Electronics Assembly Knowledge, Vision & Wisdom
Rework, Repair, Modification
Previous   Page 1 of 6   Next


Programs are sorted by published date, most recent first.


Issues With BGA Rework Residue
Issues With BGA Rework Residue
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA?
Board Talk

Through-Hole Rework for Challenging Components
Through-Hole Rework for Challenging Components
The successful transition of low and mid-range servers to lead-free has come largely through wave solder process optimization and the use of alternate lead-free alloys.
Production Floor

Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards?
Board Talk

Rework Challenges for Smart Phones and Tablets
Rework Challenges for Smart Phones and Tablets
This paper reviews the challenges and process steps needed for successful repair of surface mount devices on very densely packaged circuit boards.
Production Floor

Do BGA Components Warp During Reflow?
Do BGA Components Warp During Reflow?
We recently reworked a BGA component and the corners all bridged. Can these components be removed and reused if we remove the warp?
Board Talk

Calculating Failure Rate During Rework
Calculating Failure Rate During Rework
Is there a way to estimate the potential failure rate introduced by hand rework on one SMT part? Phil Zarrow and Jim Hall, The Assembly Brothers, share their own insights to answer this question.
Board Talk

How To Strip Tin-Lead Solder From SMT Pads for RoHS
How To Strip Tin-Lead Solder From SMT Pads for RoHS
Is it possible to scrub the pads of a PCB to bring it back into compliance? 63-37 solder was mistakenly used to hand solder parts. Somebody put out the wrong material for the manual soldering operation. The Assembly Brothers review this challenge.
Board Talk

Automating the Rework Process
Automating the Rework Process
This paper describes Automated Optical Rework technology and its advantages for advanced circuit board production.
Production Floor

New Placement Technology for Rework
New Placement Technology for Rework
This paper introduces a rework technology using cameras to identify the target area for component installation and component pin structure.
Production Floor

Process Control and Reliability of Reworked BGAs
Process Control and Reliability of Reworked BGAs
The lead-free solder does not wet metal surfaces as well as tin-lead metallurgy. This narrows down the process window for lead-free solder.
Production Floor

Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search