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01005 Component Challenges and Bugs



01005 Component Challenges and Bugs
We are going forward with assemblies that use 01005 components. We're wondering if you have some input as to the challenges we will face.
Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Process Troubleshooting, Failure Analysis, Process Audits, Process Set-up
CEM Selection/Qualification, SMT Training/Seminars, Legal Disputes
Phil Zarrow
Phil Zarrow
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall
Jim Hall
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

Transcript


Phil
Welcome to Board Talk with Jim Hall and Phil Zarrow of ITM Consulting, the Assembly brothers. We're here to talk about electronic assembly; materials, equipment, components, practices and procedure, and who knows what else.  Who does know what else? Jim does because he's got the question of the day.

Jim
We are going forward with assemblies that use 01005 components. We're wondering if you would have some input as to what the most important challenges we are going to face. It's sent by T.G.  

Well your whole world's about to change and maybe come crashing down. Everything that you do just got harder from loading a feeder to picking up a component, inspecting it, handling it, printing the solder paste for it, everything in the line.  

Reflowing gets easier because, believe it or not, 01005s have a lower tendency to tombstone than 0201s. That is the one redeeming grace that I have ever heard about processing 01005s.

Phil
But first you have to surmount all of the hurdles Jim mentioned to get to reflow machine and a lot of people think the obvious pick and place and there are a lot of pick and place issues.

As Jim mentioned; feeding, how the component's sitting in the pocket on the tape and real, how it's being picked up, also how it's being released. There's been modified pick and place tooling for various affects so the buggers don't get caught. Then of course there's printing.

Jim
I want to go back to placement for a while. Think about putting a reel of these into a feeder. The operator is manually loading them, stripping back the tape to get a pocket with a component, your operators can barely see that there's a component in the pocket.

That's the reality of dealing with these without magnification. If you're splicing tapes on the fly just the simple thing as loading a feeder can become an issue.  

Finding the part in the pocket; tolerance is so small sometimes some people find they have to use their vision system to find the parts in the pockets.  Hopefully you don't have to go that way but I'm just emphasizing how every part has now become more critical.

I think that printing is far and away the biggest problem.  

Basically you're dealing with very small apertures. If you were printing a cellphone where everything is ultra-miniaturized and you can you use a 3 mil stencil then the problem isn't so bad but most people have other larger components where they would like to use a 5 mil stencil or at least a 4 mil stencil.

The apertures get really small and you begin to get, as I would call, tall narrow apertures when you make them small enough for your 01005 pads. So you're faced with the situations of step stencils, enhanced stencil materials such as e-fab or nano-coatings and things like that.

Bottom line, to get consistent fill, complete fill, and repeatable release of solder paste from these tiny apertures becomes a bigger and bigger challenge.

Make sure if you're using AOI that it has the resolution to identify these parts.  Older systems, the camera pixels were not really sharp enough to give you good repeatable inspection of these even though they're just a simple resistor or a capacitor component.  

Phil
As Jim said at the outset your whole world is changing and there are so many implications.

But it is doable, lots of other people are doing them. Master 01005s and then see what your designers throw in that's even smaller. They're out there.

On that note this is Complete Phil and Complete Jim coming to you from Board Talk and we thank you for listening. Whatever you do no matter what size components you're doing them with, don't solder like my brother.  

Jim
And don't solder like my brother.

Comments

One of the biggest factors when working with 01005s, believe it or not, is maintaining the proper humidity in the automation area. If the humidity levels are below 40%RH, just that little bit more static can cause all kinds of issues with the charge buildup from removing the cover tape. We found that during setup, removing the leader under an ionizer was a huge benefit in preventing the relatively minor static field that caused these tiny parts to jump out of the carrier tape pockets once loaded into the machine. Maintain the humidity at 60% to 70% and everything becomes a lot easier. This is well-documented in the IPC Standards (sorry Walt!).
Richard Stadem, Kongsberg Defence AS
We moved to 01005 parts a few years back to get increased density. Our first few months were horrible for assembly yield until we found that our assembly house could not reduce the placement force low enough on the pick & place machine and it was cracking resistors (leaving latent defects). Since moving to a new assembly shop, all has been running smoothly.
Steve Wint, Astek Corporation
Mike, Interesting comment on adhesive carrier tapes. Surftape is a adhesive based tape and is still available today. However I am sure some testing would need to be done for these very small devices.
Tim Hemken, Advantek, Inc.
Any thoughts on adhesive based carrier tapes? 01005s can be taped at 4 times the density of pocket tapes and they stay where they are put. If my math is correct that means 4 times fewer splices.
Mike Wendt, MWC, Inc., USA

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