Electronics Assembly Knowledge, Vision & Wisdom
Test, Inspection, X-Ray
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These programs cover manual and automated test, manual and automated optical inspection, x-ray and more. Programs are sorted by published date, most recent first.


Solder Paste Inspection - When and Why
Solder Paste Inspection - When and Why
Our facility is pushing us to purchase a 3D solder paste inspection system. Are these systems common and under what condition should we consider buying one?
Board Talk

Will Typical No Clean Paste Pass an SIR Test?
Will Typical No Clean Paste Pass an SIR Test?
Will a typical no clean paste pass an SIR test? Is it really clean enough for a conformal coating and 20 years of service?
Board Talk

Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups
Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups
This paper investigates the Mechanical Shock and Drop Reliability of SnAgCu ball Flip Chip BGA solder joints.
Production Floor

AOI Capabilities Study with 03015 Components
AOI Capabilities Study with 03015 Components
Paper covers tests working with five AOI vendors to ensure successful testing of 03015 components, with emphasis on optimizing algorithm threshold settings.
Analysis Lab

Design for Testability to Overcome Functional Board Test Complexities
Design for Testability to Overcome Functional Board Test Complexities
In this paper the author reviews how Design for Testability techniques can be an effective way to reduce functional board test programming complexity.
Production Floor

Ball Pull Test Efficiency for the PCB Pad Cratering Validation
Ball Pull Test Efficiency for the PCB Pad Cratering Validation
In the study cold ball pull testing is used to validate the resistance of PCB pad cratering for different ultra-low loss dielectrics materials.
Analysis Lab

Flowers of Sulfur Creep Corrosion Testing of Populated PCBs
Flowers of Sulfur Creep Corrosion Testing of Populated PCBs
Creep corrosion testing of printed circuit boards using a specially designed flowers of sulfur chamber has been pioneered by an iNEMI technical committee.
Production Floor

Effect of Package Warpage and Composite CTE on Failure Modes
Effect of Package Warpage and Composite CTE on Failure Modes
This paper gives examples of the BLR TC failure modes and locations of package test vehicles designed to correlate failure modes.
Analysis Lab

Creating Reusable Manufacturing Tests for High-Speed I/O
This paper illustrates high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and a strategy for testing them with SIs within FPGAs.
Analysis Lab

3D Digital Stitching Imagery is Revolutionizing Failure Analysis and Product Analysis
3D Digital Stitching Imagery is Revolutionizing Failure Analysis and Product Analysis
This presentation will outline the different types of 3D imagery and how they have found uses in various applications.
Analysis Lab

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