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These programs cover manual and automated test, manual and automated optical inspection, x-ray and more. Programs are sorted by published date, most recent first.
Should We Invest in 3D Optical Inspection?
We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time? The Assembly Brothers, Jim Hall and Phil Zarrow, share their experiences and insight.
Testing of Soldering Materials vs. Soldering Processes
This paper discusses Surface Insulation Resistance (SIR) data of solder pastes and other soldering materials on IPCB-52 coupons.
SIR Test Method for Developing Evidence for the Production Assembly
The purpose of this paper is research on the development of temperature-humidity-bias instrumentation and test board designs forproduct acceptance.
Chemical Data vs Electrical Data - Which is a Better Reliability Predictor
This study looks to correlate IPC Chemical and Electrical CAF test results. The electrical testing utilized was found within the PCQR2 Database document.
The use of an available Color Sensor for Burn-In of LED Products
This system will monitor the intensity and colour changes of a product while it is running and alert the engineer of early failures allowing the test to terminate, and faults to be examined.
AXI Applications with BTC and Connectors
What is the best way to use test and inspection techniques? How does one obtain accurate AXI data and images for surface mount technology process improvement?
Stereo Vision Based Automated Solder Ball Height Detection
An automatic, stereo vision based, in-line ball height inspection method is presented. This includes an imaging setup with a computer vision algorithm.
Signal Transmission Loss Due to Surface Roughness
In this research, parameters of various types of transmission line structures on an evaluation board were measured and analyzed in detail.
Good Quality Comes From Good Design for Test
This paper discusses how to maximize the benefits of boundary scan test, with examples of how designers should select the right components.
2D X-Ray Inspection With Materials and Thickness Identification
A technology has been developed that, instead of simply measuring the total absorption of the X-ray beam, enables changes in the beam energy to be resolved.
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