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Does Contamination Affect Whisker Formation?
This paper will review select failures due to metal whisker formation shorting and data of controlled whisker growth. Analysis Lab
Terry Munson and Paco Solis
Foresite Inc.
Kokomo, Indiana USA
Transcript
Foresite has investigated many whisker failures and found that consistent high levels of chloride, sulfate and amines are present in and around the areas of whisker formation even in hot dry environments with high stress conditions in the solder joints.
Using new techniques to extract pockets of contamination to isolate a specific area we can qualify the ionic residues on the surface and at the subsurface level. This paper will show supporting evidence that localized levels of contamination have an effect on the dissolution and stress conditions that feed whisker formations.
In addition, this paper will review some select failures due to metal whisker formation shorting and data of controlled whisker growth under contamination, and new growth under clean conditions of plated and solders surfaces.
Summary
Foresite has investigated many whisker failures and found that consistent high levels of chloride, sulfate and amines are present in and around the areas of whisker formation even in hot dry environments with high stress conditions in the solder joints.
Initially Published in the IPC Proceedings
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Essential guide for hi-rel BGA re-balling
Re-balling of BGA's with tin-lead solder is required in some hi-rel applications due to tin whisker concerns. This white paper discusses the key considerations of this specialized process. Read more. Circuit Technology Center
