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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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ASC International helps electronics manufacturers worldwide improve their production yield and profits.Using our portfolio of optical-based solder paste measurement systems, Automatic Optical Inspection (AOI) systems, process control tools and production equipment, we work closely with our customers to develop and implement yield improvement strategies that work... guaranteed. "
The circuit board assembly industry is becoming more competitive, while board configurations are becoming more complex and component sizes are decreasing.
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ASC International
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