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A New Line Balancing Method
Electromigration in Tin-Bismuth Planar and Bottom Terminated Solder Joints
The Effect of Sb and Ag Addition on the Behavior of Sn-Bi LTS
Design for Testability to Overcome Functional Board Test Complexities
Generalizations About Component Flatness at Elevated Temperature
The Effects of PCB Fabrication on High-Frequency Electrical Performance
Stencil Printing Yield Improvements
Reterminated RoHS Components for SnPb Applications
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Insertion Loss Comparisons of High Frequency PCBs
PCBs have been used for many years in low loss, high frequency microwave applications and many have become increasingly complex.
Materials Tech
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Authored By:
John Coonrod, Rogers Corporation
Initially Published in the IPC Proceedings
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Board Talk
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