Electronics Assembly Knowledge, Vision & Wisdom
Test, Inspection, X-Ray
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These programs cover manual and automated test, manual and automated optical inspection, x-ray and more. Programs are sorted by published date, most recent first.


The Evolution of ICT
The Evolution of ICT
Paper describes how ICT advancements contribute to lowering overall manufacturing test costs by improving fault coverage, reliability, and throughput of production tests.
Production Floor

A New Method to Forecast Drop Shock Performance
A New Method to Forecast Drop Shock Performance
This paper discusses a method to predict drop test behavior by understanding the surface tension of the solder mask ink and the underfill.
Analysis Lab

Electrical Test Conditions & Considerations
Electrical Test Conditions & Considerations
When an OEM is deciding requirements for a particular part regarding Electrical Test, some over precautions and disconnects may occur.
Analysis Lab

Recent Technology Advances for X-ray Inspection
Recent Technology Advances for X-ray Inspection
This paper reviews x-ray system types and what they provide for resolution, magnification, power, pixel size and the effects of radiation damage.
Analysis Lab

Latent Short Circuit Failure in High-rel PCBs
Latent Short Circuit Failure in High-rel PCBs
This paper describes inspections performed on base materials, manufacturing processes and final PCBs.
Production Floor

Tools and Techniques for Material Assessment in Advanced Technologies
Tools and Techniques for Material Assessment in Advanced Technologies
Paper identifies limitations in the methods used for evaluating solders, circuit board materials and surface finishes.
Materials Tech

Early Design Review of Boundary Scan To Enhancing Testability
Early Design Review of Boundary Scan To Enhancing Testability
Paper reviews what portions of a design can be covered structurally and what are covered functionally, to provide the best diagnostics to discover faults?
Production Floor

Thermal Mechanical Fatigue of a 56 I/O Quad-Flat No Lead Package
Thermal Mechanical Fatigue of a 56 I/O Quad-Flat No Lead Package
A fatigue computational model was used to predict the effects of conformal coating and underfill on solder joints between a 56 I/O plastic quad-flat and a polyimide PCB.
Analysis Lab

Numerical Study on New Pin Pull Test for Pad Cratering
Numerical Study on New Pin Pull Test for Pad Cratering
In this study a new pin pull test method with solder ball attached and positioned to the test board at a 30° was used to study the strength of pad cratering.
Analysis Lab

Tin Flakes/Splashes in SMT
Tin Flakes/Splashes in SMT
An increasing of electrical shorts reported in several testers was noticed. Initially, it was found than more of the 80% of the shorts corresponding to thin metal flakes/splashes.
Analysis Lab

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