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Void-Free Soldering With Vapor-Phase Vacuum Tech
This paper explores equipment that has been developed to achieve void-free joints using modern condensation reflow technology.
Production Floor
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Authored By:
Claus Zabel
Asscon
Konigsbrunn, Germany
JB Byers
A-Tek Systems Group
Longmont, CO, USA
Summary
Voids in solder joints are largely a function of differential pressure between vapor pressure of the gases inside of the joint and environmental conditions. By entering joints still in their liquid state into decompression chambers, voids can be eliminated. Equipment has been developed to achieve void-free joints under these conditions utilizing modern condensation reflow technology.
Initially Published in the SMTA Proceedings
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