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Best alternative to dispensed adhesives
PLACE-N-BOND underfilm eliminates dispensing and curing in SMT assembly. Use PLACE-N-BOND for solder joint strain relief, shock/drop reliability improvement & encapsulation. Read more.
Alltemated Inc.
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EPA Verified Stencil Cleaning Systems
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, oven radiators, misprints and SMD adhesives.
Smart Sonic
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Designs and manufactures a range of cost-effective turnkey solutions for surface mount and through hole assembly systems for low to medium volume OEM and contract manufacturers.
Equipment includes manual and automatic stencil printers, manual and automatic pick & place systems with dispensers, wave solder and models of selective solder machines, lead-free solder-reflow ovens (including models with exclusive patented horizontal convection), component counters, and through-hole rework systems.
Our newest products include the 'NovaPlace' pick and place machine and the 'NovaSelect' selective solder machine.
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DDM Novastar Inc.
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