Electronics Assembly Knowledge, Vision & Wisdom
Soldering, Selective, Wave
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These programs cover manual and automated soldering, selective soldering, wave soldering and more. Programs are sorted by published date, most recent first.


Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
Equipment has been developed to achieve void-free joints under these conditions utilizing modern condensation reflow technology.
Production Floor

Test Methods for Electrochemical Consistency in PCB Assembly Processes
Test Methods for Electrochemical Consistency in PCB Assembly Processes
This paper will review traditional and emerging methods to characterize flux residues and cleanliness of finished assemblies.
Analysis Lab

Solderability Testing Protocols and Component Re-Tinning Methods
Solderability Testing Protocols and Component Re-Tinning Methods
This paper addresses methods to enhance solderability including: component solderability test methodologies, gold embrittlement and removal of gold plating.
Analysis Lab

Copper-Tin Intermetallics: Their Importance, Growth Rate and Nature
Copper-Tin Intermetallics: Their Importance, Growth Rate and Nature
This paper will review the formation of copper-tin intermetallics, their growth rate, their effect on thermal cycle life, and drop shock performance.
Analysis Lab

Vapor Phase - Improvement Under Oxidation Free Soldering Conditions
Vapor Phase - Improvement Under Oxidation Free Soldering Conditions
Modern vapor phase soldering systems based on new technologies have eliminated the disadvantages inherent to condensation systems.
Production Floor

Crack Propagation Mechanism Study on Bismuth Contained Base Lead Free Solder Under Thermo-Mechanical Stress
Crack Propagation Mechanism Study on Bismuth Contained Base Lead Free Solder Under Thermo-Mechanical Stress
The thermal cycling reliability characteristics of solder containing a small amount of Bismuth which is below 4wt% in accordance with the new requirements were investigated.
Analysis Lab

Engineered Tin-Copper Alloys in Selective Soldering
Engineered Tin-Copper Alloys in Selective Soldering
The performance with one alloy under design conditions that make soldering difficult demonstrate the need to evaluate the performance differences.
Production Floor

Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
Reworkable Edgebond Applied Wafer-Level Chip-Scale Package
This paper presents data showing that localized distribution of recrystallized grains is an accurate indicator of solder joint life-cycle degradation and enhancement.
Analysis Lab

Board, Package and Die Thickness Effects Under Thermal Cycling Conditions
A model that enables the scaling of solder joint failure cycles for board and die or substrate thickness effects under thermal cycling conditions is discussed.
Analysis Lab

The Dynamics of Low Stress Epoxy Curing
The Dynamics of Low Stress Epoxy Curing
This study compares uniform variable frequency microwave (VFM) field cure to standard oven curing at temperatures below Tg (transition temperature).
Production Floor

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