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Low Temperature SMT Solder Evaluation
Conformal Coating - Performance Comparison Environmental Testing
ENEPIG - How the Process Characteristics Influence the Layer Performance
Position Accuracy Machines for Selective Soldering Fine Pitch
Effect of Area Shape and Area Ratio on Solder Paste Printing Performance
Nano Silver Replacement for High Lead Solders
Innovative Panel Plating for Heterogeneous Integration
Advances in Power Electronics
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Insertion Loss Comparisons of High Frequency PCBs
PCBs have been used for many years in low loss, high frequency microwave applications and many have become increasingly complex.
Materials Tech
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Authored By:
John Coonrod, Rogers Corporation
Initially Published in the IPC Proceedings
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