Research
Impractical Stencil Aperture Designs to Enable M0201 Assembly
Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Microalloyed Sn-Cu Pb-Free Solder for High Temp
Selective Reflow Rework Process
Impact of Thermal Loading on the Structural Intergrity of 3D TSV Package
Design and Fabrication of Ultra-Thin Flexible Substrate
Influence of PCB Surface Features on BGA Assembly Yield
Last Will and Testament of the BGA Void
MORE RESEARCH
Latest Industry News
Print These Electronic Circuits Directly Onto Skin
Compal increasingly asked to diversify production bases
Intel's margins tumble as customers shift to cheaper chips, shares slide 10%
From Foldable Phones to Stretchy Screens
6 Considerations for Integrating Sensors in Vehicles
Bill Gates Says Unhappy Customers Are Good for Your Business. Here's Why.
iPhone 12 review: Upgrade for the camera, not 5G
Apple's shifting supply chain creates boomtowns in rural Vietnam
MORE INDUSTRY NEWS

Does Contamination Affect Whisker Formation?



Does Contamination Affect Whisker Formation?
This paper will review select failures due to metal whisker formation shorting and data of controlled whisker growth.
Analysis Lab

DOWNLOAD

Authored By:


Terry Munson and Paco Solis
Foresite Inc.
Kokomo, Indiana USA

Transcript


Foresite has investigated many whisker failures and found that consistent high levels of chloride, sulfate and amines are present in and around the areas of whisker formation even in hot dry environments with high stress conditions in the solder joints.

Using new techniques to extract pockets of contamination to isolate a specific area we can qualify the ionic residues on the surface and at the subsurface level. This paper will show supporting evidence that localized levels of contamination have an effect on the dissolution and stress conditions that feed whisker formations.

In addition, this paper will review some select failures due to metal whisker formation shorting and data of controlled whisker growth under contamination, and new growth under clean conditions of plated and solders surfaces.


Summary


Foresite has investigated many whisker failures and found that consistent high levels of chloride, sulfate and amines are present in and around the areas of whisker formation even in hot dry environments with high stress conditions in the solder joints.

Initially Published in the IPC Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
Causes of Blowholes
Tips When Moving a Reflow Oven
Assembling Boards with BGAs on Both Sides
Larger Stencil Apertures and Type 4 Paste
5 vs 8-Zone Ovens
Component Moisture Question?
BGA Components and Coplanarity
How To Verify Cleanliness After Rework and Prior to Re-coating?
MORE BOARD TALK
Ask the Experts
Initial Screen Print Test Board
HASL Surface Finish and Coplanarity
Legend Marking Discoloration
Cleanliness Testing
Stencil Cleaning Frequency
Exposed Copper Risk
Spotting After DI Water Cleaning
ESD Grounding - 1 Meg Ohm Resistor
MORE ASK THE EXPERTS