Authored By:
Albert Chen
Elite Material Co., Ltd.
Taiwan, ROC
Summary
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The material suppliers, PCB manufactures, OEM designer commonly face the serious issue "how to keep signal integrity operated in the high speed transmission" for the modern electronic application nowadays.
The material suppliers dedicated into developing lower dielectric constant and dissipation factor material, PCB manufactures define the low loss material and copper foil selection guide and more delicate process handling. The OEM specify the signal integrity form the insertion loss and extracted material Dk / Df from signal loss result . All of these are for keeping signal could be transmitted completely at higher bandwidth.
We discuss the following factors affect insertion loss result in this paper, such as material Dk / Df , copper foil type, skin effect, impedance variation, line width , line space, black / brown oxide treatment, dielectric thickness, via stub effect and so on through TDR and VNA measurement and simulation analysis result. We hope we could more understand the mystery of signal loss issue through these discussions and meet the signal loss specification from the OEM designer.
Initially Published in the IPC Proceedings
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