Electronics Assembly Knowledge, Vision & Wisdom
Soldering, Selective, Wave
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These programs cover manual and automated soldering, selective soldering, wave soldering and more. Programs are sorted by published date, most recent first.


Impact of Lead-Free Components for High Reliability
Impact of Lead-Free Components for High Reliability
This paper has discussed some of the issues faced by organizations in the high reliability sector when adopting COTS and lead-free components.
Analysis Lab

Solder Column Attachment for Absorbing Large CTE Mismatch
Solder Column Attachment for Absorbing Large CTE Mismatch
Paper reviews commercially off-the-shelf solder columns available, including plain columns, copper wrapped columns and more.
Production Floor

Reliability Improvements by the Creation of Intermetallic Connections
Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech

TOF SIMS Analysis for SnO Determination
TOF SIMS Analysis for SnO Determination
During the production of Lead-Free Hot Air Solder Leveling (LF HASL), non-wetting issues in several components were found including BGA pad.
Analysis Lab

What Causes Solder Balls During Hand Soldering?
What Causes Solder Balls During Hand Soldering?
We have experienced solder balls during automated reflow. Now we are finding solder balls during the hand soldering.
Board Talk

Position Accuracy Machines for Selective Soldering Fine Pitch
Position Accuracy Machines for Selective Soldering Fine Pitch
Selective soldering is a robust soldering process. This paper explores the different process steps and critical parameters.
Production Floor

Dross Contamination After Selective Soldering
Dross Contamination After Selective Soldering
We have discovered a fine low density dross on PCBs after selective soldering. The dross is difficult to see. Is there an effective way to clean this?
Board Talk

A Control-Chart Based Method for Solder Joint Crack Detection
A Control-Chart Based Method for Solder Joint Crack Detection
The purpose of this study is to evaluate the effect of failure criteria on the reported thermal fatigue life and find out which failure criterion can detect failure sooner.
Analysis Lab

The Versatile Preform
The Versatile Preform
This paper discusses attributes within the solder families that the preforms are composed of and considerations when considering solder preforms.
Production Floor

What Causes Solder Icicles During Wave Soldering
What Causes Solder Icicles During Wave Soldering
Why are we getting solder icicles on some leads when we run boards in our wave solder machine? Where should be look first to change our process? The Assembly Brothers, Jim Hall and Phil Zarrow, share their insight and experience.
Board Talk

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