Electronics Assembly Knowledge, Vision & Wisdom
Test, Inspection, X-Ray << Page 1 of 10 >>
These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.

Programs are sorted by published date, most recent first.
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Reliability for High Temperature Power Computing
Reliability for High Temperature Power Computing
This experiment considers the reliability of different electronic components and evaluates them on 0.200" power computing printed circuit boards with OSP.
Analysis Lab
The Evolution of ICT
The Evolution of ICT
Paper describes how ICT advancements contribute to lowering overall manufacturing test costs by improving fault coverage, reliability, and throughput of production tests.
Production Floor
Protocol Development for Testing Solder Reliability
Protocol Development for Testing Solder Reliability
This paper updates progress in the development of methods for investigating solder joint reliability in a combined environment of vibration and thermal cycle testing.
Analysis Lab
Cross-Sectioning of SMT and PCB Related Architectures
Cross-Sectioning of SMT and PCB Related Architectures
Techniques in performing precision and analytical micro-sections, which fuse the techniques common in preparation of silicon wafers and bulk materials are discussed.
Analysis Lab
Risk for Ceramic Component Cracking Dependent
Risk for Ceramic Component Cracking Dependent
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses.
Analysis Lab
Solder Paste Inspection - When and Why
Solder Paste Inspection - When and Why
Folks at our facility are pushing us to purchase a 3D solder paste inspection system. Are these systems common and under what condition should we consider buying one? Phil Zarrow and Jim Hall, the Assembly Brothers, provide insight.
Board Talk
Pad Crater Initiation in Shock Using Acoustic Emission Detection
Pad Crater Initiation in Shock Using Acoustic Emission Detection
Dye stain and cross section failure analysis techniques were used to identify pad crater damage and showed good agreement with the acoustic events.
Analysis Lab
Board Level Reliability Comparison of BGA and LGA Packages
Board Level Reliability Comparison of BGA and LGA Packages
Study compares board level reliability of BGA and LGA packages mounted with an LGA footprint. Yield, drop test and thermal performance were evaluated.
Analysis Lab
Will Typical No Clean Paste Pass an SIR Test?
Will Typical No Clean Paste Pass an SIR Test?
Will a typical no clean paste pass an SIR test? Is it really clean enough for a conformal coating and 20 years of service?
Board Talk
Latent Short Circuit Failure in High-rel PCBs
Latent Short Circuit Failure in High-rel PCBs
This paper describes inspections performed on base materials, manufacturing processes and final PCBs.
Production Floor
Test, Inspection, X-Ray << Page 1 of 10 >>