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Capacitive Sensor System Using Printed Electronics on Window Glass
The Effect of Thermal Cycling Profile on Thermal Fatigue Performance of an 84-Pin Thin Core BGA
Materials for Advanced Ball-Attach Processes for Advanced Packages
Influence of PCB Surface Features on BGA Assembly Yield
Effectiveness of Conformal Coat to Prevent Corrosion of Terminals
Behavior of Materials in the Manufacturing Environment
Rework of High I/O Column Grid Arrays
Mitigating Tin Whiskers in Alternative Lead-Free Alloys
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Board Talk
Limits for HASL with Complex Products
Reliability of Tin Lead Solder vs. Lead Free Solder
What Is the Recommended Component Storage Environment?
How To Prevent Mid-chip Solder Balls?
The Best Storage Method to Protect Against Corrosion
Risks Using Flux Only for Soldering BGAs
Solder Paste Printing First Pass
Gooey Flux Residue Left Behind
MORE BOARD TALK
Ask the Experts
IPC-A-610 Solder Joint Acceptability Question
What Are Realistic Guidelines for PCB Flexing?
OA Flux Turning Blue
Point to Point Soldering vs Drag Soldering
EMI Shield Reflow Soldering Techniques
IPC SOIC Defect Question
Advise and suggestions for assembly using 01005 capacitors.
Hot Air Soldering for 0201s and 01005s
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