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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
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Designs and manufactures a range of cost-effective turnkey solutions for surface mount and through hole assembly systems for low to medium volume OEM and contract manufacturers.
Equipment includes manual and automatic stencil printers, manual and automatic pick & place systems with dispensers, wave solder and models of selective solder machines, lead-free solder-reflow ovens (including models with exclusive patented horizontal convection), component counters, and through-hole rework systems.
Our newest products include the 'NovaPlace' pick and place machine and the 'NovaSelect' selective solder machine.
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DDM Novastar Inc.
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