Electronics Assembly Knowledge, Vision & Wisdom
Test, Inspection, X-Ray
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These programs cover manual and automated test, manual and automated optical inspection, x-ray and more. Programs are sorted by published date, most recent first.


Latent Short Circuit Failure in High-rel PCBs
Latent Short Circuit Failure in High-rel PCBs
This paper describes inspections performed on base materials, manufacturing processes and final PCBs.
Production Floor

Requirements on a Class 0 EPA - ESD Equipment and Measurements
Requirements on a Class 0 EPA - ESD Equipment and Measurements
The requirements “0 volt” can be achieved, when die maximum value will be required. Today we do not have any ESD material, which requires these limits.
Analysis Lab

Early Design Review of Boundary Scan To Enhancing Testability
Early Design Review of Boundary Scan To Enhancing Testability
Paper reviews what portions of a design can be covered structurally and what are covered functionally, to provide the best diagnostics to discover faults?
Production Floor

A Standardized Reliability Evaluation Framework for Connections
A Standardized Reliability Evaluation Framework for Connections
The iNEMI Connector Reliability Test Recommendations team recommends work to define test conditions to evaluate the expected degradation of connectors under the stress levels.
Analysis Lab

Accuracy Validation Finds Hidden Problems Affecting DPMO
Accuracy Validation Finds Hidden Problems Affecting DPMO
This paper discusses individual process step validation methods with real examples of improvement that contribute to defect per million opportunities (DPMO) reduction.
Analysis Lab

Reliability for High Temperature Power Computing
Reliability for High Temperature Power Computing
This experiment considers the reliability of different electronic components and evaluates them on 0.200" power computing printed circuit boards with OSP.
Analysis Lab

Tools and Techniques for Material Assessment in Advanced Technologies
Tools and Techniques for Material Assessment in Advanced Technologies
Paper identifies limitations in the methods used for evaluating solders, circuit board materials and surface finishes.
Materials Tech

Expanding IEEE Std 1149.1 Boundary-Scan Architecture
Expanding IEEE Std 1149.1 Boundary-Scan Architecture
This paper discusses the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects.
Production Floor

Protocol Development for Testing Solder Reliability
Protocol Development for Testing Solder Reliability
This paper updates progress in the development of methods for investigating solder joint reliability in a combined environment of vibration and thermal cycle testing.
Analysis Lab

Cross-Sectioning of SMT and PCB Related Architectures
Cross-Sectioning of SMT and PCB Related Architectures
Techniques in performing precision and analytical micro-sections, which fuse the techniques common in preparation of silicon wafers and bulk materials are discussed.
Analysis Lab

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