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How X-Ray Technology is Improving the Electronics Assembly Process
Production Floor |
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Authored By:Griffin Lemaster and Bill Cardoso, Ph.D. Creative Electron, Inc. San Marcos, CA USA SummaryIt was 1895 when Wilhelm Roentgen discovered a mysterious light that allowed him to see through things – and called it x-rays. Since then, x-rays have been adopted in a wide range of applications in the electronics assembly process. Instead of taking a “deep-dive” in one aspect of x-ray inspection, in this paper we’ll cover a broad range of applications: - Electronic component inspection. - Real-time defect verification. - Counterfeit detection. - Component counting and material management. - Reverse engineering. - 2D, 2.5D, and 3D x-ray inspection. - Voids, bridging, and head-in-pillow failures in bottom terminated components - Design for manufacturing (DFM) and design for x-ray inspection (DFXI). - Artificial Intelligence We will also discuss how artificial intelligence (AI) is changing the way we think about x-ray inspection. Things we would never dream of doing just a few years ago are now reality by combining AI and x-ray inspection. Moreover, we will show you a series of real-life cases on how our team of AI scientists is using AI to solve the most challenging applications in x-ray inspection. And beyond x-ray inspection, we’ll examine how AI is forever changing the way in which we manufacture and inspect anything. ConclusionsElectronics assembly has advanced in several ways over the last several decades. With miniaturization necessary to make major advancements, the processes and standards used in manufacturing must be tightly controlled. X-ray imaging allows the internal inspection of products without any damage to the part. As more complex products are created, the technology behind x-ray inspection is also developing to keep pace. The advancements in AI and other image processing techniques will continue to push electronics manufactures to design for, and assemble the highest quality product. Initially Published in the SMTA Proceedings |
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