Electronics Assembly Knowledge, Vision & Wisdom
Soldering, Selective, Wave
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These programs cover manual and automated soldering, selective soldering, wave soldering and more. Programs are sorted by published date, most recent first.


Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
A model that enables the scaling of solder joint failure cycles for board and die or substrate thickness effects under thermal cycling conditions is discussed.
Analysis Lab

Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
This paper presents data showing that localized distribution of recrystallized grains is an accurate indicator of solder joint life-cycle degradation and enhancement.
Analysis Lab

Simple Test for Flux Penetration
Simple Test for Flux Penetration
What is a good test for flux penetration through plated hole barrels on plated through hole circuit boards? A simple method is offered.
Board Talk

Problem Meeting Minimum Hole Fill During Wave Soldering
Problem Meeting Minimum Hole Fill During Wave Soldering
We are having problems achieving the minimum hole fill of 75% on electrolytic capacitors using our wave soldering. What do you suggest?
Board Talk

Reactivity of No-Clean Flux Trapped Under Bottom Terminated Components
Reactivity of No-Clean Flux Trapped Under Bottom Terminated Components
As components reduce in size, the flux residue formation during the reflow soldering process is altered which can impact the reliability of the final assembly.
Analysis Lab

Component Density on Solder Joint Reliability Under Harsh Environment
Component Density on Solder Joint Reliability Under Harsh Environment
In this study, degradation behavior of lead free solder joint was compared with mounted position and component density of vehicle engine control unit for excavator.
Analysis Lab

Advancement of Solder Paste Inspection (SPI) Tools to Support Industry 4.0 & Package Scaling
Advancement of Solder Paste Inspection (SPI) Tools to Support Industry 4.0 & Package Scaling
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability.
Analysis Lab

Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
Equipment has been developed to achieve void-free joints under these conditions utilizing modern condensation reflow technology.
Production Floor

Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
The purpose of this research is to develop a test method designed to evaluate the electrochemical reliability of the selective soldering process at the assembly site.
Analysis Lab

Solder Pallets With Titanium Inserts - Yes/No?
Solder Pallets With Titanium Inserts - Yes/No?
Our pallet manufacturer recommends titanium inserts to allow larger apertures near closely spaced surface mount components. Are they worth it? The Assembly Brothers, Jim Hall and Phil Zarrow, share their insights.
Board Talk

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