Soldering, Selective, Wave



These programs cover manual and automated soldering, selective soldering, wave soldering and more.
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EOS Exposure of Components in the Soldering Process
EOS Exposure of Components in the Soldering Process
Examines the consequences of electrical overstress caused by electromagnetic interference on power lines and ground in the manufacturing environment.
Analysis Lab

Soldering Relays Intrusively in Lead Free Process
Soldering Relays Intrusively in Lead Free Process
We use intrusive reflow soldering on relays using a lead process. We are now challenged to also solder relays intrusively in a lead-free process. Our design has relays, bunched very close with gaps of only 4 mm. Phil Zarrow and Jim Hall, The Assembly Brothers, share their experiences.
Board Talk

Effects of Composition and Isothermal Aging on Microstructure Performance
Effects of Composition and Isothermal Aging on Microstructure Performance
Investigations of alloy composition and isothermal aging on solder microstructure and shear fatigue were performed on Pb-free alloy solder joints.
Analysis Lab

Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
The effect of micro-alloying to SAC based solder materials on component reliability was studied, considering various factors of solder paste and surface finish.
Materials Tech

Wettable-Flanks On Bottom-Termination Components in Mass Production
Wettable-Flanks On Bottom-Termination Components in Mass Production
Paper investigates the influence of wetting height of lead-frame based bottom-termination components on the performance of AO joint inspection.
Analysis Lab

Maximum Board Temperature During Tin-Lead
Maximum Board Temperature During Tin-Lead
IPC 709SC 6.4.2 discusses the maximum top-side board temperature for BGAs to be 150 degrees C during a tin-lead wave solder. Does anyone know how this temperature was determined? The Assembly Brothers, Jim Hall and Phil Zarrow, offer insight.
Board Talk

Optimization of Robotic Soldering Process: Solder Spread and Spattering
Optimization of Robotic Soldering Process: Solder Spread and Spattering
Robotic soldering is a growing market. We will present how cored wires with different flux percentages will affect robotic soldering performance.
Analysis Lab

Reliability Improvements by the Creation of Intermetallic Connections
Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech

Controlling Voiding Mechanisms in the Reflow Soldering Process
Controlling Voiding Mechanisms in the Reflow Soldering Process
This paper reviews the factors that influence the incidence of voids in small and large area solder joints in LED modules.
Analysis Lab

The Versatile Preform
The Versatile Preform
This paper discusses attributes within the solder families that the preforms are composed of and considerations when considering solder preforms.
Production Floor

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