Electronics Assembly Knowledge, Vision & Wisdom
Rework, Repair, Modification << Page 1 of 9 >>


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Best Method for Repairing Underfill Arrays?
Best Method for Repairing Underfill Arrays?
What is the best method for removing an SMT array package that has been under-filled and cured. Is there an industry approved method? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk
6 Common Mistakes of BGA Rework
6 Common Mistakes of BGA Rework
Discover the 6 most common mistakes in BGA rework and how you can avoid them.
Production Floor
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Automatic Insertion Causing Plated Hole Damage
What is the criteria for acceptability of cracks and deformation of the plated hole wall?
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Ask the Experts
How To Rework SMT Connector with Center Ground Strip
I need to remove a SMT connector that has a ground strip down the middle. How do I remove it and put a new one on an assembled PCB?
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WLCSP and BGA Reworkable Underfill Evaluation and Reliability
WLCSP and BGA Reworkable Underfill Evaluation and Reliability
Paper reviews study on underfill/flux compatibility issues and investigates flux compatibility between four popular commercial solder pastes and six underfills.
Production Floor
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Customer Approval for Repairs
We have a case where a customer's board was repaired without authorization. Does IPC specify that customer approval is required for class 3 repairs?
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BGA Reballing and Influence on Ball Shear Strength
BGA Reballing and Influence on Ball Shear Strength
This paper focuses on the effect of various parameters that are used to reball a BGA component and their effect on the overall shear strength.
Analysis Lab
Issues With BGA Rework Residue
Issues With BGA Rework Residue
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA?
Board Talk
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Estimating Failure Rate During Rework
Is there a way to estimate the potential failure rate introduced by hand rework of one SMT part that involves de-soldering and soldering a new part?
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Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards?
Board Talk
Rework, Repair, Modification << Page 1 of 9 >>