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Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond
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Circuit Technology Center continues to be recognized as the country's most innovative specialist in circuit board repair and rework, including BGA rework and BGA reballing. With the advancement of today's modern circuit board technology, it's more important than ever to have specialists available to help you at a moment's notice.
Circuit Technology Center has been dedicated to circuit board repair and rework for over 35 years and wrote the industry guide on circuit board rework and repair. All technicians are IPC certified with over 300 years of circuit board repair experience. Every project backed is by an unconditional guarantee.
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Circuit Technology Center Inc.
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