Electronics Assembly Knowledge, Vision & Wisdom
Soldering, Selective, Wave
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These programs cover manual and automated soldering, selective soldering, wave soldering and more. Programs are sorted by published date, most recent first.


Hand Soldering Reliability
Hand Soldering Reliability
Can you comment on potential differences in reliability for SMT machine placement followed by reflow soldering vs. hand placement followed by hand soldering in surface mount? The Assembly Brothers, Jim Hall and Phil Zarrow, address this question.
Board Talk

Opens With Assembled QFN Components
Opens With Assembled QFN Components
We are experiencing opens on assembled QFN components at a rate of approximately 9%. The component has two rows of pads and the failure only appears in rows near the component center. Our boards are double-side reflow and this component is mounted on the first side. What is happening?
Board Talk

EOS Exposure of Components in the Soldering Process
EOS Exposure of Components in the Soldering Process
Examines the consequences of electrical overstress caused by electromagnetic interference on power lines and ground in the manufacturing environment.
Analysis Lab

Wettable-Flanks On Bottom-Termination Components in Mass Production
Wettable-Flanks On Bottom-Termination Components in Mass Production
Paper investigates the influence of wetting height of lead-frame based bottom-termination components on the performance of AO joint inspection.
Analysis Lab

Effects of Composition and Isothermal Aging on Microstructure Performance
Effects of Composition and Isothermal Aging on Microstructure Performance
Investigations of alloy composition and isothermal aging on solder microstructure and shear fatigue were performed on Pb-free alloy solder joints.
Analysis Lab

Causes of Blowholes
Causes of Blowholes
Are old components such as resistors and circuit breakers more likely to cause blowholes during wave soldering compared to newer components? Phil Zarrow and Jim Hall, The Assembly Brothers, discuss this question.
Board Talk

Controlling Voiding Mechanisms in the Reflow Soldering Process
Controlling Voiding Mechanisms in the Reflow Soldering Process
This paper reviews the factors that influence the incidence of voids in small and large area solder joints in LED modules.
Analysis Lab

Transient Solder Separation of BGA Solder Joint  During Second Reflow Cycle
Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle
This paper covers a study of the mechanism for solder joint separation due to VIPPO and non VIPPO mixed designs.
Analysis Lab

Evaluation of Stencil Technology for Miniaturization
Evaluation of Stencil Technology for Miniaturization
The objective of this study is to assess the impact of various stencil materials and fabrication methods on the repeatability of solder paste deposition.
Production Floor

Simple Test for Flux Penetration
Simple Test for Flux Penetration
What is a good test for flux penetration through plated hole barrels on plated through hole circuit boards? A simple method is offered.
Board Talk

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