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Embedded Packaging Technologies



Embedded Packaging Technologies
Paper covers the design, packaging processes, and technology demonstrations of prototypes packaged using embedded technology.
Materials Tech

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Authored By:


Casey H. Cooper
STI Electronics, Inc.
Madison, AL USA

Summary


As the electronics industry moves toward smaller form and fit factors, advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are not driven by circuit design capabilities but by an inability to reliably package these circuits within the space constraints. Innovative packaging techniques are required in order to meet the increasing size, weight, power, and reliability requirements of this industry without sacrificing electrical, mechanical, or thermal performance.

Emerging technologies such as those imbedding components within organic substrates have proven capable of meeting and exceeding these design objectives. Imbedded Component/Die Technology (IC/DT) addresses these design challenges through imbedding both actives and passives into cavities within a multi-layer printed circuit board (PCB) to decrease the surface area required to implement the circuit design and increase the robustness of the overall assembly.

A passive thermal management approach is implemented with an integrated thermal core imbedded within the multi-layer PCB to which high power components are mounted directly. This paper discusses the design methodology, packaging processes, and technology demonstrations of prototypes packaged using this technology. The various prototypes designed and manufactured using this technology will be presented. KEYWORDS: Embedded Packaging Technology, Imbedded Components, Bare Die, Miniaturization, Form Fit and Function, 3D Assembly, Cavities, Thermal Core, Wire Bonds, Reliability, Material Characteristics, Conductive Adhesives,Hi-Rel, Multi-layer PCB

Conclusions


It is through the development of new materials and processes, i.e. packaging technologies, that have enabled the electronics industry to continue placing leap-ahead technology in the hands of consumers. The embedded packaging technology presented in this paper, Imbedded Component/Die Technology, is just one example of how leading-edge technologies can help system designers meet their size, weight, and power (SWAP) requirements in a cost-effective and reliable manner.

Although imbedding components brings unique design and fabrication challenges over conventional technologies such as SMT, the prototypes presented are a demonstration that imbedding components in single-cavity and multi-cavity designs is both feasible and reliable. The testing of the two test vehicles demonstrated that this technology is a robust packaging technology for use in products that must operate in harsh environments.

The first two test vehicles discussed in this paperhave proven that the design guidelines, materials, and process parameters used to manufacture imbedded assemblies arecapable of withstanding temperature, humidity, and shock stresses. Lastly, the recent prototypes designed and tested are a testament to the ability of packaging technologies to adapt to meet the toughest form, fit, and function requirements without sacrificing electrical, mechanical, or thermal performance

Initially Published in the IPC Proceedings

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