Electronics Assembly Knowledge, Vision & Wisdom
Rework, Repair, Modification << Page 1 of 9 >>


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Ask the Experts
BGA Rework Flux Recommendation
Is there a flux we should evaluate when we replace BGA components? We have problems maintaining activity during BGA rework.
Ask the Experts
Practices to Assure Consistent Hot Gas Rework
Practices to Assure Consistent Hot Gas Rework
Paper discusses practices observed at various CMs that can lead to inconsistency in rework and techniques that will reduce or eliminate the inconsistency.
Production Floor
Ask the Experts
Is Pre-Bake Standard for Rework?
On occasion we need to perform rework. Is there a rule or standard that can be applied for pre-bake requirements prior to rework?
Ask the Experts
Rework of Large Surface Mount Connectors
Rework of Large Surface Mount Connectors
Paper discusses how to assemble and rework large SMT connectors and how to assure compliance without sacrificing solder joint reliability and performance.
Production Floor
Is Customer Approval Required for Class 3 Repair?
Is Customer Approval Required for Class 3 Repair?
We have a case where a non-aerospace customer's board was repaired without prior authorization. It was for a class 3 assembly. Does it specify in an IPC document that customer approval is required for class 3 repairs?
Board Talk
Through-Hole Rework for Challenging Components
Through-Hole Rework for Challenging Components
The successful transition of low and mid-range servers to lead-free has come largely through wave solder process optimization and the use of alternate lead-free alloys.
Production Floor
SMT Components Popping Off During Reflow
SMT Components Popping Off During Reflow
One particular SMT component is popping off during the reflow process leaving indentations in the solder. Could the fans in our convection reflow oven be blowing the part of the PCB? The Assembly Brothers, Phil Zarrow and Jim Hall, answer these questions.
Board Talk
Rework Challenges for Smart Phones and Tablets
Rework Challenges for Smart Phones and Tablets
This paper reviews the challenges and process steps needed for successful repair of surface mount devices on very densely packaged circuit boards.
Production Floor
Test Method to Characterize Pad Cratering
Test Method to Characterize Pad Cratering
In this study, an easy-to-implement test method to quantify the propensity for pad cratering in different PCB materials is presented.
Analysis Lab
A Case of Missing SMT Pads
A Case of Missing SMT Pads
We often discuss methods of repairing circuit boards, but what about replacing surface mount pads that were never there to begin with?
Production Floor
Rework, Repair, Modification << Page 1 of 9 >>
 
 
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