Electronics Assembly Knowledge, Vision & Wisdom
Test, Inspection, X-Ray << Page 1 of 9 >>
These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.

Programs are sorted by published date, most recent first.
Directory Search        


Program Search        
Solder Paste Inspection - When and Why
Solder Paste Inspection - When and Why
Folks at our facility are pushing us to purchase a 3D solder paste inspection system. Are these systems common and under what condition should we consider buying one? Phil Zarrow and Jim Hall, the Assembly Brothers, provide insight.
Board Talk
Virtual Access Augments Test Coverage
Virtual Access Augments Test Coverage
Detecting open solder connections with electrical test techniques is a major challenge for manufacturers because of the erosion of test pads.
Production Floor
Signal Transmission Loss Due to Surface Roughness
Signal Transmission Loss Due to Surface Roughness
In this research, parameters of various types of transmission line structures on an evaluation board were measured and analyzed in detail.
Materials Tech
A New Method to Forecast Drop Shock Performance
A New Method to Forecast Drop Shock Performance
This paper discusses a method to predict drop test behavior by understanding the surface tension of the solder mask ink and the underfill.
Analysis Lab
Will Typical No Clean Paste Pass an SIR Test?
Will Typical No Clean Paste Pass an SIR Test?
Will a typical no clean paste pass an SIR test? Is it really clean enough for a conformal coating and 20 years of service? The Assembly Brothers, Phil Zarrow and Jim Hall, provide some answers to these questions.
Board Talk
Boundary Scan Advanced Diagnostic Methods
Boundary Scan Advanced Diagnostic Methods
Cases illustrate how circuit information and predictive analysis can provide more precise and accurate diagnostic information.
Production Floor
Solder Residues and In-Circuit Test
Solder Residues and In-Circuit Test
While running a solder paste comparison through our ICT process, we found one solder paste residue is harder than another. What could be causing the difference? The Assembly Brothers, Phil Zarrow and Jim Hall, answer these questions.
Board Talk
Overcoming Challenges to Functional Test
Overcoming Challenges to Functional Test
Paper covers development of a standardized functional circuit test, combined with fixturing designed for high-mix, high volume production.
Production Floor
Evaluating Surface Cleanliness
Evaluating Surface Cleanliness
The water break test is easy and practical to conduct and helps you evaluate residues left from adhesives or conformal coating dots.
Analysis Lab
X-rays vs. Cross Sections to Measure Voids
X-rays vs. Cross Sections to Measure Voids
This paper validates void measurements obtained from non-destructive imaging techniques, with the physically measured void measurements of cross sectioning.
Analysis Lab
Test, Inspection, X-Ray << Page 1 of 9 >>
 
 
About | Advertising | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms

Circuit Insight
6 Liberty Square #2040, Boston MA 02109 USA

Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager

Copyright © Circuitnet LLC. All rights reserved.
A Circuitnet Media Publication