Rework, Repair, Modification



These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.
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Reworkable Edge Bond Adhesives for BGA Applications
Reworkable Edge Bond Adhesives for BGA Applications
Reworkable edge bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies are presented.
Production Floor

Best Method for Repairing Underfill Arrays?
Best Method for Repairing Underfill Arrays?
What is the best method for removing an SMT array package that has been under-filled and cured. Is there an industry approved method?
Board Talk

Hot Air BGA Rework Process Improvement with a Touchless Temperature- Dependent Live-Feedback Process
Hot Air BGA Rework Process Improvement with a Touchless Temperature- Dependent Live-Feedback Process
The goal of this paper is to share complex rework process improvements to review and consider how incorporating into their practice can provide benefit.
Production Floor

Through-Hole Rework for Challenging Components
Through-Hole Rework for Challenging Components
The successful transition of low and mid-range servers to lead-free has come largely through wave solder process optimization and the use of alternate lead-free alloys.
Production Floor

Rework Challenges for Smart Phones and Tablets
Rework Challenges for Smart Phones and Tablets
This paper reviews the challenges and process steps needed for successful repair of surface mount devices on very densely packaged circuit boards.
Production Floor

BGA Reballing and Influence on Ball Shear Strength
BGA Reballing and Influence on Ball Shear Strength
This paper focuses on the effect of various parameters that are used to reball a BGA component and their effect on the overall shear strength.
Analysis Lab

Issues With BGA Rework Residue
Issues With BGA Rework Residue
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA? Phil Zarrow and Jim Hall, also known as The Assembly Brothers, share their own insight and experience with everyone.
Board Talk

Modify Rework Procedures for Assemblies Fabricated Using OSP?
Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards?
Board Talk

Calculating Failure Rate During Rework
Calculating Failure Rate During Rework
Is there a way to estimate the potential failure rate introduced by hand rework on one SMT part? Phil Zarrow and Jim Hall, The Assembly Brothers, share their own insights to answer this question.
Board Talk

Automating the Rework Process
Automating the Rework Process
This paper describes Automated Optical Rework technology and its advantages for advanced circuit board production.
Production Floor

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