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Research & Technical Papers
Recent Technology Advances for X-ray Inspection
This paper reviews x-ray system types and what they provide ...
Last Will and Testament of the BGA Void
This paper investigates the impact of voids in BGA and ...
Modern 2D / 3D X-Ray Inspection
Paper reviews methods of finding defects in BGAs, QFNs, and ...
Challenges of Package on Package Devices
Processes associated with soldering stacked packages using dip flux and ...
Analysis of Voiding Under QFN Packages
Paper covers results of experiments on QFN devices when the ...
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Nordson DAGE's award winning X-ray systems have been specifically and ergonomically designed for Printed Circuit Board assembly (PCB) and semiconductor industries not only within failure analysis laboratories but also within the production environment.

Nordson DAGE's winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond testing technology including a hot bump pull test in full accordance with the recently published IPC-9708 test standards for the detection of pad cratering for surface mount and printed circuit board assemblies.
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Nordson DAGE

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