Electronics Assembly Knowledge, Vision & Wisdom
Rework, Repair, Modification << Page 1 of 9 >>


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Process Control and Reliability of Reworked BGAs
Process Control and Reliability of Reworked BGAs
The lead-free solder does not wet metal surfaces as well as tin-lead metallurgy. This narrows down the process window for lead-free solder.
Production Floor
Consensus for Baking Prior to Rework?
Consensus for Baking Prior to Rework?
What is the industry consensus for baking out moisture in circuit board assemblies prior to convection rework, localized mini-wave rework, or hand soldering rework?
Board Talk
Rework Challenges for Leading Edge Components BGA, QFN and LED
Rework Challenges for Leading Edge Components BGA, QFN and LED
This paper outlines rework processes for many challenging components including BGA, QFN/BTC, and LED packages.
Production Floor
Rework of High I/O Column Grid Arrays
Rework of High I/O Column Grid Arrays
Off-the-shelf column grid arrays are now being considered for use in a number of NASA systems. This paper presents rework and re-column attachment data.
Production Floor
Advanced Rework Technology for Large Area Arrays
Advanced Rework Technology for Large Area Arrays
This paper discusses rework challenges including identification of the key technical process, outlining efforts aimed at addressing these new challenges.
Production Floor
Ask the Experts
Options for Reballing BGA Components
Which do you recommend when reballing BGA components? Reballing with solder paste and solder spheres, or with solder spheres only?
Ask the Experts
Solder Paste Volume for BGA Rework
Solder Paste Volume for BGA Rework
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness?
Board Talk
Selective Reflow Rework Process
Selective Reflow Rework Process
This paper discusses some aspects of the process optimization and changes made to improve the quality of the rework process.
Production Floor
Cleaning Reballed BGA Components
Cleaning Reballed BGA Components
We currently clean reballed BGAs using an ultrasonic cleaner followed by baking to remove moisture. Is this an acceptable practice? Jim Hall and Phil Zarrow, the Assembly Brothers, offer their own suggestions.
Board Talk
Ask the Experts
Burned Chip Repair
I have a circuit board with a burned chip. Can this type of repair be done reliably? Where can I send this board to and have it done professionally?
Ask the Experts
Rework, Repair, Modification << Page 1 of 9 >>