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Soldering, Selective, Wave << Page 1 of 14 >>
These programs cover manual and automated soldering, selective soldering, wave soldering and more.

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Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
A model that enables the scaling of solder joint failure cycles for board and die or substrate thickness effects under thermal cycling conditions is discussed.
Analysis Lab
Ask the Experts
Problems Hand Soldering 24 Layer Boards
We are assembling a back plane board with 24 layers. We are finding that the solder does not flow through to the other side of the board.
Ask the Experts
Ask the Experts
Improve DPPM for Wave Soldering Using Nitrogen
To improve our DPPM level we plan to install a nitrogen environment around the wave soldering tank. Is this likely to improve our DPPM level?
Ask the Experts
Risk Mitigation in Hand Soldering
Risk Mitigation in Hand Soldering
A new validation technology in concert with visual inspection represents a change to the status quo in hand soldering.
Production Floor
Inclusion Voiding in Gull Wing Solder Joints
Inclusion Voiding in Gull Wing Solder Joints
This paper provides definitions of the different voiding types encountered in gull wing solder joint geometries.
Analysis Lab
Voiding Control On Bottom Terminated Components Using Preforms
Voiding Control On Bottom Terminated Components Using Preforms
This paper looks at a new approach using readily available solder fortification preforms.
Production Floor
Fill the Void II: An Investigation into Methods of Reducing Voiding
Fill the Void II: An Investigation into Methods of Reducing Voiding
This paper is a continuation of previous work on voiding. The voiding results are summarized and recommendations made for reduction of voiding.
Production Floor
Selective Soldering for Interconnection Technology
Selective Soldering for Interconnection Technology
Paper evaluates three processes for selective surface mount soldering. A Xenon Lamp-based system, a hot air system, and a reflow oven system.
Production Floor
Reduction of Voids in Solder Joints
Reduction of Voids in Solder Joints
This paper reviews an alternative to vacuum soldering for the reduction of voids in solder joints.
Analysis Lab
What Causes Solder Balls During Hand Soldering?
What Causes Solder Balls During Hand Soldering?
We have experienced solder balls during automated reflow. Now we are finding solder balls during the hand soldering.
Board Talk
Soldering, Selective, Wave << Page 1 of 14 >>