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| Soldering, Selective, Wave | ||||||||||
| These programs cover manual and automated soldering, selective soldering, wave soldering and more. | ||||||||||
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This paper presents the methodology for evaluation of Underfills and Edgebond materials in combination with no-clean solder paste. Analysis Lab
QFN SMT components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performance and reliability. Production Floor
This paper documents the Collins Aerospace thermal cycle testing effort for the IPC PERM DoD consortium program. Analysis Lab
During wave solder some of the vias have concave fillets giving them a dimple effect. What can we do to create flatter fillets on via holes? Board Talk
A new methodology for solder joint reliability prediction taking into account the mechanical load as well as the thermal mismatch load between component, solder & PCB is proposed. Production Floor
After wave soldering we find dross particles on the circuit board surface. We cleaned and have the same problem. Do we have contamination? Board Talk
This paper will focus on the research and development of the Next Gen Pin-in-Ball Grid Array connectors, and the non-solder ball versions. Analysis Lab
This study reports a new near-eutectic Sn-Bi-based low-temperature solder alloy (Bi+) which can reflow between 165°C and 190°C. Materials Tech
Printed circuit board manufacturers are continually challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components. Production Floor
We plan to install a nitrogen environment around the wave soldering tank. Is this likely to improve our defective parts-per-million level? Board Talk |
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