Research
Technologies and Standards to Realize Smart Manufacturing
SIR Test Method for Developing Evidence for the Production Assembly
Attributes of Cored Solder Wire in LED Luminaire Soldering
Selective Removal of Conformal Coatings by Pulsed Ultraviolet Lasers
Effect of Assembly Pitch and Distance on Solder Joint Thermal Cycling Life
Hybrid Conformal Coatings for Mitigating Tin Whiskers
Printing and Assembly Challenges for QFN Devices
Pad Cratering Susceptibility Testing with Acoustic Emission
MORE RESEARCH
Latest Industry News
Will iPhone 13 Trigger Headaches and Nausea?
You'll hear a lot about how boring the iPhone 13 is, but Apple is still poised to continue its sales super cycle
Foxtron, Taiwan's First EV, Leaks After Arriving in the Country: How Come?
NI, Elektro-Automatik Join Forces for EV Battery Testing
China's manufacturing growth slows
To Manage Your Time Better, Think Of It Like A Balloon
Out of the Verification Crisis: Improving RTL Quality
Deep Learning Method Produces Holograms Instantly
MORE INDUSTRY NEWS

pH neutral Cleaning Agents - Market Expectation & Field Performance



pH neutral Cleaning Agents - Market Expectation & Field Performance
Study reviews performance of pH neutral cleaning agents compared to alkaline cleaning alternatives and includes field data.
Materials Tech

DOWNLOAD

Authored By:


Umut Tosun, Jigar Patel, Kalyan Nukula, Fernando Gazcon
ZESTRON Americas
Manassas, VA USA

Summary


With regard to precision cleaning applications within electronics manufacturing, pH neutral product development was a major breakthrough in recent years. The impetus for this development resulted from changes with regard to solder paste formulations and resulting assembly processes.

The greater use of lead-free solder paste and the required higher reflow profiles have resulted in even more difficult to remove burnt-in flux residues. Coupled with increases in component density, larger component packages, higher lead counts, finer lead spacing, and lower standoff distances, effective cleaning is greatly challenged. The aqueous alkaline based cleaning agents can effectively remove these flux residues, however, the process often requires an increase in wash temperature and exposure time, chemical concentration, and mechanical energy. Although an efficient and effective cleaning process can be developed, oftentimes, the required operating parameters present a new set of challenges with regard to material compatibility.

Since their introduction, the newly developed pH neutral formulations have proven to be capable not only of removing these difficult post reflow residues from complex board geometries, but do so without affecting material compatibility of sensitive components. Additionally, they perform at low concentration levels. This study reviews the performance of pH neutral cleaning agents as compared to alkaline cleaning agent alternatives and includes field data demonstrating their effectiveness with regard to material compatibility and cleaning performance.

Conclusions


As reviewed in the background and introduction of this study, pH neutral cleaning agents held the promise of offering superior material compatibility and excellent cleaning results as compared to the inhibited alkaline cleaning agents currently available for various paste and flux residues. In this study, three case studies were presented, each with a different paste/flux vehicle and material compatibility constraints whereby a pH neutral process cleaning solution was identified.

In summary, pH neutral cleaning agents can in fact meet the stringent cleaning requirements expected, even with burnt-in flux residues from multiple heat cycles, while exhibiting excellent material compatibility and with lower wash concentrations as compared to alkaline alternatives. Additionally, it is environmentally friendly eliminating the need for waste water neutralization.

Initially Published in the IPC Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
01005 Component Challenges and Bugs
Insulation Between Overhanging Component Lead and Circuit Conductor
Sticky Residue Under Low Clearance Parts
Finding the Cause of Cold Solder Joints
Soldering Relays Intrusively in Lead Free Process
Printing vs. Dispensing
Maximum Board Temperature During Tin-Lead
Is There a Spacing Spec for SMD Components?
MORE BOARD TALK
Ask the Experts
Options for Reballing BGA Components
Solder Paste Viscosity
MSD Components Baked Too Long
Aluminum Trays and Rapid Static Discharge
Seeking IPC and J-STD Definitions
Is Component Lead Damage Reparable?
BGA Solder Ball Shelf Life
Conformal Coating Press Fit Connectors
MORE ASK THE EXPERTS