Electronics Assembly Knowledge, Vision & Wisdom
Rework, Repair, Modification
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Rework Practices for MicroLEDs and Other Highly Miniaturized SMT Components
Rework Practices for MicroLEDs and Other Highly Miniaturized SMT Components
This paper will focus on practices and innovative solutions to successfully repair these miniaturized, sensitive and often fragile components.
Analysis Lab

Consensus for Baking Prior to Rework?
Consensus for Baking Prior to Rework?
What is the consensus for baking out moisture in circuit board assemblies prior to convection rework, localized mini-wave rework, or hand soldering rework?
Board Talk

Solder Paste Volume for BGA Rework
Solder Paste Volume for BGA Rework
Rework can never be as controlled or consistent as original assembly, should we use more paste during BGA rework to compensate for irregularities or flatness?
Board Talk

Cleaning Reballed BGA Components
Cleaning Reballed BGA Components
We currently clean reballed BGAs using an ultrasonic cleaner followed by baking to remove moisture. Is this an acceptable practice? Jim Hall and Phil Zarrow, the Assembly Brothers, offer their own suggestions.
Board Talk

Rework and Reball Challenges for Wafer-Level Packages
Rework and Reball Challenges for Wafer-Level Packages
The present work addresses the rework and reball challenges of a specific WLP case study, and suggests improvements for maintaining the true failure signature.
Analysis Lab

6 Common Mistakes of BGA Rework
6 Common Mistakes of BGA Rework
Discover the 6 most common mistakes in BGA rework and how you can avoid them.
Production Floor

Best Method for Repairing Underfill Arrays?
Best Method for Repairing Underfill Arrays?
What is the best method for removing an SMT array package that has been under-filled and cured. Is there an industry approved method? The Assembly Brothers, Phil Zarrow and Jim Hall, answer this question.
Board Talk

WLCSP and BGA Reworkable Underfill Evaluation and Reliability
WLCSP and BGA Reworkable Underfill Evaluation and Reliability
Paper reviews study on underfill/flux compatibility issues and investigates flux compatibility between four popular commercial solder pastes and six underfills.
Production Floor

Issues With BGA Rework Residue
Issues With BGA Rework Residue
After BGA rework there is an outline of residue on around the pads. Is it necessary to remove this residue to reinstall a new BGA?
Board Talk

Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP, organic solderability preservatives, bare boards?
Board Talk

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