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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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We are dedicated to continually innovate and develop the highest quality products and services to exceed even the most stringent cleanliness requirements. Whether implementing a new cleaning process, optimizing an existing one or preparing for future design changes, the use of our eight worldwide Technical Centers and global expert engineering teams that offer a wide variety of services and world-class cleaning support ensure a seamless transition.
ZESTRON has the products and services to keep your cleaning process performance at its best. As an ITAR registered company, ZESTRON can handle the most critically sensitive electronics cleaning challenges.
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ZESTRON Corporation
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