Electronics Assembly Knowledge, Vision & Wisdom
Rework, Repair, Modification << Page 1 of 9 >>


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Ask the Experts
Burned Chip Repair
I have a circuit board with a burned chip. Can this type of repair be done reliably? Where can I send this board to and have it done professionally?
Ask the Experts
Issues With BGA Rework Residue
Issues With BGA Rework Residue
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA?
Board Talk
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards? Phil Zarrow and Jim Hall, the Assembly Brothers, offer their insight.
Board Talk
BGA Re-balling from Lead-free to Tin-lead
BGA Re-balling from Lead-free to Tin-lead
This paper includes an assessment of the mechanical integrity of commercially available BGAs after reballing.
Production Floor
WLCSP and BGA Reworkable Underfill Evaluation and Reliability
WLCSP and BGA Reworkable Underfill Evaluation and Reliability
Paper reviews study on underfill/flux compatibility issues and investigates flux compatibility between four popular commercial solder pastes and six underfills.
Production Floor
Ask the Experts
Mixing Silicone and Acrylic Conformal Coatings
After repair our techs use an acrylic based conformal coat to touch-up the area. Could there be a problem if we mix silicone and acrylic conformal coatings?
Ask the Experts
Can We Skip Cleaning After Rework?
Can We Skip Cleaning After Rework?
What short-term and long-term concerns should we have with product reliability if we skip cleaning after rework?
Board Talk
Ask the Experts
Time Required to Bake for Repair
How much time is required to bake a PCB assembly to eliminate the moisture before doing any repair work on the components?
Ask the Experts
Alternative to Dead Bug Rework
Alternative to Dead Bug Rework
Dead bugging is when you add components to a circuit board upside-down and run jumper wires to complete the circuits. Here's an alternative.
Production Floor
Do BGA Components Warp During Reflow?
Do BGA Components Warp During Reflow?
We recently reworked a BGA component and the corners all bridged. Can these components be removed and reused if we remove the warp? What causes the corners of the BGA component to warp and how do we prevent it? The Assembly Brothers, Jim Hall and Phil Zarrow, answer these questions.
Board Talk
Rework, Repair, Modification << Page 1 of 9 >>