Electronics Assembly Knowledge, Vision & Wisdom
Test, Inspection, X-Ray << Page 1 of 9 >>
These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.

Programs are sorted by published date, most recent first.
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On-Board Package Decapsulation Techniques for Failure Analysis
On-Board Package Decapsulation Techniques for Failure Analysis
Various on-board decapsulation techniques to remove package overmold while preserving wire bonds either gold (Au) or Copper (Cu) were evaluated.
Analysis Lab
Tools and Techniques for Material Assessment in Advanced Technologies
Tools and Techniques for Material Assessment in Advanced Technologies
Paper identifies limitations in the methods used for evaluating solders, circuit board materials and surface finishes.
Materials Tech
Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups
Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups
This paper investigates the Mechanical Shock and Drop Reliability of SnAgCu ball Flip Chip BGA solder joints.
Production Floor
PCBA Inspection Concerns
PCBA Inspection Concerns
We inspect PCBAs on a relatively hard ESD mat. Will moving the PCBs on the mat will scratch and stress the soldered components on the bottom side?
Board Talk
Ask the Experts
Initial Screen Print Test Board
Is it recommended to print one cycle before printing the first production board? I could use a scrap board or blank plastic card for the first print.
Ask the Experts
Novel Pogo-Pin Socket Design for Automated Linearity Testing
Novel Pogo-Pin Socket Design for Automated Linearity Testing
A novel pogo-pin block array and corresponding motorized test socket has been designed to stimulate the MCM and acquire full functional test data.
Production Floor
Design for Testability to Overcome Functional Board Test Complexities
Design for Testability to Overcome Functional Board Test Complexities
In this paper the author reviews how Design for Testability techniques can be an effective way to reduce functional board test programming complexity.
Production Floor
Revolutionary Technique for Microvia Microsections
Revolutionary Technique for Microvia Microsections
This paper describes the design of a test structure that facilitates the evaluation of blind and buried microvias in printed circuit boards.
Analysis Lab
Reliability for High Temperature Power Computing
Reliability for High Temperature Power Computing
This experiment considers the reliability of different electronic components and evaluates them on 0.200" power computing printed circuit boards with OSP.
Analysis Lab
Cross-Sectioning of SMT and PCB Related Architectures
Cross-Sectioning of SMT and PCB Related Architectures
Techniques in performing precision and analytical micro-sections, which fuse the techniques common in preparation of silicon wafers and bulk materials are discussed.
Analysis Lab
Test, Inspection, X-Ray << Page 1 of 9 >>
 
 
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