Electronics Assembly Knowledge, Vision & Wisdom
Test, Inspection, X-Ray << Page 1 of 9 >>
These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.

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What is Kelvin Test?
What is Kelvin Test?
This paper uses data to outline what a 4-wire Kelvin test. Several examples are illustrated of what the 4 wire Kelvin test can and cannot do.
Analysis Lab
Thermal Cycle Testing of PWBs
Thermal Cycle Testing of PWBs
Paper establishes a test protocol for thermal cycle testing of bare PWBs exposed to lead-free and rework simulation.
Analysis Lab
Good Quality Comes From Good Design for Test
Good Quality Comes From Good Design for Test
This paper discusses how to maximize the benefits of boundary scan test, with examples of how designers should select the right components.
Production Floor
Drop Test For Lead-Free Assemblies
Drop Test For Lead-Free Assemblies
In this work, a board-level drop shock test was performed on 9 assemblies. Each board was monitored for shock response and net electrical resistance.
Analysis Lab
Electrical Testing of Passive Components
Electrical Testing of Passive Components
Substrates have become more critical with regard to pitch and density leading to increased use of buried components. This paper reviews testing for buried capacitors.
Production Floor
Head in Pillow X-ray Inspection at Flextronics
Head in Pillow X-ray Inspection at Flextronics
For the study we used two boards exhibiting HIP defects with four types of AXI machines at four sites in Flextronics manufacturing, or vendor laboratory.
Analysis Lab
Embedded System Access
Embedded System Access
This paper discusses test access methodologies and elaborates on Embedded System Access strategies in particular.
Analysis Lab
The Evolution of ICT
The Evolution of ICT
Paper describes how ICT advancements contribute to lowering overall manufacturing test costs by improving fault coverage, reliability, and throughput of production tests.
Production Floor
Voiding Control at QFN Assembly
Voiding Control at QFN Assembly
Thermal pad voiding control at QFN assembly is a major challenge due to the large coverage area, large number of via, and low standoff.
Analysis Lab
Flexible Fixturing System for In-Circuit Test
Flexible Fixturing System for In-Circuit Test
Paper describes a flexible fixturing system which overcomes the cost and tooling cycle times inherent with traditional BoN fixtures.
Production Floor
Test, Inspection, X-Ray << Page 1 of 9 >>
 
 
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