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These programs cover manual and automated soldering, selective soldering, wave soldering and more. Programs are sorted by published date, most recent first.
Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Surface Treatment Enabling Low Temperature Soldering to Aluminum
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates.
Behavior of Materials in the Manufacturing Environment
This document shows the effect of Dk and Df values from 10GHz to 20GHz and also shows their performance for lead-free assembly.
Solder Joint Embrittlement Mechanisms, Solutions and Standards
The paper describes four case studies of solder joint embrittlement, three with Sn63Pb37 and one with SnAg3.7 solder alloy.
Issues With Fillets on Via Holes?
During wave solder some of the vias have concave fillets giving them a dimple effect. What can we do to create flatter fillets on via holes? The Assembly Brothers, Phil Zarrow and Jim Hall, share their own experiences.
Rheology and Wetting Characterizations of Flux and Solder Paste
In this paper, we will discuss a solder paste wetting method. A high resolution solder wetting balance was used for the solder paste wettability analysis.
Challenges for Bottom Termination Components
Complex components designed to keep up with the demand for electronics with expanding capabilities are challenging the performance of traditional solder pastes.
Converting Cable Assembly to Lead Free Solder
This paper reviews soldering applications associated with cable assembly. The focus is on process modification and qualification with lead free solders.
Why is Solder Dross Sticking to Our PCBAs?
After wave soldering we find dross particles on the circuit board surface. We cleaned and have the same problem. Do we have contamination?
Will Nitrogen Reduce Wave Solder Defects?
We plan to install a nitrogen environment around the wave soldering tank. Is this likely to improve our defective parts-per-million level?
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