Electronics Assembly Knowledge, Vision & Wisdom
Test, Inspection, X-Ray << Page 1 of 9 >>
These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.

Programs are sorted by published date, most recent first.
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New Paradigm for Optical/X-Ray Inspection
New Paradigm for Optical/X-Ray Inspection
This paper describes a concept for a test system where a low energy micro focus X-ray source and 4 mega pixel detector are mounted in separate robotically controlled heads.
Analysis Lab
Should We Invest in 3D Optical Inspection?
Should We Invest in 3D Optical Inspection?
We are correcting many solder defects. The search for defects is taking too long. Should we go with a 3D AOI system to save inspection time?
Board Talk
AOI in an 01005 World
AOI in an 01005 World
Paper discusses how AOI has become an essential tool to ensure a superior yield in the assembly of 01005 components.
Production Floor
Implementing Robust Bead Probe Test Processes
Implementing Robust Bead Probe Test Processes
This paper defines a process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly.
Production Floor
Ask the Experts
Cause of BGA Solder Joint Bridging
How do you find the root cause of BGA bridging? We are seeing two different bridging areas: one in the corner and the other in the center.
Ask the Experts
Acoustic Micro Imaging Analysis for 3D Packages
Acoustic Micro Imaging Analysis for 3D Packages
This paper will present a review of AMI methods that are applicable to analyses of 3D devices and show example applications.
Analysis Lab
Ask the Experts
Intermittent BGA Test Problems
During testing BGA devices are failing, however if we press lightly on the top of the problem BGA device during testing, the board passes. What is likely to be the cause?
Ask the Experts
Industry Progress from 2005 to Present Day
Industry Progress from 2005 to Present Day
This paper compares assembly and test of various 1.0 mm pitch CBGAs conducted between 2005 and 2014.
Production Floor
Mechanical Failures in Pb-Free Processing
Mechanical Failures in Pb-Free Processing
This paper evaluates the effect of pad crater defects on process strain limits for BGA devices. Methods, results, analysis and techniques are discussed.
Analysis Lab
Testing of Soldering Materials vs. Soldering Processes
Testing of Soldering Materials vs. Soldering Processes
This paper discusses Surface Insulation Resistance (SIR) data of solder pastes and other soldering materials on IPCB-52 coupons.
Production Floor
Test, Inspection, X-Ray << Page 1 of 9 >>