Research
Technologies and Standards to Realize Smart Manufacturing
SIR Test Method for Developing Evidence for the Production Assembly
Attributes of Cored Solder Wire in LED Luminaire Soldering
Selective Removal of Conformal Coatings by Pulsed Ultraviolet Lasers
Effect of Assembly Pitch and Distance on Solder Joint Thermal Cycling Life
Hybrid Conformal Coatings for Mitigating Tin Whiskers
Printing and Assembly Challenges for QFN Devices
Pad Cratering Susceptibility Testing with Acoustic Emission
MORE RESEARCH
Latest Industry News
Will iPhone 13 Trigger Headaches and Nausea?
You'll hear a lot about how boring the iPhone 13 is, but Apple is still poised to continue its sales super cycle
Foxtron, Taiwan's First EV, Leaks After Arriving in the Country: How Come?
NI, Elektro-Automatik Join Forces for EV Battery Testing
China's manufacturing growth slows
To Manage Your Time Better, Think Of It Like A Balloon
Out of the Verification Crisis: Improving RTL Quality
Deep Learning Method Produces Holograms Instantly
MORE INDUSTRY NEWS

Characterization of Solder Defects in Package on Package



Characterization of Solder Defects in Package on Package
This paper is part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls.
Analysis Lab

DOWNLOAD

Authored By:


Zhen (Jane) Feng, Ph. D., David Geiger, Weifeng Liu, Ph.D., Anwar Mohammed, Murad Kurwa
AEG, FLEXTRONICS International Inc.
Milpitas, CA, USA

George Tint, Ph. D.
Saki America
Santa Clara, CA, USA

Summary


As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.

Conclusions


As an extended study of earlier reported projects, we have conducted inspection of solder defects on the top layer of mounted POP devices by an AXI system capable of high speed CT imaging, AXI 5.

AXI 5 produced better testing results with the top layer of POP as shown in Table 5. The interesting facts are that pCT pass/fail calls generated by AXI 5 are independent from operator judgments, and they can be automatically saved to a server to be reviewed by the engineers.

The attribute Gage RR results are in progress.

This project is still ongoing to develop a process for AXI with pCT algorithms and parameter optimization.

For POP applications, 3D imaging offer less ambiguous decisions for solder bridges, open defects while 2D or 2.5D images sometimes encounter confusion from the shadow of neighbors.

This study on POP with AXI 5 is just a start, while more packages evaluation like connectors ongoing to utilize the machine's 3D imaging capability in a wider range of applications.

Initially Published in the IPC Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
01005 Component Challenges and Bugs
Insulation Between Overhanging Component Lead and Circuit Conductor
Sticky Residue Under Low Clearance Parts
Finding the Cause of Cold Solder Joints
Soldering Relays Intrusively in Lead Free Process
Printing vs. Dispensing
Maximum Board Temperature During Tin-Lead
Is There a Spacing Spec for SMD Components?
MORE BOARD TALK
Ask the Experts
Options for Reballing BGA Components
Solder Paste Viscosity
MSD Components Baked Too Long
Aluminum Trays and Rapid Static Discharge
Seeking IPC and J-STD Definitions
Is Component Lead Damage Reparable?
BGA Solder Ball Shelf Life
Conformal Coating Press Fit Connectors
MORE ASK THE EXPERTS