Research
Leadless Flip Chip PLGA for Networking Applications
Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
Designing a High Performance Electroless Nickel and Immersion Gold
Innovative of CU Electroplating Process for Any Layer Via Fillwith Planer Via Top and Thin Surface Copper
Acoustic Micro Imaging Analysis for 3D Packages
Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion
Rework Challenges for Leading Edge Components BGA, QFN and LED
Compatibility and Aging for Flux and Cleaner Combinations
MORE RESEARCH
Latest Industry News
Globalization strikes back
Self-driving technology reaches a crossroads
The Art of Wanting Less
Amazon is everywhere. Here's how the US could break it up
The Best Laptops 2021
Foxconn installs advanced packaging equipment at China plant
Foxconn installs advanced packaging equipment at China plant
Here’s the latest proof that Apple is fixing the iPhone notch
MORE INDUSTRY NEWS

Expanding IEEE Std 1149.1 Boundary-Scan Architecture



Expanding IEEE Std 1149.1 Boundary-Scan Architecture
This paper discusses the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects.
Production Floor

DOWNLOAD

Authored By:


Jun Balangue
Keysight Technologies

Summary


This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly (PCBA).
The following topics will be discussed to demonstrate the capability of boundary-scan test system on how we can extend beyond typical manufacturing test:

1. Boundary-scan as a complete manufacturing test system - A boundary-scan test system should be able to cover all the needs of a manufacturing test to be an effective solution.

2. Boundary-scan implementation during PCBA design stage - This topic will discuss the importance of design for test (DFT) at the early stage of PCBA design to maximize the use of boundary-scan to lower the cost of test while increasing the test coverage.

3. Implementation of boundary-scan beyond typical structural testing - While capturing structural defects are important during manufacturing test, the need for boundary-scan to include other areas beyond PCBA structural testing is now necessary.

Conclusions


Boundary-scan tools are now capable to interpret and convert the binary files or configuration (CFG) files supplied by the ASIC designer or vendor to execute Built-in self-test (BIST) such as memory BIST, Logic BIST and other custom function test that will help extend the coverage of a board during boundary-scan testing.

The boundary-scan 1149.1 along with the new enhancements and standards such as - IEEE 1149.6 and IEEE 1687 will redefine the testing strategy for PCBA, not only in the In-Circuit Test but including various areas of manufacturing such as - functional test, burn in and repair as well as the prototype and NPI stages of the product which will help the industry in ensuring testability of the next generation of PCBAs and streamlining the efficiency of the test systems.

Initially Published in the IPC Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
What Causes Solder Icicles During Wave Soldering
Modify Rework Procedures for Assemblies Fabricated Using OSP?
Can High Particle Concentrations Impact PCB Assembly?
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
Moisture Barrier Bag Issues
Trouble With Skewed DPAK Components
Can Mixing Wave Solder Pallets Cause Contamination?
How to Reduce Voiding on QFN Components
MORE BOARD TALK
Ask the Experts
Suggested Limit for PCBA Heat Cycles
Average Temperature/Humidity for an Electronics Assembly Facility?
ENIG Solderability Issues
Very Low Temp PCBs
0201 Pick & Place Nozzle Plugging
IPC-A-610 Class 3 - IPC-A-600 Class 2
BGA Solder Ball Collapse
Baking After Cleaning Hand Placed Parts
MORE ASK THE EXPERTS