Research & Technical Papers

Technical papers are pulled from the database at Circuitnet. SUBMIT

Research links are papers authored by your company that are hosted at Circuit Insight.

Data is presented on the intermetallic strengths and failure modes ...

Tools and Techniques for Material Assessment in Advanced Technologies

Paper identifies limitations in the methods used for evaluating solders, ...

Material Selection for Reliable TMV Pop Assembly

This paper investigates selected aspects of the above mentioned processes ...

A Model for Life of SnAgCu Solder Joints

Almost all reliability assessment is focused on the anticipated life ...

Reliability of Lead-Free LGAs and BGAs

A theory is proposed that substantial differences in SAC305 solder ...

Reliability of Sn/Cu/Ni Solder Joints

Paper covers the electronics industry search for a single lead-free ...

Reliability Impact of Partial Pad Craters

PCB pad craters are associated with single overstress events that ...

More Information

■	No additional information currently available.

Universal Instruments is a global electronics productivity specialist, providing innovative circuit, semiconductor, and back-end assembly technologies and equipment, integrated system solutions, and process expertise to manufacturers in every sector of the global electronics industry.

Our aim is a continuous and intelligent investment in research, and to develop processes, equipment, systems and software to bring electronic assembly to its current pinnacle of sophistication.

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Universal Instruments Corporation

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