Honeywell International, Aerospace
Advance Manufacturing Engineering
Technology Group organization
Phoenix, Arizona USA
Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology have a great potential for high frequency and high density applications. It also provides better signal performance, reduced parasitic and cross talk.
This paper summarizes the selection of resistor embedded materials, evaluations of resistive material (Phase 1) and dplication of a complex digital design (Phase 2). Phase 1 - resistive materials (Foil 25Ω/sq NiCr and 1kΩ/sq CrSiO) and resistive-Ply materials (25Ω/sq and 250Ω/sq NiP) were chosen for evaluation.
Phase 2 - Due to the high level of complexity and advance materials dielectric, the Digital Imaging Processor unit was chosen as an evaluation vehicle. Process Evaluation for embedded was used to determine present process gaps for laser trimming, fabrication material, raw board test and defining specifications for DFM and layout design.
The Advanced Manufacturing Engineering (AME) technology group has been involved in the evaluation of embedded passive technology as part of the Game Changers technology. The game changer of the EPT was defined into three different phases; phase 0 was completed in 2009 to define the type of resistive materials that are available.
Phase 1 was completed in 2010 and resistive material types were selected, a test vehicle was designed and fabricated, assembled and tested. Phase 2 is in the final phases of completion, where a high complexity Circuit Card Assembly (CCA) was selected using Thermount based material for PB fabrication with 4 layers of EPT.
Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. EPT's value is creating space on a crowded PCB where more active components are needed. Embedding resistors and capacitors can increase board functionality without increasing board size. It also provides better signal performance, reduced parasitic and cross talk.
EPT can increase reliability by eliminating surface mount devices and the defects associated with assembly processes such as placement and soldering. Multiple circuit board fabricators in the US have experience in utilizing embedded passive technology. Design aids including Ticer's Resistor Calculator are available on the AME website.
Initially Published in the IPC Proceedings