Research
Stencil Printing Yield Improvements
Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Solder Paste Selection for Bottom Termination Components Attach
Jetting Solder Paste Opens Up New Possibilities
Advances Autonomous Driving V2X Technologies
Surface Insulation Resistance of No-Clean Flux Residues
Jetting Conductive Adhesives with Silver Coated Polymer Particles
Residues on Probing PCBAS-Consistent Connections Across No-Clean Fluxes
MORE RESEARCH
Latest Industry News
Applying Strategic Sourcing Principles to Modern Procurement
Should You Trust Apple's New Blood Oxygen Sensor?
Cobalt demand for 5G technology to challenge electric vehicles
S. Korea to launch supercomputer for biotechnology in 2023
China needs first mover advantage in digital currency race
Top 10 Digital Transformation Trends For 2021
Chinese leaders split over releasing blacklist of U.S. companies
It's getting harder for tech companies to bridge the US-China divide
MORE INDUSTRY NEWS

How Does Printed Solder Paste Volume Affect Solder Joint Reliability?



How Does Printed Solder Paste Volume Affect Solder Joint Reliability?
Solder paste and stencil technology has been well studied. It is the aim of this work to correlate printed solder paste volume to solder joint reliability.
Materials Tech

DOWNLOAD

Authored By:


Tony Lentz
FCT Assembly
Greeley, CO, USA

Jasbir Bath
Bath Consultancy, LLC

N. Pavithiran (R&D Manager)
Nihon Superior
Ipoh, Perak, Malaysia

Summary


Printing of solder paste and stencil technology has been well studied and many papers have been presented on the topic. Very few studies have looked at how solder paste volume affects solder joint reliability. It is the aim of this work to correlate printed solder paste volume to solder joint reliability.

The circuit board chosen for this work includes a variety of component sizes and types. The components tested are as follows: 0402, 0603, 0805, and 1206 Imperial chip components (1005, 1608, 2012, 3216 metric); PLCC; SOT, and SOIC leaded components. In an effort to determine the lower limit of acceptable solder paste volume, printed volumes were varied between 25 and 125% of nominal. Solder joint quality was assessed using IPC-A-610 standard methods and cross-sectional analysis. Solder joint strength was measured using shear and pull tests. Thermal cycling between -40 ºC and 125 ºC was done for 1000 cycles and solder joint quality and strength was measured again.

In summary, the solder joint reliability data was correlated to printed solder paste volume. This was done in an effort to establish basic guidelines for the printed solder paste volumes required to generate reliable solder joints.

Conclusions


This study gives some guidelines on the effects of solder paste volume for certain components in terms of manufacturing yield and reliability. It is apparent that a wide range of solder paste volumes can be used to create acceptable solder joints, but if the solder volume is too low then solder joints may not be reliable. Changing solder paste volume can induce certain defects but these defects are correctable. It is advisable for PCB assemblers to set up their own standards for acceptable solder paste volume based on the components used.

Initially Published in the SMTA Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
Solder Pallets With Titanium Inserts - Yes/No?
What Rate is World Class for SMT Machines?
Selective Solder Pot Temperatures
Top Side Reflow Causing Solder Balls
Trends for Printing Ultra Miniature Chips
Should We Measure Solder Paste Thickness?
Cleaning R.F. Circuits - Aqueous or Vapor?
Why Should We Consider Smart Feeders?
MORE BOARD TALK
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS