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The Development of Hybrid Therma-EMI Solutions for Electronics
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Detect PCB Stack-up Error with Machine Learning Methods
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Mechanical Stress and PCB Depaneling
Inspired by a recent program from the Assembly Brothers, Shane and Mirela discuss 4 methods for depaneling PCBs and which cause the most mechanical stress to boards.
Production Floor
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Authored By:
Shane Stafford, Market Development Representative
Mirela Orlowski, Laser Sales Engineer
LPKF Laser & Electronics
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Board Talk
Cause of Long-Term Soldering Joint Cracking in Automotive Application
Hand Soldering Reliability
Does HASL or ENIG Reduce Creep Corrosion in Corrosive Environments?
Opens With Assembled QFN Components
Tips When Moving a Reflow Oven
Issues With SMT Component Alignment
No-Clean Residue Shorts
How To Strip Tin-Lead Solder From SMT Pads for RoHS
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Ask the Experts
Coils Rotated After Reflow
Ultrasonic Cleaning and Surfactants
Reflow Oven Calibration Schedule
Flux Residue During Pin-in-Paste
Matte Black Solder Mask Defects
Conformal Coating in Nitrogen Environment
BGA Placement Paste or Only Flux
Solder Paste Thickness Measurements
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