Research
Impractical Stencil Aperture Designs to Enable M0201 Assembly
Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Microalloyed Sn-Cu Pb-Free Solder for High Temp
Selective Reflow Rework Process
Impact of Thermal Loading on the Structural Intergrity of 3D TSV Package
Design and Fabrication of Ultra-Thin Flexible Substrate
Influence of PCB Surface Features on BGA Assembly Yield
Last Will and Testament of the BGA Void
MORE RESEARCH
Latest Industry News
Print These Electronic Circuits Directly Onto Skin
Compal increasingly asked to diversify production bases
Intel's margins tumble as customers shift to cheaper chips, shares slide 10%
From Foldable Phones to Stretchy Screens
6 Considerations for Integrating Sensors in Vehicles
Bill Gates Says Unhappy Customers Are Good for Your Business. Here's Why.
iPhone 12 review: Upgrade for the camera, not 5G
Apple's shifting supply chain creates boomtowns in rural Vietnam
MORE INDUSTRY NEWS

HDI Structures Using Thin Films and Low Temp Paste



HDI Structures Using Thin Films and Low Temp Paste
Conductors and dielectrics have to be considered when building any layer HDI. New methods and materials are becoming available for building HDI.
Materials Tech

DOWNLOAD

Authored By:


Catherine Shearer, James Haley, Chris Hunrath
Ormet Circuits Inc. - Integral Technology
CA USA

Summary


Circuit complexity and density requirements continue to push PCB fabrication capability limits. Component pitch and routing requirements are continually becoming more aggressive and difficult to achieve in good yield with current fabrication strategies. The trend is to bring the PCB closer to the density requirements currently required for semiconductor packaging. The ability to place interconnecting vias in any location on any layer is crucial to PCB fabricators in meeting this high density interconnect (HDI) trend.

The two fundamental elements in any type of PCB, conductors and dielectrics, both have to be considered when building "any layer" HDI. These PCB's have specific challenges for processing while maintaining thermal and electrical performance. Careful consideration of the interplay of the fundamental elements is critical to fulfilling all of these requirements. New methods and materials designed specifically with these challenges in mind are becoming available for building HDI.

Using materials specifically designed for HDI PCBs can significantly reduce the challenges producing these boards. However, along with easing the challenges of fabrication, these materials must also demonstrate the right combination of properties to meet electrical and thermal requirements while also being reliable. Validation of these new technologies is currently underway.

Conclusions


Combing a TLPS paste with a film that is engineered without the constraints of flex can produce thermally reliable z-axis interconnects. The TLPS paste offers a plating like metallurgical bond to the copper innerlayers while the film allows proper sintering and controlled z-axis expansion. Together these materials give the PCB manufacturer ease of implementation of high reliability sintered-paste interconnects and more construction options for HDI structures.


Initially Published in the IPC Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
Causes of Blowholes
Tips When Moving a Reflow Oven
Assembling Boards with BGAs on Both Sides
Larger Stencil Apertures and Type 4 Paste
5 vs 8-Zone Ovens
Component Moisture Question?
BGA Components and Coplanarity
How To Verify Cleanliness After Rework and Prior to Re-coating?
MORE BOARD TALK
Ask the Experts
Initial Screen Print Test Board
HASL Surface Finish and Coplanarity
Legend Marking Discoloration
Cleanliness Testing
Stencil Cleaning Frequency
Exposed Copper Risk
Spotting After DI Water Cleaning
ESD Grounding - 1 Meg Ohm Resistor
MORE ASK THE EXPERTS