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Implementing Automation and Ai for Electronic Card Assembly
Component Pressure Exposure Validation in An Inline Wash System
Managing blooming in an adhesives process
Risk Mitigation in Hand Soldering
Oxide Alternative Process for High Frequency Bonding Applications
New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly
Cost Comparison of Complex PCB Fabrication
Failure Modes in Wire Bonded and Flip Chip Packages
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Latest Industry News
A New Alliance Is Advancing Augmented Reality
North American PCB Industry Sales Down 11.6% in February
AI: What is it Good For?
The Proactive Approach to Obsolescence
China-made vehicles will comprise a quarter of Europe’s EV sales this year, study shows
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Process Cleaning Rate Theory
In this video Dr. Mike Bixenman, Chief Technology Officer of Kyzen, explains the process cleaning rate theory and how to use it.
Production Floor
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Board Talk
What is Ideal Humidity for Final Assembly?
Step Stencil Setup
Is No-Clean the Trend for QFN Components?
Acceptable Rate for Head in Pillow?
Why Do Our Boards Warp During Reflow?
What Rate is World Class for SMT Machines?
Should Apertures be Home Plate or Inverted Home Plate?
Is Customer Approval Required for Class 3 Repair?
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Ask the Experts
3D AOI Solder Joint Qualification Parameters
Cause of Cracking on SOT23 Components
ESD Ground Wire Gauge
Soldering Station Calibration
Maximum Allowable Time Prior to Washing When Using Water Soluble Paste
Out-gassing and Cleaning
QFN Open Solder Joints
BGA BAll Sheer Testing
MORE ASK THE EXPERTS