Research & Technical Papers Technical papers are pulled from the database at Circuitnet. SUBMIT Research links are papers authored by your company that are hosted at Circuit Insight. Meeting Future Stencil Printing Challenges with Ultrafine Powder Pastes A comparison of the transfer efficiency of solder powder particle ... Assembly of POP with Novel Epoxy Flux on Solder Paste In this paper, a newly developed epoxy flux, that is ... Effect of Reflow Profiling on Solder Paste Flux Residues Paper studied the effect of reflow profiling on the electrical ... Challenges for Bottom Termination Components Complex components designed to keep up with the demand for ... Ultra-Low Voiding No-Clean Lead-Free Paste for Large Pads In this work, a new halogen-free no-clean flux solder paste ... Can Age and Storage Affect Performance of No-Clean Flux Residue? Solder paste flux chemistry, storage temperature, and age seem to ... Human-Induced Contamination on PCB Assembly This paper will discuss an experiment that was performed to ... Process Optimization for Fine Feature Solder Paste Dispensing In this paper the authors evaluate variables in the solder ... Low Cost Alternative to SAC Alloys Paper discusses some new SAC alloy options, comparing performance to ... Solder Fortification with Preforms PIP is not always possible to print enough paste to ... Stencil Printing for CSP's and 01005 Chips Printing solder paste is a challenge when larger components are ... No-Clean Flux Residue and Underfill Compatibility This paper covers an experiment designed to measure the electrical ... Best Practices - Reflow Profiling for Lead-free Paper covers best practices for optimizing the reflow process to ... Next Generation PoP Pastes This paper highlights some of the differences between traditional solder ... Voiding Control at QFN Assembly Thermal pad voiding control at QFN assembly is a major ... Selecting Fluxes for Lead-free Selective Soldering Paper touches on identifying flux properties, selecting low solids fluxes ... The Effects of Flux Residues on Reliability Paper discusses an experiment designed to mimic partially activated flux ... The Proliferation of Lead-free Alloys This paper is an overview of this lead-free alloy proliferation ... Stencil Printing: Circular vs. Square Apertures Paper covers practices for optimizing the printing process focusing on ... Understanding Surface Insulation Resistance This paper covers differences between two common surface insulation resistance ... Minimizing Voiding in QFN Packages This paper quantifies the preform requirements and process adjustments needed ... Drop Test Performance of BGA Assemblies In this work, BGA solder spheres using SAC105 with 0.02% ... Optimization to Prevent the Graping Effect This paper will discuss the specific challenge of the Graping ... Stencil Printing for Miniaturized Electronics Paper covers experimental data and process optimization techniques employed to ... A Robust Fine Feature Printing Process This paper evaluates many fine printing stencil factors that have ... Lead-Free Flux and Influence on Cleaning Lead-free flux technology is more difficult to clean. Cleaners with ... Implementing Halogen-free PCB Assembly This paper covers the reduction of halogenated compounds and techniques ...

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