and compares them to the first round robin test and recent mixed-flowing gas test results.
Analysis Lab

Board Level Reliability Comparison of BGA and LGA Packages
Board Level Reliability Comparison of BGA and LGA Packages
Study compares board level reliability of BGA and LGA packages mounted with an LGA footprint. Yield, drop test and thermal performance were evaluated.
Analysis Lab

PCBA Inspection Concerns
PCBA Inspection Concerns
We inspect PCBAs on a relatively hard ESD mat. Will moving the PCBs on the mat will scratch and stress the soldered components on the bottom side?
Board Talk

AOI Capabilities Study with 03015 Components
AOI Capabilities Study with 03015 Components
Paper covers tests working with five AOI vendors to ensure successful testing of 03015 components, with emphasis on optimizing algorithm threshold settings.
Analysis Lab

Ball Pull Test Efficiency for the PCB Pad Cratering Validation
Ball Pull Test Efficiency for the PCB Pad Cratering Validation
In the study cold ball pull testing is used to validate the resistance of PCB pad cratering for different ultra-low loss dielectrics materials.
Analysis Lab

Implementing Robust Bead Probe Test Processes
Implementing Robust Bead Probe Test Processes
This paper defines a process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly.
Production Floor

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