Component Pressure Exposure Validation in An Inline Wash System
The purpose of this research is to measure what circuit cards and parts on those assemblies are exposed to during the wash and rinse process of inline cleaning.
Analysis Lab
DOWNLOAD
|
Authored By:
William Capen
Honeywell Federal Manufacturing and Technology
KS, USA
Eric Becker
ITW Electrovert
Summary
Inline cleaners are a fast and reliable method of cleaning printed wiring assemblies. These machines are designed to give maximum exposure to assemblies with cleaning solution and DI-Water. The challenge with these machines is that because of the way the machines are designed, it has always been a challenge to understand what the assemblies and the parts on those assemblies are seeing from a pressure exposure.
Why does pressure matter? Pressure matters because as technology becomes more complex certain parts are designed in such a way that large pressure exposure from the inline cleaner could in fact induce extreme damage. These parts may cost thousands of dollars and replacing them is not an option that manufacturers what to deal with or can afford.
The purpose of this research is to measure what circuit cards and parts on those assemblies are exposed to during the wash and rinse process of inline cleaning. This study will utilize numerous pressure sensor systems, strain gages and other tools to measure force and pressure on the parts of the circuit cards.
As part of this research two different simulations will be developed and used to compare against what the pressure sensing systems will measure as they are ran through the inline cleaning system. If differences are present, we will use a off the shelf pressure sensor system that will measure pressures as the pressure system travels through the inline cleaner. The second method of testing the pressure question will be using off the self-gorilla glass parts that are designed to simulate what real components would see during the standard inline cleaning process.
Conclusions
The data from both the gorilla glass testing and the pressure sensor testing indicate that a larger amount of testing is needed. Even though the gorilla glass never broke, the pressure sensor does indicate that pressure does drastically increase the closer to the bottom of the V-Jet nozzles the sensor was. Is this pressure enough to damage components to early to determine? With assemblies becoming denser and component packages becoming ever more ceramic based additional testing will be needed. That testing will happen in the next year.
Initially Published in the SMTA Proceedings
|
Comments
|
No comments have been submitted to date.
|
|
|
|
