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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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In 1959, Fuji Corporation began as Fuji Machine Manufacturing (FMMC) producing electronic assembly equipment. Through the years, the company has remained committed to creating, developing, and manufacturing the surface mount (SMT) industry’s most innovative assembly solutions.
The Fuji Corporation name is synonymous with reliability and trustworthiness. Not only is Fuji Corporation a global leader as a machine tool builder, Fuji Corporation ensures productive manufacturing of countless additional companies in almost every industry around the world. Fuji Corporation, is simply, the standard.
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Fuji America Corporation
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