Adding OSP to Pads that are Missing ENIG Plating Process



Adding OSP to Pads that are Missing ENIG Plating Process
A fabricator recently notified us that during the ENIG plating process, several pads had been “skipped” and missed on a number of boards. The fabricator would like to add OSP to the pads that are missing the ENIG. Is this acceptable?
Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Process Troubleshooting, Failure Analysis, Process Audits, Process Set-up
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Phil Zarrow
Phil Zarrow
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall
Jim Hall
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

Transcript


Phil
And welcome to Board Talk with Phil Zarrow and Jim Hall, The Assembly Brothers, Pick and Place. We are here to talk about assembly, processes, materials, equipment, methodologies, and all of those fun things that while our day away. Jim, what is today’s question?

Jim
It comes from S.N. A fabricator recently notified us that during the ENIG plating process, several pads had been "skipped" and missed on a number of boards. The fabricator would like to add OSP to the pads that are missing the ENIG. Our fabrication drawing clearly specifies ENIG, so I think the boards should be either replated with ENIG or scrapped at the fabricator’s expense.

Phil
Hey Jim, is this a gag question?

Jim
Phil, you’re my customer. I made some mistake with your product so I put some band-aids on it and good luck.

Phil
It's probably time to find another board fabricator. I don’t even know where to begin with this. Starting with the fact that your drawing clearly specifies ENIG. The process is clearly well out of control. It is time to find another fabricator. But to answer your specific question, no way. Jim, you want to add to that?

Jim
Phil, play a mind game with this thing. He says skipped. Well, what was skipped? Was the gold skipped? If that is the answer, then I am putting OSP over nickel. If the nickel and the gold were skipped, then you could argue that it is OSP over copper. That is the standard process. What else is going wrong with the plating?

Phil
Yeah, that is what you have noted.

Jim
Think about black pad. One of the things we know is that pads come to us with black pad; they look good. They have gold on them, but when we go to solder them, they get a weak joint. If we have skips on the gold, then what is going on under the other gold that is there? Are we just looking at a massive potential black pad problem? I don’t know. That is the question.

You shouldn’t have to take that variability into your process. I want to step back and say, as an assembler, the PCB is an incoming material; it should be right. It should be to spec. We have enough problems assembling boards and getting good quality and everything else without dealing with variable, not-to-spec incoming materials.

Phil
This is what you have seen, and that is what you have seen on this batch of boards. What might have slipped past you? The bottom line with this fabricator is run away, run away. You have to be doing better than that. We will see if anyone comes to the defense of the fabricator, but that is pathetic. No, you don’t put OSP over that.

You have been listening to Board Talk with Jim Hall and Phil Zarrow, The Assembly Brothers. However your surface finish is, whatever you try to solder to it, just don’t solder like my brother.

Jim
And don’t solder like my brother.

Comments

I agree with Phil and Jim, time to find another FAB house, but I think we need to check the Gerber files to make layer information is correct to have all locations plated.
Sundaram, EIT

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