Research
Leadless Flip Chip PLGA for Networking Applications
Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
Designing a High Performance Electroless Nickel and Immersion Gold
Innovative of CU Electroplating Process for Any Layer Via Fillwith Planer Via Top and Thin Surface Copper
Acoustic Micro Imaging Analysis for 3D Packages
Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion
Rework Challenges for Leading Edge Components BGA, QFN and LED
Compatibility and Aging for Flux and Cleaner Combinations
MORE RESEARCH
Latest Industry News
Globalization strikes back
Self-driving technology reaches a crossroads
The Art of Wanting Less
Amazon is everywhere. Here's how the US could break it up
The Best Laptops 2021
Foxconn installs advanced packaging equipment at China plant
Foxconn installs advanced packaging equipment at China plant
Here’s the latest proof that Apple is fixing the iPhone notch
MORE INDUSTRY NEWS

Risk for Ceramic Component Cracking Dependent



Risk for Ceramic Component Cracking Dependent
The paper discusses the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses.
Analysis Lab

DOWNLOAD

Authored By:


J. Trodler Dipl.-Ing.
Heraeus Deutschland GmbH&Co.KG,
Hanau Germany

R. Dudek Dr.-Ing., Fraunhofer ENAS, Chemnitz Germany
M. Rollig Dr.-Ing., Fraunhofer IKTS, Dresden Germany

Summary


New solder alloy development for high temperature applications have increased the last few years; for example, automotive applications now use both Innolot and/or HT1 alloys, especially when the devices have to work at temperatures up to 170 Celsius. For the solder alloy and the interconnection itself, there are some fatigue life advantages when using Innolot, especially for thermal cycles - 40/+150 Celsius. On the other hand, by using Innolot there is a relatively high thermo-mechanical stress induced which can create ceramics defects at the passive components. The paper will compare and discuss the differences of the alloy, based stress in ceramic components due to passive cycle tests, real customer tests, and stress analyses based on the finite element method.

Conclusions


During physical testing, standard SAC alloys show fatigue, while both high temperature alloys produced acceptable results for the solder joint, and the IL alloy produced a ceramic crack after TCT. Due to additional active TCT tests, utilizing other alloys, there were also similar results detected. Field test conditions that seems to be non-critical. By an FEM it has been analyzed the stress on the passive components with different alloys. With regard to component stress, IL was determined to be the most critical alloy, with HT1 producing the lowest stress. Therefore, when there is a risk of ceramic cracks, using an alloy with a higher shear rate may provide a possible solution. Further activities will analyze other combinations such as devices with conformal coating etc. In addition, the knowledge can influence the quality of the ceramic passive components.

Initially Published in the SMTA Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
What Causes Solder Icicles During Wave Soldering
Modify Rework Procedures for Assemblies Fabricated Using OSP?
Can High Particle Concentrations Impact PCB Assembly?
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
Moisture Barrier Bag Issues
Trouble With Skewed DPAK Components
Can Mixing Wave Solder Pallets Cause Contamination?
How to Reduce Voiding on QFN Components
MORE BOARD TALK
Ask the Experts
Suggested Limit for PCBA Heat Cycles
Average Temperature/Humidity for an Electronics Assembly Facility?
ENIG Solderability Issues
Very Low Temp PCBs
0201 Pick & Place Nozzle Plugging
IPC-A-610 Class 3 - IPC-A-600 Class 2
BGA Solder Ball Collapse
Baking After Cleaning Hand Placed Parts
MORE ASK THE EXPERTS