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Sponsor
Future-Ready Bonding Technology
ZTACH® ACE Anisotropic Conductive Epoxy Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more. Action Integrated Resources
Sponsor
Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly. BEST Inc.
5N Plus Micro Powders focuses on the production of ultrafine metal powders for the microelectronic market with D50â?Ts ranging from 20 µm down to 2 µm. We offer a wide selection of alloys with melting points starting as low as 61°C and up to 1100°C. Our powders are ideal for use in solder pastes for SMT, S/C packaging and ECA formulations. We have recently developed Type 9 and Type 10 powders for the Mini/MicroLED market using ACP and ACF technologies.
5N Plus Micro Powders
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