Electronics Assembly Knowledge, Vision & Wisdom
Test, Inspection, X-Ray << Page 1 of 10 >>
These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.

Programs are sorted by published date, most recent first.
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Flowers of Sulfur Creep Corrosion Testing of Populated PCBs
Flowers of Sulfur Creep Corrosion Testing of Populated PCBs
Creep corrosion testing of printed circuit boards using a specially designed flowers of sulfur chamber has been pioneered by an iNEMI technical committee.
Production Floor
Signal Transmission Loss Due to Surface Roughness
Signal Transmission Loss Due to Surface Roughness
In this research, parameters of various types of transmission line structures on an evaluation board were measured and analyzed in detail.
Materials Tech
Thermal Mechanical Fatigue of a 56 I/O Quad-Flat No Lead Package
Thermal Mechanical Fatigue of a 56 I/O Quad-Flat No Lead Package
A fatigue computational model was used to predict the effects of conformal coating and underfill on solder joints between a 56 I/O plastic quad-flat and a polyimide PCB.
Analysis Lab
Numerical Study on New Pin Pull Test for Pad Cratering
Numerical Study on New Pin Pull Test for Pad Cratering
In this study a new pin pull test method with solder ball attached and positioned to the test board at a 30° was used to study the strength of pad cratering.
Analysis Lab
Should We Invest in 3D Optical Inspection?
Should We Invest in 3D Optical Inspection?
We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time? The Assembly Brothers, Jim Hall and Phil Zarrow, share their experiences and insight.
Board Talk
Implementing Robust Bead Probe Test Processes
Implementing Robust Bead Probe Test Processes
This paper defines a process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly.
Production Floor
Ask the Experts
Test Probe Problems After Pin-In-Paste
We are having test probe contact issues with our Pin-In-Paste process. Should all the flux vaporize off in the reflow process? Any suggestions?
Ask the Experts
Industry Progress from 2005 to Present Day
Industry Progress from 2005 to Present Day
This paper compares assembly and test of various 1.0 mm pitch CBGAs conducted between 2005 and 2014.
Production Floor
Testing of Soldering Materials vs. Soldering Processes
Testing of Soldering Materials vs. Soldering Processes
This paper discusses Surface Insulation Resistance (SIR) data of solder pastes and other soldering materials on IPCB-52 coupons.
Production Floor
Tin Flakes/Splashes in SMT
Tin Flakes/Splashes in SMT
An increasing of electrical shorts reported in several testers was noticed. Initially, it was found than more of the 80% of the shorts corresponding to thin metal flakes/splashes.
Analysis Lab
Test, Inspection, X-Ray << Page 1 of 10 >>