Research
Stencil Printing Yield Improvements
Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Solder Paste Selection for Bottom Termination Components Attach
Jetting Solder Paste Opens Up New Possibilities
Advances Autonomous Driving V2X Technologies
Surface Insulation Resistance of No-Clean Flux Residues
Jetting Conductive Adhesives with Silver Coated Polymer Particles
Residues on Probing PCBAS-Consistent Connections Across No-Clean Fluxes
MORE RESEARCH
Latest Industry News
The Exodus Of Chinese Manufacturing
Autonomous Vehicles in China
How Much Gold Is in Your Computer and How Efficient It Is to Reclaim It
All must come aboard for a smooth ride to a carbon-neutral future
Memory Technologies Confront Edge AI's Diverse Challenges
How to Make Big Decisions When Facing an Unpredictable Future
Gartner Says Worldwide Robotic Process Automation Software Revenue to Reach Nearly $2 Billion in 2021
China rolls out fresh policies to boost hydrogen vehicle sales
MORE INDUSTRY NEWS

Cost Effective 3D Glass Microfabrication



Cost Effective 3D Glass Microfabrication
In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX Glass ceramic to create various interposer technologies.
Production Floor

DOWNLOAD

Authored By:


Jeb H. Flemming, Kevin Dunn, James Gouker, Carrie Schmidt, Roger Cook

3D Glass Solutions, Life BioScience
4343 Pan American Frwy NE
Albuquerque, NM 87107

Summary


Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility needs in consumer electronics. Furthermore, IC packaging is widely seen as a method to prolong Moore's law. Historically, silicon has been the material of interest or interposer materials given its prevalence in IC production, but it presents many technical and costs hurdles.

In contrast, glass interposer technology presents a low cost alternative, yet attempts at producing advanced through glass vias (TGVs) arrays using traditional methods, such as laser ablation, have inherent process flaws, such as reduced interposer mechanical strength and debris sputtering among others.

In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX Glass ceramic to create various interposer technologies. This extended abstract will present on the production of large arrays of 10 micron diameter TGVs, with 20 micron center-to-center pitch, in 100 micron thick APEX Glass ceramic and the comparisons of wet etching of APEX Glass vs. laser ablation.

Conclusions


APEX Glass is an ideal substrate for 2.5D and 3D IC packaging applications. Wafer processing is accomplished through standard batch IC processes enabling a low cost alternative to silicon interposers. Furthermore, wet etching of the 3D structures, such as TGVs, produces a micro fracture-free product, leading to a more reliable product. 3D Glass Solutions has demonstrated the optimized production of 8 million 10 micron.

Initially Published in the IPC Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
Solder Pallets With Titanium Inserts - Yes/No?
What Rate is World Class for SMT Machines?
Selective Solder Pot Temperatures
Top Side Reflow Causing Solder Balls
Trends for Printing Ultra Miniature Chips
Should We Measure Solder Paste Thickness?
Cleaning R.F. Circuits - Aqueous or Vapor?
Why Should We Consider Smart Feeders?
MORE BOARD TALK
Ask the Experts
BGA reballing question
Conformal Coating Press Fit Connectors
Dust contamination after selective soldering
Moisture Sensitivity Level for Bare Boards
Contamination Using Solvent Dispensers
Challenges Placing RF Shields During SMT Assembly
Seeking Advise for a Solder Reflow Recipe
Critical Part Fixture During Reflow
MORE ASK THE EXPERTS