Electronics Assembly Knowledge, Vision & Wisdom
Rework, Repair, Modification
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Programs are sorted by published date, most recent first.


How To Strip Tin-Lead Solder From SMT Pads for RoHS
How To Strip Tin-Lead Solder From SMT Pads for RoHS
Is it possible to scrub the pads of a PCB to bring it back into compliance? 63-37 solder was mistakenly used to hand solder parts. Somebody put out the wrong material for the manual soldering operation. The Assembly Brothers review this challenge.
Board Talk

Automating the Rework Process
Automating the Rework Process
This paper describes Automated Optical Rework technology and its advantages for advanced circuit board production.
Production Floor

New Placement Technology for Rework
New Placement Technology for Rework
This paper introduces a rework technology using cameras to identify the target area for component installation and component pin structure.
Production Floor

Process Control and Reliability of Reworked BGAs
Process Control and Reliability of Reworked BGAs
The lead-free solder does not wet metal surfaces as well as tin-lead metallurgy. This narrows down the process window for lead-free solder.
Production Floor

BGA Reballing and Influence on Ball Shear Strength
BGA Reballing and Influence on Ball Shear Strength
This paper focuses on the effect of various parameters that are used to reball a BGA component and their effect on the overall shear strength.
Analysis Lab

Rework Challenges for Leading Edge Components BGA, QFN and LED
Rework Challenges for Leading Edge Components BGA, QFN and LED
This paper outlines rework processes for many challenging components including BGA, QFN/BTC, and LED packages.
Production Floor

Is Customer Approval Required for Class 3 Repair?
Is Customer Approval Required for Class 3 Repair?
A non-aerospace customer's board was repaired without authorization. Does an IPC document state that customer approval is required for class 3 repairs? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk

Rework of High I/O Column Grid Arrays
Rework of High I/O Column Grid Arrays
Off-the-shelf column grid arrays are now being considered for use in a number of NASA systems. This paper presents rework and re-column attachment data.
Production Floor

Advanced Rework Technology for Large Area Arrays
Advanced Rework Technology for Large Area Arrays
This paper discusses rework challenges including identification of the key technical process, outlining efforts aimed at addressing these new challenges.
Production Floor

Selective Reflow Rework Process
Selective Reflow Rework Process
This paper discusses some aspects of the process optimization and changes made to improve the quality of the rework process.
Production Floor

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