Electronics Assembly Knowledge, Vision & Wisdom
Rework, Repair, Modification
Previous   Page 1 of 6   Next


Programs are sorted by published date, most recent first.


WLCSP and BGA Reworkable Underfill Evaluation and Reliability
WLCSP and BGA Reworkable Underfill Evaluation and Reliability
Paper reviews study on underfill/flux compatibility issues and investigates flux compatibility between four popular commercial solder pastes and six underfills.
Production Floor

Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics
Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics
This paper reports an ensemble of strategies for the successful miniaturization of EEG in a fully-flexible, wearable and wireless platform.
Analysis Lab

Best Method for Repairing Underfill Arrays?
Best Method for Repairing Underfill Arrays?
What is the best method for removing an SMT array package that has been under-filled and cured. Is there an industry approved method?
Board Talk

Reworkable Edge Bond Adhesives for BGA Applications
Reworkable Edge Bond Adhesives for BGA Applications
Reworkable edge bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies are presented.
Production Floor

Issues With BGA Rework Residue
Issues With BGA Rework Residue
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA?
Board Talk

Through-Hole Rework for Challenging Components
Through-Hole Rework for Challenging Components
The successful transition of low and mid-range servers to lead-free has come largely through wave solder process optimization and the use of alternate lead-free alloys.
Production Floor

Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards?
Board Talk

Rework Challenges for Smart Phones and Tablets
Rework Challenges for Smart Phones and Tablets
This paper reviews the challenges and process steps needed for successful repair of surface mount devices on very densely packaged circuit boards.
Production Floor

Do BGA Components Warp During Reflow?
Do BGA Components Warp During Reflow?
We recently reworked a BGA component and the corners all bridged. Can these components be removed and reused if we remove the warp?
Board Talk

Calculating Failure Rate During Rework
Calculating Failure Rate During Rework
Is there a way to estimate the potential failure rate introduced by hand rework on one SMT part? Phil Zarrow and Jim Hall, The Assembly Brothers, share their own insights to answer this question.
Board Talk

Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search