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Hybrid Sintering for High-power Density Devices Aerospace Applications

Hybrid Sintering for High-power Density Devices  Aerospace Applications
This paper presents the results of a study aimed at developing high-power density devices for aerospace applications.
Materials Tech


Authored By:

Yuan Zhao, Bruno Tolla, Doug Katze, Glenda Castaneda, Ryan Yoshikawa and John Wood
Henkel Corporation
Irvine, California


With in-application reliability and fail-safe processes paramount, aerospace applications present unique challenges for materials suppliers. As aerospace electronic devices increase in power density to accommodate higher function, and energy-efficient, high operating temperature wide bandgap (WBG) semiconductors become more prevalent, new materials with robust thermal management capabilities and higher operating temperature ranges are required.

Recently, a hybrid technology that marries the high thermal performance of pure silver sintering materials with the reliability of epoxy-based die attach pastes has been developed and is a promising solution to address these challenges. This hybrid technology offers similar electrical and thermal performance as sintering pastes but has exhibits less voiding and is process-friendly, much like that of traditional die attach pastes. This paper presents the results of an application study aimed at developing this unique technology in the field of high-power density devices for aerospace applications.


Comprehensive experimental tests have been conducted to evaluate the bonding strength and thermal performance of semi-sintering die attach paste. The test results indicate that the semi-sintering TIM can maintain high bond strength and deliver ultra-high thermal performance which exceeds that of traditional die attach pastes and solders. SEM studies indicated that sintering quality was poor between the silver particles and component surfaces. Further development may need to focus on the interface between the component surfaces and silver particles.

Initially Published in the SMTA Proceedings


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