Authored By:
Ranjan Chatterjee, Cimetrix
UT, USA
Daniel Gamota, Jabil
CA, USA
Summary
The Vertical Segments of the Electronic Products Manufacturing Industry (Semiconductor, Outsourced System Assembly, and Test, and Printed Circuit Board Assembly) are converging and service offerings are consolidating due to advanced technology adoption and market dynamics. The convergence will cause shifts in the flow of materials across the supply chain as well as the introduction of equipment and processes across the segments. The ability to develop Smart Manufacturing and Industry 4.0 enabling technologies (e.g., big data analytics, artificial intelligence, cloud/edge computing, robotics, automation, IoT) that can be deployed within and between the Vertical Segments is critical.
A Smart Manufacturing Technology Working Group (TWG) was formed by International Electronics Manufacturing Initiative (iNEMI) that included thought leaders from across the electronic products manufacturing industry. The TWG published a roadmap that included the situation analysis, critical gaps and key needs to realize Smart Manufacturing.
Conclusions
The iNEMI Smart Manufacturing Roadmap Chapter provides the situation analysis and key attribute needs for the Horizontal Topics within the Vertical Segments as well as between the Vertical Segments. Also, the chapter identifies the primary gaps and needs for the Horizontal Topics that must be addressed to enable realization of Smart Manufacturing.
Initially Published in the SMTA Proceedings
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