LGA/QFN Packages Floating During Reflow
Industry expert Bob Willis explains why LGA/QFN packages may float during reflow and how this defect may be associated with excess voids and open solder joints.
Defect of the Month
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Defect of the Month are short informative programs produced by Bob Willis.
Bob is an electronics manufacturing consultant providing solutions for process and product failure trouble shooting, in-house training, process engineering support
on conventional and SMT,
lead-free production plus process and product failure analysis.
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