Electronics Assembly Knowledge, Vision & Wisdom
Soldering, Selective, Wave
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These programs cover manual and automated soldering, selective soldering, wave soldering and more. Programs are sorted by published date, most recent first.


Why is Solder Dross Sticking to Our PCBAs?
Why is Solder Dross Sticking to Our PCBAs?
After wave soldering we find dross particles on the circuit board surface. We cleaned and have the same problem. Do we have contamination?
Board Talk

Will Nitrogen Reduce Wave Solder Defects?
Will Nitrogen Reduce Wave Solder Defects?
We plan to install a nitrogen environment around the wave soldering tank. Is this likely to improve our defective parts-per-million level? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question.
Board Talk

Surface Treatment Enabling Low Temperature Soldering to Aluminum
Surface Treatment Enabling Low Temperature Soldering to Aluminum
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates.
Production Floor

Effect of Area Shape and Area Ratio on Solder Paste Printing Performance
Effect of Area Shape and Area Ratio on Solder Paste Printing Performance
The effect of aperture shape and orientation on solder paste printing performance is analyzed using stencil thicknesses, solder paste types and manufacturers.
Analysis Lab

Alloy Composition and Aging on the Survivability of Lead-Free Solders
Alloy Composition and Aging on the Survivability of Lead-Free Solders
A comparison of failure modes for different packaging architectures at elevated test temperatures and vibration has been presented in this study.
Analysis Lab

Selective Soldering Design for Reliability Using SIR Test Method
Selective Soldering Design for Reliability Using SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Analysis Lab

Rheology and Wetting Characterizations of Flux and Solder Paste
Rheology and Wetting Characterizations of Flux and Solder Paste
In this paper, we will discuss a solder paste wetting method. A high resolution solder wetting balance was used for the solder paste wettability analysis.
Production Floor

Low Melting Temperature Interconnect Thermal Cycling Performance
Low Melting Temperature Interconnect Thermal Cycling Performance
Low melting temperature for solder interconnection comes with benefits but one disadvantage is inferior thermal cycling performance due to the higher creep rate.
Analysis Lab

Converting Cable Assembly to Lead Free Solder
Converting Cable Assembly to Lead Free Solder
This paper reviews soldering applications associated with cable assembly. The focus is on process modification and qualification with lead free solders.
Production Floor

What Causes Solder Balls During Hand Soldering?
What Causes Solder Balls During Hand Soldering?
We have experienced solder balls during automated reflow. Now we are finding solder balls during the hand soldering.
Board Talk

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