Electrically Conductive Die Attach Epoxy
Master Bond EP17HTS-DA is a silver filled, die attach adhesive that withstands high temperatures and passes MIL-STD-883J thermal stability requirements. Master Bond
Reiner Zoch, Product Manager
Christian Ott, Sales and Project Manager
SEHO Systems GmbH
Kreuzwertheim, Germany
Transcript
Today companies producing electronic equipment must reduce production costs while maintaining a consistently high quality level of manufactured products.
Manual repair soldering is an expensive and time consuming process. This type of repair is generally unacceptable due to the required quality and the reproducibility of the manufacturing process.
Densely populated multilayer boards and miniaturized, high-pin-count, fine-pitch devices cannot be efficiently repaired. Hidden costs, including productivity rates, operator training and damaged assembly costs need to be taken into consideration as well.
By choosing the correct soldering nozzle, one can avoid the formation of soldering faults in the automatic selective soldering process.
This paper gives a detailed explanation of the individual points which should be found in the selective soldering process, with regard to the assembly design and solder nozzle technology.
Initially Published in the IPC Proceedings
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