circuit insight
Sponsor
Schunk

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK
Sponsor
Master-Bond

Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond
Established in 1998 as an engineering, design and manufacturing company, Production Solutions, Inc. is located in Poway, California north of San Diego.

The focus of our development projects has been on improving the methods of assembly of printed circuit boards. In 2000, the first product introduced was the Red-E-Set board support system for semi-automatic screen printers. Well received by the market, PSI introduced the inline version in 2001 for Printers, Pick & Place, Chipshooters and Dispensers.

Production Solutions, Inc.

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