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Board Level Reliability Comparison of BGA and LGA Packages
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Authored By:Robert Darveaux, Howard Chen, Shaul Branchevsky, Bhuvaneshwaran Vijayakumar Skyworks Solutions, Inc. Irvine, CA, USA Ben Zarkoob, Wyatt Huddleston, Christopher J. Berry, Amkor Technology, Inc. Chandler, AZ, USA Fenimore Chen Integrated Service Technology, Inc. Hsin-chu City, Taiwan R.O.C. SummaryThe present study compares board level reliability of both BGA and LGA packages mounted to motherboards with an LGA footprint. SMT yield, drop test performance, and thermal cycle performance were evaluated. Finite element analysis was also used to compare with the measured reliability testing. Both the BGA and LGA devices self-align well without open, shorted, or inconsistent solder joints. The package can be displaced off the pad by no more than 0.200mm, and solder paste misprinting must be limited to 0.050mm. There were no confirmed failures in solder joints up to 3042 temperature cycles. Simulation predicts that the LGA package should have 1.5X longer fatigue life than the BGA package due to a larger perimeter I/O pads, and additional ground pads in the interior of the module. There were no failures in drop testing up to 400 cycles. Overall, both modules showed excellent board level reliability that far exceeds typical consumer product requirements. ConclusionsBoth the BGA and LGA devices self-align well without open, shorted or inconsistent solder joints. The maximum allowable displacement off the pad is 0.200mm, and solder paste misprinting must be limited to 0.050mm. There were no confirmed failures in solder joints up to 3042 temperature cycles. Simulation predicts that the LGA package should have 1.5X longer fatigue life than the BGA package due to a larger perimeter I/O pads, and additional ground pads in the interior of the module. There were no failures in drop testing up to 400 drop cycles. Overall, both modules showed excellent board level reliability that far exceeds typical consumer product requirements. Initially Published in the SMTA Proceedings |
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